Pagina 4 - Prodotti 3M - Zoccoli per C.I., transistor

232-1271-00-1102JH

3M

OEM LCC SOCKETS 32 POS SOLID LID

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

pacchetto: -

Azione6.264

-

8468-21B1-RK-TR

3M

CONN SOCKET PLCC 68POS TIN

Type: PLCC
Number of Positions or Pins (Grid): 68 (4 x 17)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 160µin (4.06µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Surface Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 160µin (4.06µm)
Contact Material - Post: Copper Alloy
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature: -40°C ~ 105°C

pacchetto: -

Azione8.244

68 (4 x 17)

0.050" (1.27mm)

Tin

160µin (4.06µm)

Copper Alloy

Surface Mount

Closed Frame

Solder

0.050" (1.27mm)

Tin

160µin (4.06µm)

Copper Alloy

Polybutylene Terephthalate (PBT), Glass Filled

-40°C ~ 105°C

8484-21A1-RK-TP

3M

CONN SOCKET PLCC 84POS TIN

Type: PLCC
Number of Positions or Pins (Grid): 84 (4 x 21)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 160µin (4.06µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Surface Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 160µin (4.06µm)
Contact Material - Post: Copper Alloy
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature: -40°C ~ 105°C

pacchetto: -

Azione6.912

84 (4 x 21)

0.050" (1.27mm)

Tin

160µin (4.06µm)

Copper Alloy

Surface Mount

Closed Frame

Solder

0.050" (1.27mm)

Tin

160µin (4.06µm)

Copper Alloy

Polybutylene Terephthalate (PBT), Glass Filled

-40°C ~ 105°C

8452-21B1-RK-TR

3M

CONN SOCKET PLCC 52POS TIN

Type: PLCC
Number of Positions or Pins (Grid): 52 (4 x 13)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 160µin (4.06µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Surface Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 160µin (4.06µm)
Contact Material - Post: Copper Alloy
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature: -40°C ~ 105°C

pacchetto: -

Azione4.644

52 (4 x 13)

0.050" (1.27mm)

Tin

160µin (4.06µm)

Copper Alloy

Surface Mount

Closed Frame

Solder

0.050" (1.27mm)

Tin

160µin (4.06µm)

Copper Alloy

Polybutylene Terephthalate (PBT), Glass Filled

-40°C ~ 105°C

8420-21B1-RK-TR

3M

CONN SOCKET PLCC 20POS TIN

Type: PLCC
Number of Positions or Pins (Grid): 20 (4 x 5)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 160µin (4.06µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Surface Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 160µin (4.06µm)
Contact Material - Post: Copper Alloy
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature: -40°C ~ 105°C

pacchetto: -

Azione3.384

20 (4 x 5)

0.050" (1.27mm)

Tin

160µin (4.06µm)

Copper Alloy

Surface Mount

Closed Frame

Solder

0.050" (1.27mm)

Tin

160µin (4.06µm)

Copper Alloy

Polybutylene Terephthalate (PBT), Glass Filled

-40°C ~ 105°C

8428-21A1-RK-TP

3M

CONN SOCKET PLCC 28POS TIN

Type: PLCC
Number of Positions or Pins (Grid): 28 (4 x 7)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 160µin (4.06µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Surface Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 160µin (4.06µm)
Contact Material - Post: Copper Alloy
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature: -40°C ~ 105°C

pacchetto: -

Azione4.158

28 (4 x 7)

0.050" (1.27mm)

Tin

160µin (4.06µm)

Copper Alloy

Surface Mount

Closed Frame

Solder

0.050" (1.27mm)

Tin

160µin (4.06µm)

Copper Alloy

Polybutylene Terephthalate (PBT), Glass Filled

-40°C ~ 105°C

8420-21A1-RK-TP

3M

CONN SOCKET PLCC 20POS TIN

Type: PLCC
Number of Positions or Pins (Grid): 20 (4 x 5)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 160µin (4.06µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Surface Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 160µin (4.06µm)
Contact Material - Post: Copper Alloy
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature: -40°C ~ 105°C

pacchetto: -

Azione8.514

20 (4 x 5)

0.050" (1.27mm)

Tin

160µin (4.06µm)

