Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Logic Elements/Cells | Total RAM Bits | Number of I/O | Number of Gates | Voltage - Supply | Mounting Type | Operating Temperature | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Altera |
IC FPGA
|
pacchetto: - |
Azione5.040 |
|
67200 | 1146880 | - | 5250000 | 1.425 V ~ 1.575 V | Surface Mount | 0°C ~ 85°C (TJ) | - | - |
||
Altera |
IC FPGA
|
pacchetto: - |
Azione5.136 |
|
24320 | 311296 | - | 1537000 | 1.71 V ~ 1.89 V | Surface Mount | 0°C ~ 85°C (TJ) | - | - |
||
Altera |
IC FPGA 271 I/O 356BGA
|
pacchetto: 356-LBGA |
Azione3.840 |
|
8320 | 106496 | 271 | 526000 | 1.71 V ~ 1.89 V | Surface Mount | 0°C ~ 85°C (TJ) | 356-LBGA | 356-BGA (35x35) |
||
Microsemi Corporation |
IC FPGA 77 I/O 100VQFP
|
pacchetto: 100-TQFP |
Azione6.400 |
|
768 | - | 77 | 30000 | 1.425 V ~ 1.575 V | Surface Mount | -40°C ~ 100°C (TJ) | 100-TQFP | 100-VQFP (14x14) |
||
Lattice Semiconductor Corporation |
IC FPGA 188 I/O 256FBGA
|
pacchetto: 256-BGA |
Azione6.352 |
|
15000 | 331776 | 188 | - | 1.14 V ~ 1.26 V | Surface Mount | 0°C ~ 85°C (TJ) | 256-BGA | 256-FPBGA (17x17) |
||
Xilinx Inc. |
IC FPGA 182 I/O 256FTBGA
|
pacchetto: 256-LBGA |
Azione8.388 |
|
1728 | 32768 | 182 | 50000 | 1.71 V ~ 1.89 V | Surface Mount | -40°C ~ 100°C (TJ) | 256-LBGA | 256-FTBGA (17x17) |
||
Xilinx Inc. |
IC FPGA 77 I/O 100QFP
|
pacchetto: 100-BQFP |
Azione7.888 |
|
466 | 6272 | 77 | 5000 | 3 V ~ 3.6 V | Surface Mount | 0°C ~ 85°C (TJ) | 100-BQFP | 100-PQFP (14x20) |
||
Altera |
IC FPGA 552 I/O 1152FBGA
|
pacchetto: 1152-BBGA, FCBGA |
Azione5.344 |
|
420000 | 43983872 | 552 | - | 0.82 V ~ 0.88 V | Surface Mount | 0°C ~ 85°C (TJ) | 1152-BBGA, FCBGA | 1152-FBGA (35x35) |
||
Altera |
IC FPGA 224 I/O 484UBGA
|
pacchetto: 484-FBGA |
Azione4.800 |
|
77000 | 5001216 | 224 | - | 1.07 V ~ 1.13 V | Surface Mount | 0°C ~ 85°C (TJ) | 484-FBGA | 484-UBGA (19x19) |
||
Xilinx Inc. |
IC FPGA 440 I/O 676FCBGA
|
pacchetto: 676-BBGA, FCBGA |
Azione2.272 |
|
82944 | 3538944 | 440 | - | 0.95 V ~ 1.05 V | Surface Mount | 0°C ~ 85°C (TJ) | 676-BBGA, FCBGA | 676-FCBGA (27x27) |
||
Microsemi Corporation |
IC FPGA 176 I/O 208QFP
|
pacchetto: 208-BFQFP |
Azione4.096 |
|
- | 2560 | 176 | 54000 | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | Surface Mount | -55°C ~ 125°C (TC) | 208-BFQFP | 208-PQFP (28x28) |
||
Microsemi Corporation |
IC FPGA 244 I/O
|
pacchetto: - |
Azione3.040 |
|
300000 | 21094400 | 244 | - | 0.97 V ~ 1.08 V | - | -40°C ~ 100°C (TJ) | - | - |
||
Xilinx Inc. |
IC FPGA 304 I/O 400FBGA
|
pacchetto: 400-BGA |
Azione5.776 |
|
33192 | 663552 | 304 | 1600000 | 1.14 V ~ 1.26 V | Surface Mount | -40°C ~ 100°C (TJ) | 400-BGA | 400-FBGA (21x21) |
||
Microsemi Corporation |
IC FPGA 233 I/O 484FBGA
|
pacchetto: 484-BGA |
Azione4.208 |
|
12084 | 933888 | 233 | - | 1.14 V ~ 2.625 V | Surface Mount | -40°C ~ 100°C (TJ) | 484-BGA | 484-FPBGA (23x23) |
||
Microsemi Corporation |
IC FPGA 177 I/O 256FBGA
|
