Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics |
CONN SOCKET PGA GOLD
|
pacchetto: - |
Azione7.038 |
|
- | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
||
Aries Electronics |
CONN IC DIP SOCKET 14POS GOLD
|
pacchetto: - |
Azione3.528 |
|
14 (2 x 7) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
||
Aries Electronics |
CONN SOCKET SIP 6POS GOLD
|
pacchetto: - |
Azione8.982 |
|
6 (1 x 6) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
||
Aries Electronics |
CONN IC DIP SOCKET 60POS GOLD
|
pacchetto: - |
Azione6.318 |
|
60 (2 x 30) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
||
Aries Electronics |
COLLET PIN CARRIER 20-PIN .300
|
pacchetto: - |
Azione3.472 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Aries Electronics |
CONN SOCKET PLCC ZIF 32POS GOLD
|
pacchetto: - |
Azione5.706 |
|
32 (2 x 7, 2 x 9) | 0.050" (1.27mm) | Gold | 12µin (0.30µm) | - | Through Hole | Open Frame | - | - | - | - | - | - | - |
||
Aries Electronics |
CONN SOCKET PLCC ZIF 52POS GOLD
|
pacchetto: - |
Azione7.632 |
|
52 (4 x 13) | 0.050" (1.27mm) | Gold | 12µin (0.30µm) | - | Through Hole | Open Frame | - | - | - | - | - | - | - |
||
Aries Electronics |
CONN IC DIP SOCKET 14POS GOLD
|
pacchetto: - |
Azione3.888 |
|
14 (2 x 7) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
||
Aries Electronics |
CONN SOCKET PLCC ZIF 84POS GOLD
|
pacchetto: - |
Azione7.848 |
|
84 (4 x 21) | 0.050" (1.27mm) | Gold | 12µin (0.30µm) | - | Through Hole | Open Frame | - | - | - | - | - | - | - |
||
Aries Electronics |
CONN SOCKET PLCC ZIF 68POS GOLD
|
pacchetto: - |
Azione7.740 |
|
68 (4 x 17) | 0.050" (1.27mm) | Gold | 12µin (0.30µm) | - | Through Hole | Open Frame | - | - | - | - | - | - | - |
||
Aries Electronics |
CONN SOCKET PLCC ZIF 44POS GOLD
|
pacchetto: - |
Azione3.618 |
|
44 (4 x 11) | 0.050" (1.27mm) | Gold | 12µin (0.30µm) | - | Through Hole | Open Frame | - | - | - | - | - | - | - |