Copper Alloy

Surface Mount

Closed Frame

Solder

0.050" (1.27mm)

Tin

160µin (4.06µm)

Copper Alloy

Polybutylene Terephthalate (PBT), Glass Filled

-40°C ~ 105°C

4842-6004-CP

3M

CONN IC DIP SOCKET 42POS TIN

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 135µin (3.43µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 135µin (3.43µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Polyester, Glass Filled
Operating Temperature: -25°C ~ 85°C

pacchetto: -

Azione4.122

42 (2 x 21)

0.100" (2.54mm)

Tin

135µin (3.43µm)

Phosphor Bronze

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

135µin (3.43µm)

Phosphor Bronze

Polyester, Glass Filled

-25°C ~ 85°C

4842-6000-CP

3M

CONN IC DIP SOCKET 42POS TIN

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 135µin (3.43µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 135µin (3.43µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Polyester, Glass Filled
Operating Temperature: -25°C ~ 85°C

pacchetto: -

Azione6.714

42 (2 x 21)

0.100" (2.54mm)

Tin

135µin (3.43µm)

Phosphor Bronze

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

135µin (3.43µm)

Phosphor Bronze

Polyester, Glass Filled

-25°C ~ 85°C

4832-6004-CP

3M

CONN IC DIP SOCKET 32POS TIN

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Polyester, Glass Filled
Operating Temperature: -25°C ~ 85°C

pacchetto: -

Azione3.690

32 (2 x 16)

0.100" (2.54mm)

Tin

35µin (0.90µm)

Phosphor Bronze

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

35µin (0.90µm)

Phosphor Bronze

Polyester, Glass Filled

-25°C ~ 85°C

4824-3004-CP

3M

CONN IC DIP SOCKET 24POS TIN

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Polyester, Glass Filled
Operating Temperature: -25°C ~ 85°C

pacchetto: -

Azione5.598

24 (2 x 12)

0.100" (2.54mm)

Tin

35µin (0.90µm)

Phosphor Bronze

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

35µin (0.90µm)

Phosphor Bronze

Polyester, Glass Filled

-25°C ~ 85°C

228-7474-55-1902

3M

CONN SOCKET SOIC 28POS GOLD

Type: SOIC
Number of Positions or Pins (Grid): 28 (2 x 14)
Pitch - Mating: -
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polyethersulfone (PES), Glass Filled
Operating Temperature: -55°C ~ 150°C

pacchetto: -

Azione5.742

28 (2 x 14)

-

Gold

-

Beryllium Copper

Through Hole

Closed Frame

Solder

-

Gold

30µin (0.76µm)

Beryllium Copper

Polyethersulfone (PES), Glass Filled

-55°C ~ 150°C

264-4493-00-0602J

3M

CONN IC DIP SOCKET ZIF 64POS GLD

Type: DIP, ZIF (ZIP), 0.9" (22.86mm) Row Spacing
Number of Positions or Pins (Grid): 64 (2 x 32)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Connector
Features: Closed Frame
Termination: Press-Fit
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polysulfone (PSU), Glass Filled
Operating Temperature: -55°C ~ 125°C

pacchetto: -

Azione3.474

64 (2 x 32)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Connector

Closed Frame

Press-Fit

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Polysulfone (PSU), Glass Filled

-55°C ~ 125°C

4808-3000-CP

3M

CONN IC DIP SOCKET 8POS TIN

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 35µin (0.90µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 35µin (0.90µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Polyester, Glass Filled
Operating Temperature: -25°C ~ 85°C

pacchetto: -

Azione2.538

8 (2 x 4)

0.100" (2.54mm)

Tin

35µin (0.90µm)

Phosphor Bronze

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

35µin (0.90µm)

Phosphor Bronze

Polyester, Glass Filled

-25°C ~ 85°C

260-4204-01

3M

CONN SOCKET QFN 60POS GOLD

Type: QFN
Number of Positions or Pins (Grid): 60 (4 x 15)
Pitch - Mating: 0.016" (0.40mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.016" (0.40mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: -
Contact Material - Post: Beryllium Copper
Housing Material: Polyethersulfone (PES)
Operating Temperature: -

pacchetto: -

Azione7.326

60 (4 x 15)

0.016" (0.40mm)