pacchetto: 256-LBGA |
Azione2.352 |
|
- | 110592 | 177 | 600000 | 1.425 V ~ 1.575 V | Surface Mount | 0°C ~ 85°C (TJ) | 256-LBGA | 256-FPBGA (17x17) |
||
Microsemi Corporation |
IC FPGA 96 I/O 144FBGA
|
pacchetto: 144-LBGA |
Azione4.848 |
|
- | 18432 | 96 | 60000 | 1.425 V ~ 1.575 V | Surface Mount | -40°C ~ 100°C (TJ) | 144-LBGA | 144-FPBGA (13x13) |
||
Microsemi Corporation |
IC FPGA 119 I/O 256FBGA
|
pacchetto: 256-LBGA |
Azione6.512 |
|
- | 110592 | 119 | 600000 | 1.425 V ~ 1.575 V | Surface Mount | 0°C ~ 85°C (TJ) | 256-LBGA | 256-FPBGA (17x17) |
||
Intel |
IC FPGA
|
pacchetto: - |
Azione7.856 |
|
- | - | - | - | - | - | - | - | - |
||
Intel |
IC FPGA
|
pacchetto: - |
Azione2.304 |
|
38400 | 327680 | - | 1772000 | 1.71 V ~ 1.89 V | Surface Mount | 0°C ~ 85°C (TJ) | - | - |
||
Intel |
IC FPGA 413 I/O 672FBGA
|
pacchetto: 672-BBGA |
Azione3.600 |
|
6656 | 65536 | 413 | 342000 | 2.375 V ~ 2.625 V | Surface Mount | 0°C ~ 70°C (TA) | 672-BBGA | 672-FBGA (27x27) |
||
Intel |
IC FPGA 147 I/O 208QFP
|
pacchetto: 208-BFQFP |
Azione2.560 |
|
4992 | 49152 | 147 | 257000 | 2.375 V ~ 2.625 V | Surface Mount | 0°C ~ 70°C (TA) | 208-BFQFP | 208-PQFP (28x28) |
||
Intel |
IC FPGA 920 I/O 1932FBGA
|
pacchetto: 1932-BBGA, FCBGA |
Azione2.064 |
|
531200 | 28033024 | 920 | - | 0.87 V ~ 0.93 V | Surface Mount | 0°C ~ 85°C (TJ) | 1932-BBGA, FCBGA | 1932-FBGA, FC (45x45) |
||
Intel |
IC FPGA 552 I/O 1152FBGA
|
pacchetto: 1152-BBGA, FCBGA |
Azione5.856 |
|
622000 | 59939840 | 552 | - | 0.82 V ~ 0.88 V | Surface Mount | -40°C ~ 100°C (TJ) | 1152-BBGA, FCBGA | 1152-FBGA (35x35) |
||
Intel |
IC FPGA 552 I/O 1152FBGA
|
pacchetto: 1152-BBGA, FCBGA |
Azione2.832 |
|
622000 | 59939840 | 552 | - | 0.82 V ~ 0.88 V | Surface Mount | -40°C ~ 100°C (TJ) | 1152-BBGA, FCBGA | 1152-FBGA (35x35) |
||
Intel |
IC FPGA 488 I/O 1152FBGA
|
pacchetto: 1152-BBGA, FCBGA |
Azione4.128 |
|
72600 | 7564880 | 488 | - | 0.87 V ~ 0.93 V | Surface Mount | -40°C ~ 100°C (TJ) | 1152-BBGA, FCBGA | 1152-FBGA (35x35) |
||
Intel |
IC FPGA 260 I/O 572FBGA
|
pacchetto: 572-BGA, FCBGA |
Azione5.936 |
|
118143 | 8315904 | 260 | - | 0.87 V ~ 0.93 V | Surface Mount | 0°C ~ 85°C (TJ) | 572-BGA, FCBGA | 572-FBGA, FC (25x25) |
||
Intel |
IC FPGA 224 I/O 484UBGA
|
pacchetto: 484-FBGA |
Azione3.984 |
|
49000 | 3464192 | 224 | - | 1.07 V ~ 1.13 V | Surface Mount | 0°C ~ 85°C (TJ) | 484-FBGA | 484-UBGA (19x19) |
||
Intel |
IC FPGA 104 I/O 144TQFP
|
pacchetto: 144-LQFP |
Azione32.880 |
|
2910 | 59904 | 104 | - | 1.425 V ~ 1.575 V | Surface Mount | 0°C ~ 85°C (TJ) | 144-LQFP | 144-TQFP (20x20) |
||
Xilinx Inc. |
XCVU11P-1FSGD2104E
|
pacchetto: 2104-BBGA, FCBGA |
Azione7.904 |
|
2835000 | 396150400 | 572 | - | 0.825 V ~ 0.876 V | Surface Mount | 0°C ~ 100°C (TJ) | 2104-BBGA, FCBGA | 2104-FCBGA (47.5x47.5) |
||
Intel |
IC FPGA 896FBGA
|
pacchetto: 896-BBGA, FCBGA |
Azione4.928 |
|
- | - | - | - | 1.12V ~ 1.18V | Surface Mount | -40°C ~ 100°C (TJ) | 896-BBGA, FCBGA | 896-FBGA (31x31) |