Pagina 597 - Embedded - FPGA (Field Programmable Gate Array) | Circuiti integrati (CI) | Heisener Electronics
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Embedded - FPGA (Field Programmable Gate Array)

Record 29.278
Pagina  597/976
Immagine
Numero di parte
Produttore
Descrizione
pacchetto
Azione
Quantità
Number of Logic Elements/Cells
Total RAM Bits
Number of I/O
Number of Gates
Voltage - Supply
Mounting Type
Operating Temperature
Package / Case
Supplier Device Package
EP2AGX125EF35I5ES
Altera

IC FPGA 452 I/O 1152FBGA

  • Number of LABs/CLBs: 4964
  • Number of Logic Elements/Cells: 118143
  • Total RAM Bits: 8315904
  • Number of I/O: 452
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
pacchetto: 1152-BBGA, FCBGA
Azione4.400
118143
8315904
452
-
0.87 V ~ 0.93 V
Surface Mount
-40°C ~ 100°C (TJ)
1152-BBGA, FCBGA
1152-FBGA (35x35)
ICE5LP4K-UWG20ITR1K
Lattice Semiconductor Corporation

IC FPGA 12 I/O 20WLCSP

  • Number of LABs/CLBs: 440
  • Number of Logic Elements/Cells: 3520
  • Total RAM Bits: 81920
  • Number of I/O: 12
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 20-UFBGA, WLCSP
  • Supplier Device Package: 20-WLCSP (1.71x2.06)
pacchetto: 20-UFBGA, WLCSP
Azione6.144
3520
81920
12
-
1.14 V ~ 1.26 V
Surface Mount
-40°C ~ 100°C (TJ)
20-UFBGA, WLCSP
20-WLCSP (1.71x2.06)
A54SX32A-FG484M
Microsemi Corporation

IC FPGA 249 I/O 484FBGA

  • Number of LABs/CLBs: 2880
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: -
  • Number of I/O: 249
  • Number of Gates: 48000
  • Voltage - Supply: 2.25 V ~ 5.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -55°C ~ 125°C (TC)
  • Package / Case: 484-BGA
  • Supplier Device Package: 484-FPBGA (27X27)
pacchetto: 484-BGA
Azione3.968
-
-
249
48000
2.25 V ~ 5.25 V
Surface Mount
-55°C ~ 125°C (TC)
484-BGA
484-FPBGA (27X27)
AGL600V2-FGG144T
Microsemi Corporation

IC FPGA 97 I/O 144FBGA

  • Number of LABs/CLBs: -
  • Number of Logic Elements/Cells: 13824
  • Total RAM Bits: 110592
  • Number of I/O: 97
  • Number of Gates: 600000
  • Voltage - Supply: 1.14 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Package / Case: 144-LBGA
  • Supplier Device Package: 144-FPBGA (13x13)
pacchetto: 144-LBGA
Azione4.048
13824
110592
97
600000
1.14 V ~ 1.575 V
Surface Mount
0°C ~ 70°C (TA)
144-LBGA
144-FPBGA (13x13)
LFE2M50SE-6F484C
Lattice Semiconductor Corporation

IC FPGA 270 I/O 484FBGA

  • Number of LABs/CLBs: 6000
  • Number of Logic Elements/Cells: 48000
  • Total RAM Bits: 4246528
  • Number of I/O: 270
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FPBGA (23x23)
pacchetto: 484-BBGA
Azione2.160
48000
4246528
270
-
1.14 V ~ 1.26 V
Surface Mount
0°C ~ 85°C (TJ)
484-BBGA
484-FPBGA (23x23)
LFSC3GA80E-7FFN1704C
Lattice Semiconductor Corporation

IC FPGA 904 I/O 1704FCBGA

  • Number of LABs/CLBs: 20000
  • Number of Logic Elements/Cells: 80000
  • Total RAM Bits: 5816320
  • Number of I/O: 904
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1704-BBGA, FCBGA
  • Supplier Device Package: 1704-FCBGA (42.5x42.5)
pacchetto: 1704-BBGA, FCBGA
Azione2.336
80000
5816320
904
-
0.95 V ~ 1.26 V
Surface Mount
0°C ~ 85°C (TJ)
1704-BBGA, FCBGA
1704-FCBGA (42.5x42.5)
hot XCV1600E-6FG900I
Xilinx Inc.