Gold

-

Beryllium Copper

Through Hole

Open Frame

Solder

0.016" (0.40mm)

Gold

-

Beryllium Copper

Polyethersulfone (PES)

-

240-5205-01

3M

CONN SOCKET QFN 40POS GOLD

Type: QFN
Number of Positions or Pins (Grid): 40 (4 x 10)
Pitch - Mating: -
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Gold
Contact Finish Thickness - Post: -
Contact Material - Post: Beryllium Copper
Housing Material: Polyethersulfone (PES)
Operating Temperature: -

pacchetto: -

Azione8.658

40 (4 x 10)

-

Gold

-

Beryllium Copper

Through Hole

Closed Frame

Solder

-

Gold

-

Beryllium Copper

Polyethersulfone (PES)

-

240-5205-00

3M

CONN SOCKET QFN 40POS GOLD

Type: QFN
Number of Positions or Pins (Grid): 40 (4 x 10)
Pitch - Mating: -
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Gold
Contact Finish Thickness - Post: -
Contact Material - Post: Beryllium Copper
Housing Material: Polyethersulfone (PES)
Operating Temperature: -

pacchetto: -

Azione6.750

40 (4 x 10)

-

Gold

-

Beryllium Copper

Through Hole

Closed Frame

Solder

-

Gold

-

Beryllium Copper

Polyethersulfone (PES)

-

290-1294-00-3302J

3M

CONN IC DIP SOCKET ZIF 90POS GLD

Type: DIP, ZIF (ZIP)
Number of Positions or Pins (Grid): 90 (2 x 45)
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polysulfone (PSU), Glass Filled
Operating Temperature: -55°C ~ 125°C

pacchetto: -

Azione4.788

90 (2 x 45)

0.070" (1.78mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.070" (1.78mm)

Gold

30µin (0.76µm)

Beryllium Copper

Polysulfone (PSU), Glass Filled

-55°C ~ 125°C

242-1289-00-0602J

3M

CONN IC DIP SOCKET ZIF 42POS GLD

Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Connector
Features: Closed Frame
Termination: Press-Fit
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polysulfone (PSU), Glass Filled
Operating Temperature: -55°C ~ 125°C

pacchetto: -

Azione6.084

42 (2 x 21)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Connector

Closed Frame

Press-Fit

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Polysulfone (PSU), Glass Filled

-55°C ~ 125°C

218-7223-55-1902

3M

CONN SOCKET SOIC 18POS GOLD

Type: SOIC
Number of Positions or Pins (Grid): 18 (2 x 9)
Pitch - Mating: -
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polyethersulfone (PES), Glass Filled
Operating Temperature: -55°C ~ 150°C

pacchetto: -

Azione6.138

18 (2 x 9)

-

Gold

-

Beryllium Copper

Through Hole

Closed Frame

Solder

-

Gold

30µin (0.76µm)

Beryllium Copper

Polyethersulfone (PES), Glass Filled

-55°C ~ 150°C

232-1291-00-0602J

3M

CONN IC DIP SOCKET ZIF 32POS GLD

Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Connector
Features: Closed Frame
Termination: Press-Fit
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polysulfone (PSU), Glass Filled
Operating Temperature: -55°C ~ 125°C

pacchetto: -

Azione5.796

32 (2 x 16)

0.070" (1.78mm)

Gold

30µin (0.76µm)

Beryllium Copper

Connector

Closed Frame

Press-Fit

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Polysulfone (PSU), Glass Filled

-55°C ~ 125°C

251-5949-01-0602

3M

CONN ZIG-ZAG ZIF 51POS GOLD

Type: Zig-Zag, ZIF (ZIP)
Number of Positions or Pins (Grid): 51 (1 x 25, 1 x 26)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polysulfone (PSU), Glass Filled
Operating Temperature: -55°C ~ 125°C

pacchetto: -

Azione7.776

51 (1 x 25, 1 x 26)

0.050" (1.27mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.050" (1.27mm)

Gold

30µin (0.76µm)

