Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC CLK BUFFER 1:1 1MHZ
|
pacchetto: - |
Azione7.920 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER MUX 2:2 24-TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) Exposed Pad |
Azione3.232 |
|
1 | 2:2 | Yes/Yes | CML, eHSTL, HSTL, LVDS, LVEPECL, LVPECL, LVTTL | LVDS | 450MHz | 2.3 V ~ 2.7 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) Exposed Pad | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 1:9 133.33MHZ 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione4.144 |
|
1 | 1:9 | No/No | LVTTL | LVTTL | 133.33MHz | 3 V ~ 3.6 V | 0°C ~ 70°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:4 266MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione5.472 |
|
1 | 2:4 | No/Yes | LVCMOS, LVTTL | LVPECL | 266MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:1 2.5GHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione5.424 |
|
1 | 1:1 | Yes/Yes | CML, LVDS, LVPECL | ECL, LVPECL | 2.5GHz | 2.375 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
ON Semiconductor |
IC CLK BUFFER 1:5 3GHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione4.976 |
|
2 | 1:5 | Yes/Yes | ECL, HSTL, LVDS, PECL | ECL, PECL | 3GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Texas Instruments |
IC CLK BUFFER 1:10 100MHZ 24SSOP
|
pacchetto: 24-SSOP (0.209", 5.30mm Width) |
Azione6.912 |
|
1 | 1:10 | No/No | LVTTL | LVTTL | 100MHz | 3 V ~ 3.6 V | 0°C ~ 70°C | Surface Mount | 24-SSOP (0.209", 5.30mm Width) | 24-SSOP |
||
Texas Instruments |
IC CLK BUFFER 1:10 100MHZ 24SSOP
|
pacchetto: 24-SSOP (0.209", 5.30mm Width) |
Azione3.952 |
|
1 | 1:10 | No/No | LVTTL | LVTTL | 100MHz | 3 V ~ 3.6 V | -40°C ~ 125°C | Surface Mount | 24-SSOP (0.209", 5.30mm Width) | 24-SSOP |
||
Microchip Technology |
IC CLK BUFFER 1:2 8GHZ 16MLF
|
pacchetto: 16-VFQFN Exposed Pad, 16-MLF? |
Azione5.664 |
|
1 | 1:2 | Yes/Yes | CML, LVDS, LVPECL | CML | 8GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Maxim Integrated |
IC CLK BUFFER 2:8 700MHZ 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione2.496 |
|
1 | 2:8 | Yes/Yes | HSTL, LVECL, LVPECL | LVECL, LVPECL | 700MHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:10 16MHZ 32TQFP
|
pacchetto: 32-LQFP |
Azione5.200 |
|
1 | 2:10 | Yes/Yes | LVDS, LVPECL | LVDS | 16MHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-TQFP (7x7) |
||
Microsemi Corporation |
6 OUTPUT PROGRAMMABLE FANOUT BUF
|
pacchetto: - |
Azione5.664 |
|
1 | 4:6 | Yes/Yes | CMOS, Crystal | CML, CMOS, HCSL, HSTL, LVDS, LVPECL, SSTL | 1.035GHz | 1.71 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | - | - |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:10 166MHZ 20QSOP
|
pacchetto: 20-SSOP (0.154", 3.90mm Width) |
Azione6.880 |
|
1 | 1:10 | No/No | LVTTL | LVTTL | 166MHz | 2.3 V ~ 2.7 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.154", 3.90mm Width) | 20-QSOP |
||
Microchip Technology |
IC CLK BUFFER 1:1 1MHZ 16SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.752 |
|
1 | 1:1 | No/Yes | CMOS, LVDS, PECL, Sine Wave, TTL | LVDS | 1MHz | 2.25 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
||
Cypress Semiconductor Corp |
IC CLK BUFFER 2:4 1.5GHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione3.600 |
|
1 | 2:4 | Yes/Yes | LVPECL | LVPECL | 1.5GHz | 2.375 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Silicon Labs |
IC CLK BUFFER 1:4 HCSL 24QFN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione5.024 |
|
1 | 1:4 | No/Yes | CMOS, HSTL, LVTTL, SSTL | HCSL | 250MHz | 1.71 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
Cypress Semiconductor Corp |
IC CLK BUFFER 1:2 1.5GHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione4.096 |
|
1 | 1:2 | Yes/Yes | CML, LVPECL | CML | 1.5GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 1:6 100MHZ 20VFQFPN
|
pacchetto: 20-VFQFN Exposed Pad |
Azione4.800 |
|
1 | 1:6 | No/No | Crystal | LVCMOS, LVTTL | 100MHz | 1.6 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 20-VFQFN Exposed Pad | 20-VFQFPN (4x4) |
||
Diodes Incorporated |
CLOCK BUFFER TQFP-48
|
pacchetto: - |
Azione5.840 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Silicon Labs |
IC CLK BUFFER 1:8 CMOS 24QFN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione5.856 |
|
1 | 1:8 | Yes/No | CML, HCSL, LVDS, LVPECL | CMOS | 200MHz | 1.71 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
Diodes Incorporated |
IC CLOCK BUFFER MUX 2:4 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione6.264 |
|
1 | 2:4 | No/Yes | LVCMOS, LVTTL, Crystal | LVPECL | 1.5GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 2:5 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione6.156 |
|
1 | 2:5 | Yes/Yes | ECL, PECL | ECL, PECL | - | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:10 100MHZ 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione7.344 |
|
1 | 1:10 | No/No | TTL | TTL | 100MHz | 4.75 V ~ 5.25 V | 0°C ~ 70°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
IDT, Integrated Device Technology Inc |
IC FANOUT BUFFER 32VFQFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione4.240 |
|
1 | 1:10 | Yes/Yes | HSTL, LVPECL | LVPECL | 2.7GHz | 2.5V, 3.3V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-VFQFPN (5x5) |
||
IDT, Integrated Device Technology Inc |
CLOCK SYNTHESIZE/GENERATOR/PLL
|
pacchetto: - |
Azione5.184 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
LOW SKEW, LOW ADDITIVE JITTER 3
|
pacchetto: 48-VFQFN Exposed Pad |
Azione5.088 |
|
1 | 3:10 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL, SSTL | HCSL, LVCMOS, LVDS, LVPECL | 1.6GHz | 1.35V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
Microchip Technology |
IC CLK BUFFER 1:6 750MHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione5.808 |
|
1 | 1:6 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVDS | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
TEN LVCMOS OUTPUT LOW ADDITIVE J
|
pacchetto: 32-VFQFN Exposed Pad |
Azione4.416 |
|
1 | 3:10 | Yes/No | CML, HCSL, LVCMOS, LVDS, LVPECL, SSTL | LVCMOS | 250MHz | 1.35V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
TEN LVCMOS OUTPUT LOW ADDITIVE J
|
pacchetto: 32-VFQFN Exposed Pad |
Azione8.460 |
|
1 | 3:10 | Yes/No | CML, HCSL, LVCMOS, LVDS, LVPECL, SSTL | LVCMOS | 250MHz | 1.35V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
LOW SKEW, LOW ADDITIVE JITTER 3
|
pacchetto: 32-VFQFN Exposed Pad |
Azione6.972 |
|
1 | 3:5 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL, SSTL | HCSL, LVCMOS, LVDS, LVPECL | 1.6GHz | 1.35V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |