Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Delay Time tpd(1) Max | Voltage Supply - Internal | Number of Logic Elements/Blocks | Number of Macrocells | Number of Gates | Number of I/O | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Altera |
IC CPLD 32MC 7.5NS 49UBGA
|
pacchetto: 49-LFBGA |
Azione3.568 |
|
7.5ns | 2.375 V ~ 2.625 V | 2 | 32 | 600 | 36 | 0°C ~ 70°C (TA) | Surface Mount | 49-LFBGA | 49-UBGA (7x7) |
||
Lattice Semiconductor Corporation |
IC CPLD 64MC 7.5NS 44TQFP
|
pacchetto: 44-TQFP |
Azione4.400 |
|
7.5ns | 3 V ~ 3.6 V | - | 64 | - | 64 | 0°C ~ 70°C (TA) | Surface Mount | 44-TQFP | 44-TQFP (10x10) |
||
Lattice Semiconductor Corporation |
IC CPLD 512MC 10NS 256FBGA
|
pacchetto: 256-BGA |
Azione4.736 |
|
10.0ns | 3 V ~ 3.6 V | - | 512 | - | 192 | -40°C ~ 85°C (TA) | Surface Mount | 256-BGA | 256-FPBGA (17x17) |
||
Lattice Semiconductor Corporation |
IC CPLD 10MC 15NS 24DIP
|
pacchetto: 24-DIP (0.300", 7.62mm) |
Azione14.112 |
|
15.0ns | 4.75 V ~ 5.25 V | - | 10 | - | - | 0°C ~ 75°C (TA) | Through Hole | 24-DIP (0.300", 7.62mm) | 24-PDIP |
||
Lattice Semiconductor Corporation |
IC CPLD 384MC 5NS 176TQFP
|
pacchetto: 176-LQFP |
Azione3.232 |
|
5.0ns | 3 V ~ 3.6 V | 24 | 384 | - | 128 | 0°C ~ 90°C (TJ) | Surface Mount | 176-LQFP | 176-TQFP (24x24) |
||
Lattice Semiconductor Corporation |
IC CPLD 512MC 10NS 272BGA
|
pacchetto: 272-BBGA |
Azione4.720 |
|
10.0ns | 3 V ~ 3.6 V | 16 | 512 | 24000 | 192 | 0°C ~ 70°C (TA) | Surface Mount | 272-BBGA | 272-BGA (27x27) |
||
Lattice Semiconductor Corporation |
IC CPLD 32MC 5NS 48TQFP
|
pacchetto: 48-LQFP |
Azione5.424 |
|
5.0ns | 4.75 V ~ 5.25 V | 8 | 32 | 1000 | 32 | 0°C ~ 70°C (TA) | Surface Mount | 48-LQFP | 48-TQFP (7x7) |
||
Lattice Semiconductor Corporation |
IC CPLD 10MC 15NS 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione5.072 |
|
15.0ns | 4.5 V ~ 5.5 V | - | 10 | - | - | -40°C ~ 85°C (TA) | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Lattice Semiconductor Corporation |
IC CPLD 512MC 10NS 176TQFP
|
pacchetto: 176-LQFP |
Azione2.480 |
|
10.0ns | 1.65 V ~ 1.95 V | 32 | 512 | - | 128 | -40°C ~ 105°C (TJ) | Surface Mount | 176-LQFP | 176-TQFP (24x24) |
||
Microchip Technology |
IC CPLD 64MC 10NS 68PLCC
|
pacchetto: 68-LCC (J-Lead) |
Azione5.392 |
|
10.0ns | 4.75 V ~ 5.25 V | - | 64 | - | 48 | 0°C ~ 70°C (TA) | Surface Mount | 68-LCC (J-Lead) | 68-PLCC (24.23x24.23) |
||
Altera |
IC CPLD 980MC 6.2NS 144TQFP
|
pacchetto: 144-LQFP |
Azione5.616 |
|
6.2ns | 1.71 V ~ 1.89 V | 1270 | 980 | - | 116 | 0°C ~ 85°C (TJ) | Surface Mount | 144-LQFP | 144-TQFP (20x20) |
||
Xilinx Inc. |
IC CPLD 512MC 9.2NS 324BGA
|
pacchetto: 324-BBGA |
Azione5.840 |
|
9.2ns | 1.7 V ~ 1.9 V | 32 | 512 | 12000 | 270 | -40°C ~ 85°C (TA) | Surface Mount | 324-BBGA | 324-FBGA (23x23) |
||
Lattice Semiconductor Corporation |
IC CPLD 384MC 3.5NS 176TQFP
|
pacchetto: 176-LQFP |
Azione2.416 |
|
3.5ns | 3 V ~ 3.6 V | 24 | 384 | - | 128 | 0°C ~ 90°C (TJ) | Surface Mount | 176-LQFP | 176-TQFP (24x24) |
||
Xilinx Inc. |
IC CPLD 256MC 6.7NS 132CSBGA
|
pacchetto: 132-TFBGA, CSPBGA |
Azione56.664 |
|
