Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Silicon Labs |
IC CLK BUFFER 1:4 140MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione4.816 |
|
1 | 1:4 | No/No | Clock | LVCMOS | 140MHz | 2.97 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:10 100MHZ 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione5.232 |
|
1 | 1:10 | No/No | TTL | TTL | 100MHz | 4.75 V ~ 5.25 V | 0°C ~ 70°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:6 450MHZ 32TQFP
|
pacchetto: 32-LQFP |
Azione4.576 |
|
1 | 2:6 | Yes/Yes | CML, eHSTL, HSTL, LVDS, LVPECL, LVTTL | LVDS | 450MHz | 2.3 V ~ 2.7 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-TQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 1:9 133.33MHZ 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione6.592 |
|
1 | 1:9 | No/No | LVTTL | LVTTL | 133.33MHz | 3 V ~ 3.6 V | 0°C ~ 70°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Diodes Incorporated |
IC CLK BUFFER 1:5 50MHZ 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione5.280 |
|
2 | 1:5 | No/No | CMOS, TTL | CMOS | 50MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC CLK BUF 4:20/2:10 64TQFP
|
pacchetto: 64-TQFP Exposed Pad |
Azione16.188 |
|
1 or 2 | 4:20, 2:10 | Yes/Yes | HSTL, LVPECL | HSTL | 500MHz | 3.3 V ~ 3.47 V | -40°C ~ 85°C | Surface Mount | 64-TQFP Exposed Pad | 64-EP-TQFP |
||
Microchip Technology |
IC CLK BUFFER 1:4 160MHZ 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione3.488 |
|
1 | 1:4 | Yes/Yes | PECL | TTL | 160MHz | 4.75 V ~ 5.25 V | 0°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Microchip Technology |
IC CLK BUFFER 1:4 160MHZ 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione33.036 |
|
1 | 1:4 | Yes/Yes | PECL | TTL | 160MHz | 3 V ~ 3.6 V | 0°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Microchip Technology |
IC CLK BUFFER 1:9 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione5.280 |
|
1 | 1:9 | Yes/Yes | PECL | PECL | - | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 2:6 7GHZ 32MLF
|
pacchetto: 32-VFQFN Exposed Pad, 32-MLF? |
Azione6.320 |
|
1 | 2:6 | Yes/Yes | CML, LVDS, PECL | LVPECL | 7GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, 32-MLF? | 32-MLF? (5x5) |
||
ON Semiconductor |
IC CLK BUFFER 1:5 1GHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione4.032 |
|
2 | 1:5 | Yes/Yes | LVDS, LVPECL | LVDS | 1GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFFER 1:16 500MHZ 48TQFP
|
pacchetto: 48-TQFP |
Azione5.136 |
|
1 | 1:16 | Yes/Yes | HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 500MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 48-TQFP | 48-TQFP (7x7) |
||
Microsemi Corporation |
6 OUTPUT PROGRAMMABLE FANOUT BUF
|
pacchetto: - |
Azione5.328 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
ON Semiconductor |
IC CLK BUFFER 1:10 400MHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione5.408 |
|
1 | 1:10 | Yes/Yes | CML, LVCMOS, LVDS, LVPECL, LVTTL | HCSL | 400MHz | 3 V ~ 3.6 V | -40°C ~ 70°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Texas Instruments |
IC CLK BUFFER 2:10 3.5GHZ 32LQFP
|
pacchetto: 32-LQFP |
Azione5.472 |
|
1 | 2:10 | Yes/Yes | HSTL, LVPECL | LVPECL | 3.5GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12MSOP
|
pacchetto: 12-TSSOP (0.118", 3.00mm Width) |
Azione4.736 |
|
1 | 1:2 | Yes/No | CML, CMOS, LVDS, LVPECL | CMOS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-TSSOP (0.118", 3.00mm Width) | 12-MSOP |