Beryllium Copper

Polysulfone (PSU), Glass Filled

-55°C ~ 125°C

251-5949-02-0602

3M

CONN ZIG-ZAG ZIF 51POS GOLD

Type: Zig-Zag, ZIF (ZIP)
Number of Positions or Pins (Grid): 51 (1 x 25, 1 x 26)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polysulfone (PSU), Glass Filled
Operating Temperature: -55°C ~ 125°C

pacchetto: -

Azione7.416

51 (1 x 25, 1 x 26)

0.050" (1.27mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.050" (1.27mm)

Gold

30µin (0.76µm)

Beryllium Copper

Polysulfone (PSU), Glass Filled

-55°C ~ 125°C

200-6319-9UN-1900

3M

CONN SOCKET PGA ZIF 361POS GOLD

Type: PGA, ZIF (ZIP)
Number of Positions or Pins (Grid): 361 (19 x 19)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: -
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polyethersulfone (PES)
Operating Temperature: -55°C ~ 150°C

pacchetto: -

Azione6.570

361 (19 x 19)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

-

Solder

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Polyethersulfone (PES)

-55°C ~ 150°C

236-6225-00-0602

3M

CONN SOCKET SIP ZIF 36POS GOLD

Type: SIP, ZIF (ZIP)
Number of Positions or Pins (Grid): 36 (1 x 36)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: -
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polysulfone (PSU), Glass Filled
Operating Temperature: -55°C ~ 125°C

pacchetto: -

Azione8.064

36 (1 x 36)

0.100" (2.54mm)

Gold

-

Beryllium Copper

Through Hole

-

Solder

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Polysulfone (PSU), Glass Filled

-55°C ~ 125°C

256-1292-00-0602J

3M

CONN IC DIP SOCKET ZIF 56POS GLD

Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 56 (2 x 28)
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Connector
Features: Closed Frame
Termination: Press-Fit
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polysulfone (PSU), Glass Filled
Operating Temperature: -55°C ~ 125°C

pacchetto: -

Azione5.778

56 (2 x 28)

0.070" (1.78mm)

Gold

30µin (0.76µm)

Beryllium Copper

Connector

Closed Frame

Press-Fit

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Polysulfone (PSU), Glass Filled

-55°C ~ 125°C

224-7397-55-1902

3M

CONN SOCKET SOIC 24POS GOLD

Type: SOIC
Number of Positions or Pins (Grid): 24 (2 x 12)
Pitch - Mating: -
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polyethersulfone (PES), Glass Filled
Operating Temperature: -55°C ~ 150°C

pacchetto: -

Azione5.886

24 (2 x 12)

-

Gold

-

Beryllium Copper

Through Hole

Closed Frame

Solder

-

Gold

30µin (0.76µm)

Beryllium Copper

Polyethersulfone (PES), Glass Filled

-55°C ~ 150°C

220-7201-55-1902

3M

CONN SOCKET SOIC 20POS GOLD

Type: SOIC
Number of Positions or Pins (Grid): 20 (2 x 10)
Pitch - Mating: -
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polyethersulfone (PES), Glass Filled
Operating Temperature: -55°C ~ 150°C

pacchetto: -

Azione6.108

20 (2 x 10)

-

Gold

-

Beryllium Copper

Through Hole

Closed Frame

Solder

-

Gold

30µin (0.76µm)

Beryllium Copper

Polyethersulfone (PES), Glass Filled

-55°C ~ 150°C

240-3639-00-0602J

3M

CONN IC DIP SOCKET ZIF 40POS GLD

Type: DIP, ZIF (ZIP), 1.0" (25.40mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Connector
Features: Closed Frame
Termination: Press-Fit
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polysulfone (PSU), Glass Filled
Operating Temperature: -55°C ~ 125°C

pacchetto: -

Azione3.906

40 (2 x 20)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Connector

Closed Frame

Press-Fit

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Polysulfone (PSU), Glass Filled

-55°C ~ 125°C

242-1293-00-0602J

3M

CONN IC DIP SOCKET ZIF 42POS GLD

Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Connector
Features: Closed Frame
Termination: Press-Fit
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polysulfone (PSU), Glass Filled
Operating Temperature: -55°C ~ 125°C

pacchetto: -

Azione4.626

42 (2 x 21)

0.070" (1.78mm)

Gold

30µin (0.76µm)

Beryllium Copper

Connector

Closed Frame

Press-Fit

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Polysulfone (PSU), Glass Filled

-55°C ~ 125°C