6.7ns | 1.7 V ~ 1.9 V | 16 | 256 | 6000 | 106 | -40°C ~ 85°C (TA) | Surface Mount | 132-TFBGA, CSPBGA | 132-CSPBGA (8x8) |
||
Lattice Semiconductor Corporation |
IC CPLD 64MC 7.5NS 132CSBGA
|
pacchetto: 132-LFBGA, CSPBGA |
Azione2.960 |
|
7.5ns | 1.7 V ~ 1.9 V | 4 | 64 | - | 64 | 0°C ~ 90°C (TJ) | Surface Mount | 132-LFBGA, CSPBGA | 132-CSPBGA (8x8) |
||
Lattice Semiconductor Corporation |
IC CPLD 32MC 10NS 44TQFP
|
pacchetto: 44-TQFP |
Azione7.104 |
|
10.0ns | 3 V ~ 3.6 V | - | 32 | - | 32 | -40°C ~ 85°C (TA) | Surface Mount | 44-TQFP | 44-TQFP (10x10) |
||
Altera |
IC CPLD 1700MC 7NS 256FBGA
|
pacchetto: 256-BGA |
Azione114.636 |
|
7.0ns | 2.5V, 3.3V | 2210 | 1700 | - | 204 | -40°C ~ 100°C (TJ) | Surface Mount | 256-BGA | 256-FBGA (17x17) |
||
Intel |
IC CPLD 64MC 15NS 44PLCC
|
pacchetto: - |
Azione6.912 |
|
15.0ns | 4.75 V ~ 5.25 V | 4 | 64 | 1250 | 36 | 0°C ~ 70°C (TA) | - | - | - |
||
Intel |
IC CPLD 320MC 10NS 84PLCC
|
pacchetto: 84-LCC (J-Lead) |
Azione6.080 |
|
10.0ns | 4.75 V ~ 5.25 V | 20 | 320 | 6000 | 60 | 0°C ~ 70°C (TA) | Surface Mount | 84-LCC (J-Lead) | 84-PLCC (29.31x29.31) |
||
Intel |
IC CPLD 96MC 7.5NS 100QFP
|
pacchetto: 100-BQFP |
Azione6.208 |
|
7.5ns | 4.75 V ~ 5.25 V | 6 | 96 | 1800 | 76 | 0°C ~ 70°C (TA) | Surface Mount | 100-BQFP | 100-PQFP (20x14) |
||
Intel |
IC CPLD 192MC 10NS 160QFP
|
pacchetto: 160-BQFP |
Azione5.760 |
|
10.0ns | 4.5 V ~ 5.5 V | 12 | 192 | 3750 | 124 | -40°C ~ 85°C (TA) | Surface Mount | 160-BQFP | 160-PQFP (28x28) |
||
Intel |
IC CPLD 32MC 15NS 44QFP
|
pacchetto: 44-QFP |
Azione5.568 |
|
15.0ns | 4.75 V ~ 5.25 V | 2 | 32 | 600 | 36 | 0°C ~ 70°C (TA) | Surface Mount | 44-QFP | 44-PQFP (10x10) |
||
Intel |
IC CPLD 64MC 7.5NS 100TQFP
|
pacchetto: 100-TQFP |
Azione12.492 |
|
7.5ns | 3 V ~ 3.6 V | 4 | 64 | 1250 | 66 | 0°C ~ 70°C (TA) | Surface Mount | 100-TQFP | 100-TQFP (14x14) |
||
Intel |
IC CPLD 1700MC 7NS 256FBGA
|
pacchetto: 256-BGA |
Azione6.512 |
|
7.0ns | 1.71 V ~ 1.89 V | 2210 | 1700 | - | 204 | -40°C ~ 100°C (TJ) | Surface Mount | 256-BGA | 256-FBGA (17x17) |
||
Intel |
IC CPLD 980MC 6.2NS 144TQFP
|
pacchetto: 144-LQFP |
Azione5.744 |
|
6.2ns | 1.71 V ~ 1.89 V | 1270 | 980 | - | 116 | -40°C ~ 100°C (TJ) | Surface Mount | 144-LQFP | 144-TQFP (20x20) |
||
Intel |
IC CPLD 64MC 7.5NS 44PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione7.552 |
|
7.5ns | 3 V ~ 3.6 V | 4 | 64 | 1250 | 36 | -40°C ~ 85°C (TA) | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Intel |
IC CPLD 192MC 4.7NS 100TQFP
|
pacchetto: 100-TQFP |
Azione6.352 |
|
4.7ns | 2.5V, 3.3V | 240 | 192 | - | 80 | -40°C ~ 125°C (TJ) | Surface Mount | 100-TQFP | 100-TQFP (14x14) |
||
Intel |
IC CPLD 980MC 6.2NS 144TQFP
|
pacchetto: 144-LQFP |
Azione6.540 |
|
6.2ns | 2.5V, 3.3V | 1270 | 980 | - | 116 | 0°C ~ 85°C (TJ) | Surface Mount | 144-LQFP | 144-TQFP (20x20) |
||
Intel |
IC CPLD 192MC 4.7NS 100TQFP
|
pacchetto: 100-TQFP |
Azione5.344 |
|
4.7ns | 2.5V, 3.3V | 240 | 192 | - | 80 | 0°C ~ 85°C (TJ) | Surface Mount | 100-TQFP | 100-TQFP (14x14) |
||
Dialog Semiconductor GmbH |
GPAK MIXED SIGNAL MATRIX
|
pacchetto: - |
Azione7.632 |
|
- | - | - | - | - | - | - | - | - | - |