IC FPGA 700 I/O 900FBGA

  • Number of LABs/CLBs: 7776
  • Number of Logic Elements/Cells: 34992
  • Total RAM Bits: 589824
  • Number of I/O: 700
  • Number of Gates: 2188742
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA
  • Supplier Device Package: 900-FBGA (31x31)
pacchetto: 900-BBGA
Azione8.028
34992
589824
700
2188742
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 100°C (TJ)
900-BBGA
900-FBGA (31x31)
hot XC4005E-1PQ100C
Xilinx Inc.

IC FPGA 77 I/O 100QFP

  • Number of LABs/CLBs: 196
  • Number of Logic Elements/Cells: 466
  • Total RAM Bits: 6272
  • Number of I/O: 77
  • Number of Gates: 5000
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 100-BQFP
  • Supplier Device Package: 100-PQFP (14x20)
pacchetto: 100-BQFP
Azione6.992
466
6272
77
5000
4.75 V ~ 5.25 V
Surface Mount
0°C ~ 85°C (TJ)
100-BQFP
100-PQFP (14x20)
5SGXEA9N3F45C2L
Altera

IC FPGA 840 I/O 1932FBGA

  • Number of LABs/CLBs: 317000
  • Number of Logic Elements/Cells: 840000
  • Total RAM Bits: 64210944
  • Number of I/O: 840
  • Number of Gates: -
  • Voltage - Supply: 0.82 V ~ 0.88 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1932-BBGA, FCBGA
  • Supplier Device Package: 1932-FBGA (45x45)
pacchetto: 1932-BBGA, FCBGA
Azione2.928
840000
64210944
840
-
0.82 V ~ 0.88 V
Surface Mount
0°C ~ 85°C (TJ)
1932-BBGA, FCBGA
1932-FBGA (45x45)
5SGXEA3H1F35C2LN
Altera

IC FPGA 432 I/O 1152FBGA

  • Number of LABs/CLBs: 128300
  • Number of Logic Elements/Cells: 340000
  • Total RAM Bits: 23704576
  • Number of I/O: 432
  • Number of Gates: -
  • Voltage - Supply: 0.82 V ~ 0.88 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
pacchetto: 1152-BBGA, FCBGA
Azione2.496
340000
23704576
432
-
0.82 V ~ 0.88 V
Surface Mount
0°C ~ 85°C (TJ)
1152-BBGA, FCBGA
1152-FBGA (35x35)
5SGXMA7N2F40C1N
Altera

IC FPGA 600 I/O 1517FBGA

  • Number of LABs/CLBs: 234720
  • Number of Logic Elements/Cells: 622000
  • Total RAM Bits: 59939840
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
pacchetto: 1517-BBGA, FCBGA
Azione7.680
622000
59939840
600
-
0.87 V ~ 0.93 V
Surface Mount
0°C ~ 85°C (TJ)
1517-BBGA, FCBGA
1517-FBGA (40x40)
hot EP4CE75F23I7N
Altera

IC FPGA 292 I/O 484FBGA

  • Number of LABs/CLBs: 4713
  • Number of Logic Elements/Cells: 75408
  • Total RAM Bits: 2810880
  • Number of I/O: 292
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-BGA
  • Supplier Device Package: 484-FBGA (23x23)
pacchetto: 484-BGA
Azione17.724
75408
2810880
292
-
1.15 V ~ 1.25 V
Surface Mount
-40°C ~ 100°C (TJ)
484-BGA
484-FBGA (23x23)
10M16DCF484I7G
Altera

IC FPGA 320 I/O 484FBGA

  • Number of LABs/CLBs: 1000
  • Number of Logic Elements/Cells: 16000
  • Total RAM Bits: 562176
  • Number of I/O: 320
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-BGA
  • Supplier Device Package: 484-FBGA (23x23)
pacchetto: 484-BGA
Azione4.416
16000
562176
320
-
1.15 V ~ 1.25 V
Surface Mount
-40°C ~ 100°C (TJ)
484-BGA
484-FBGA (23x23)
XCKU13P-2FFVE900E
Xilinx Inc.

XCKU13P-2FFVE900E

  • Number of LABs/CLBs: 42660
  • Number of Logic Elements/Cells: 746550
  • Total RAM Bits: 59084800
  • Number of I/O: 304
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: -
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
pacchetto: -
Azione5.232
746550
59084800
304
-
0.87 V ~ 0.93 V
-
0°C ~ 100°C (TJ)
-
-
XC5VSX50T-3FF665C
Xilinx Inc.