||
Diodes Incorporated |
IC CLOCK BUFFER MUX 3:11 48TQFN
|
pacchetto: 48-VFQFN Exposed Pad |
Azione2.384 |
|
1 | 3:11 | Yes/No | LVCMOS, LVTTL, Crystal | HCSL, LVCMOS, LVDS, LVPECL | 1.5GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-TQFN (7x7) |
||
Texas Instruments |
IC CLK BUFFER 1:10 100MHZ 28SSOP
|
pacchetto: 28-SSOP (0.209", 5.30mm Width) |
Azione396.996 |
|
1 | 1:10 | No/No | LVTTL | LVTTL, TTL | 100MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 28-SSOP (0.209", 5.30mm Width) | 28-SSOP |
||
Microchip Technology |
IC CLK BUFFER 1:2 3GHZ 16MLF
|
pacchetto: 16-VFQFN Exposed Pad, 16-MLF? |
Azione5.376 |
|
1 | 1:2 | Yes/Yes | CML, LVDS, LVPECL | LVDS | 3GHz | 2.375 V ~ 2.635 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 2:6 3.2GHZ 32VFQFPN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione7.968 |
|
1 | 2:6 | Yes/Yes | CML, LVDS, LVPECL, SSTL | ECL, LVPECL | 3.2GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-VFQFPN (5x5) |
||
ON Semiconductor |
IC CLK FANOUT/BUFFER 1:2 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione4.032 |
|
1 | 1:2 | No/No | LVCMOS | LVCMOS | 250MHz | 1.71 V ~ 3.6 V | -40°C ~ 105°C | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 1:9 133.33MHZ 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione6.480 |
|
1 | 1:9 | No/No | LVTTL | LVTTL | 133.33MHz | 3 V ~ 3.6 V | 0°C ~ 70°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Texas Instruments |
IC CLK BUFFER 2:2 75MHZ 8WSON
|
pacchetto: 8-VFDFN Exposed Pad |
Azione6.352 |
|
1 | 2:2 | No/No | Clock | Clock | 75MHz | 2.4 V ~ 5 V | -40°C ~ 85°C | Surface Mount | 8-VFDFN Exposed Pad | 8-WSON (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLOCK GENERATOR 6-DFN
|
pacchetto: 6-UFDFN |
Azione5.680 |
|
1 | 1:2 | No/No | Clock | Clock | 200MHz | 1.71 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 6-UFDFN | 6-DFN (1.4x1.4) |
||
Microchip Technology |
IC CLK BUFFER 1:4 5.5GHZ 16MLF
|
pacchetto: 16-VFQFN Exposed Pad, 16-MLF? |
Azione6.304 |
|
1 | 1:4 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 5.5GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Silicon Labs |
2:10 LVPECL BUFFER (200MHZ), 2:1
|
pacchetto: 32-VFQFN Exposed Pad |
Azione4.944 |
|
1 | 2:10 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 200MHz | 2.38 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Maxim Integrated |
IC CLK BUFFER 2:5 1.5GHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione6.976 |
|
1 | 2:5 | Yes/Yes | HSTL, LVECL, LVPECL | LVECL, LVPECL | 1.5GHz | 2.25 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 1:10 200MHZ 24TSSOP
|
pacchetto: 24-TSSOP (0.173", 4.40mm Width) |
Azione6.192 |
|
1 | 1:10 | No/No | LVTTL | LVTTL | 200MHz | 2.3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 24-TSSOP (0.173", 4.40mm Width) | 24-TSSOP |
||
Analog Devices Inc. |
IC CLK BUFFER 1:2 7.5GHZ 16LFCSP
|
pacchetto: 16-VFQFN Exposed Pad, CSP |
Azione64.044 |
|
1 | 1:2 | Yes/Yes | Clock | ECL, NECL, PECL | 7.5GHz | 2.375 V ~ 3.63 V | -40°C ~ 125°C | Surface Mount | 16-VFQFN Exposed Pad, CSP | 16-LFCSP-VQ (3x3) |
||
Diodes Incorporated |
IC CLOCK BUFFER V-QFN7070-48
|
pacchetto: 48-VFQFN Exposed Pad |
Azione26.946 |
|
1 | 2:16 | Yes/Yes | Differential or Single-Ended | LVPECL | 2GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | 48-TQFN (7x7) |