IC FPGA 360 I/O 665FCBGA

  • Number of LABs/CLBs: 4080
  • Number of Logic Elements/Cells: 52224
  • Total RAM Bits: 4866048
  • Number of I/O: 360
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 665-BBGA, FCBGA
  • Supplier Device Package: 665-FCBGA (27x27)
pacchetto: 665-BBGA, FCBGA
Azione4.672
52224
4866048
360
-
0.95 V ~ 1.05 V
Surface Mount
0°C ~ 85°C (TJ)
665-BBGA, FCBGA
665-FCBGA (27x27)
APA750-FG896I
Microsemi Corporation

IC FPGA 562 I/O 896FBGA

  • Number of LABs/CLBs: -
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: 147456
  • Number of I/O: 562
  • Number of Gates: 750000
  • Voltage - Supply: 2.3 V ~ 2.7 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Package / Case: 896-BGA
  • Supplier Device Package: 896-FBGA (31x31)
pacchetto: 896-BGA
Azione7.200
-
147456
562
750000
2.3 V ~ 2.7 V
Surface Mount
-40°C ~ 85°C (TA)
896-BGA
896-FBGA (31x31)
APA750-BGG456
Microsemi Corporation

IC FPGA 356 I/O 456BGA

  • Number of LABs/CLBs: -
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: 147456
  • Number of I/O: 356
  • Number of Gates: 750000
  • Voltage - Supply: 2.3 V ~ 2.7 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Package / Case: 456-BBGA
  • Supplier Device Package: 456-PBGA (35x35)
pacchetto: 456-BBGA
Azione5.824
-
147456
356
750000
2.3 V ~ 2.7 V
Surface Mount
0°C ~ 70°C (TA)
456-BBGA
456-PBGA (35x35)
M2GL010S-TQG144I
Microsemi Corporation

IC FPGA 84 I/O 144TQFP

  • Number of LABs/CLBs: -
  • Number of Logic Elements/Cells: 12084
  • Total RAM Bits: 933888
  • Number of I/O: 84
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 2.625 V
  • Mounting Type: -
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
pacchetto: -
Azione2.480
12084
933888
84
-
1.14 V ~ 2.625 V
-
-40°C ~ 100°C (TJ)
-
-
10M04SFE144I7G
Intel

IC FPGA/CPLD NV 144EQFP

  • Number of LABs/CLBs: 250
  • Number of Logic Elements/Cells: 4000
  • Total RAM Bits: 193536
  • Number of I/O: 101
  • Number of Gates: -
  • Voltage - Supply: 2.85 V ~ 3.465 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 144-LQFP Exposed Pad
  • Supplier Device Package: 144-EQFP (20x20)
pacchetto: 144-LQFP Exposed Pad
Azione3.536
4000
193536
101
-
2.85 V ~ 3.465 V
Surface Mount
-40°C ~ 100°C (TJ)
144-LQFP Exposed Pad
144-EQFP (20x20)
EP20K160EBC356-2
Intel

IC FPGA 271 I/O 356BGA

  • Number of LABs/CLBs: 640
  • Number of Logic Elements/Cells: 6400
  • Total RAM Bits: 81920
  • Number of I/O: 271
  • Number of Gates: 404000
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 356-LBGA
  • Supplier Device Package: 356-BGA (35x35)
pacchetto: 356-LBGA
Azione6.016
6400
81920
271
404000
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
356-LBGA
356-BGA (35x35)
EP4SGX230DF29C3ES
Intel

IC FPGA 372 I/O 780FBGA

  • Number of LABs/CLBs: 9120
  • Number of Logic Elements/Cells: 228000
  • Total RAM Bits: 17544192
  • Number of I/O: 372
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 780-BBGA, FCBGA
  • Supplier Device Package: 780-FBGA (29x29)
pacchetto: 780-BBGA, FCBGA
Azione3.920
228000
17544192
372
-
0.87 V ~ 0.93 V
Surface Mount
0°C ~ 85°C (TJ)
780-BBGA, FCBGA
780-FBGA (29x29)
5SGXEA5K2F40C3N
Intel

IC FPGA 696 I/O 1517FBGA

  • Number of LABs/CLBs: 185000
  • Number of Logic Elements/Cells: 490000
  • Total RAM Bits: 53105664
  • Number of I/O: 696
  • Number of Gates: -
  • Voltage - Supply: 0.82 V ~ 0.88 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
pacchetto: 1517-BBGA, FCBGA
Azione7.168
490000
53105664
696
-
0.82 V ~ 0.88 V
Surface Mount
0°C ~ 85°C (TJ)
1517-BBGA, FCBGA
1517-FBGA (40x40)
EP4SGX180DF29C4
Intel

IC FPGA 372 I/O 780FBGA

  • Number of LABs/CLBs: 7030
  • Number of Logic Elements/Cells: 175750
  • Total RAM Bits: 13954048
  • Number of I/O: 372
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 780-BBGA, FCBGA
  • Supplier Device Package: 780-FBGA (29x29)
pacchetto: 780-BBGA, FCBGA
Azione2.176
175750
13954048
372
-
0.87 V ~ 0.93 V
Surface Mount
0°C ~ 85°C (TJ)
780-BBGA, FCBGA
780-FBGA (29x29)
EP3CLS100F780C7
Intel

IC FPGA 413 I/O 780FBGA

  • Number of LABs/CLBs: 6278
  • Number of Logic Elements/Cells: 100448
  • Total RAM Bits: 4451328
  • Number of I/O: 413
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 780-BGA
  • Supplier Device Package: 780-FBGA (29x29)
pacchetto: 780-BGA
Azione3.632
100448
4451328
413
-
1.15 V ~ 1.25 V
Surface Mount
0°C ~ 85°C (TJ)
780-BGA
780-FBGA (29x29)
5AGXBA3D4F31I5N
Intel

IC FPGA 416 I/O 896FBGA

  • Number of LABs/CLBs: 7362
  • Number of Logic Elements/Cells: 156000
  • Total RAM Bits: 11746304
  • Number of I/O: 416
  • Number of Gates: -
  • Voltage - Supply: 1.07 V ~ 1.13 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 896-BBGA, FCBGA
  • Supplier Device Package: 896-FBGA (31x31)
pacchetto: 896-BBGA, FCBGA
Azione5.680
156000
11746304
416
-
1.07 V ~ 1.13 V
Surface Mount
-40°C ~ 100°C (TJ)
896-BBGA, FCBGA
896-FBGA (31x31)
EP3C25F324I7
Intel

IC FPGA 215 I/O 324FBGA

  • Number of LABs/CLBs: 1539
  • Number of Logic Elements/Cells: 24624
  • Total RAM Bits: 608256
  • Number of I/O: 215
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 324-BGA
  • Supplier Device Package: 324-FBGA (19x19)
pacchetto: 324-BGA
Azione6.512
24624
608256
215
-
1.15 V ~ 1.25 V
Surface Mount
-40°C ~ 100°C (TJ)
324-BGA
324-FBGA (19x19)
hot 5CEFA7F23I7N
Intel

IC FPGA 240 I/O 484FBGA

  • Number of LABs/CLBs: 56480
  • Number of Logic Elements/Cells: 149500
  • Total RAM Bits: 7880704
  • Number of I/O: 240
  • Number of Gates: -
  • Voltage - Supply: 1.07 V ~ 1.13 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-BGA
  • Supplier Device Package: 484-FBGA (23x23)
pacchetto: 484-BGA
Azione6.048
149500
7880704
240
-
1.07 V ~ 1.13 V
Surface Mount
-40°C ~ 100°C (TJ)
484-BGA
484-FBGA (23x23)
5CEFA7F31C8N
Intel

IC FPGA 480 I/O 896FBGA

  • Number of LABs/CLBs: 56480
  • Number of Logic Elements/Cells: 149500
  • Total RAM Bits: 7880704
  • Number of I/O: 480
  • Number of Gates: -
  • Voltage - Supply: 1.07 V ~ 1.13 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 896-BGA
  • Supplier Device Package: 896-FBGA (31x31)
pacchetto: 896-BGA
Azione5.264
149500
7880704
480
-
1.07 V ~ 1.13 V
Surface Mount
0°C ~ 85°C (TJ)
896-BGA
896-FBGA (31x31)
EP4CE15F23C6
Intel

IC FPGA 343 I/O 484FBGA

  • Number of LABs/CLBs: 963
  • Number of Logic Elements/Cells: 15408
  • Total RAM Bits: 516096
  • Number of I/O: 343
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BGA
  • Supplier Device Package: 484-FBGA (23x23)
pacchetto: 484-BGA
Azione7.344
15408
516096
343
-
1.15 V ~ 1.25 V
Surface Mount
0°C ~ 85°C (TJ)
484-BGA
484-FBGA (23x23)
XCDAISY-CN1140
Xilinx Inc.

XCDAISY-CN1140

  • Number of LABs/CLBs: -
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: -
  • Number of I/O: -
  • Number of Gates: -
  • Voltage - Supply: -
  • Mounting Type: -
  • Operating Temperature: -
  • Package / Case: -
  • Supplier Device Package: -
pacchetto: -
Azione6.496
-
-
-
-
-
-
-
-
-