Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Cores/Bus Width | Speed | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Operating Temperature | Security Features | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
IC PROCESSOR DUAL CORE
|
pacchetto: 448-FBGA Exposed Pad |
Azione4.720 |
|
2 Core, 32-Bit | 650MHz | - | DDR2 | No | - | GbE (2) | - | USB 2.0 + PHY (1) | - | 0°C ~ 70°C (TA) | - | 448-FBGA Exposed Pad | 448-PBGA w/Heat Spreader (23x23) |
||
Texas Instruments |
IC MPU OMAP-L1X 200MHZ 361NFBGA
|
pacchetto: 361-LFBGA |
Azione3.376 |
|
1 Core, 32-Bit | 200MHz | Signal Processing; C674x, System Control; CP15 | LPDDR, DDR2 | No | - | 10/100 Mbps (1) | - | USB 2.0 + PHY (1) | 1.8V, 3.3V | -40°C ~ 105°C (TJ) | - | 361-LFBGA | 361-NFBGA (16x16) |
||
NXP |
IC MPU Q OR IQ 1.5GHZ 780FCBGA
|
pacchetto: 780-BBGA, FCBGA |
Azione4.816 |
|
4 Core, 32-Bit | 1.5GHz | - | DDR3, DDR3L | No | - | 10/100/1000 Mbps (5), 10 Gbps (1) | SATA 3Gbps (2) | USB 2.0 + PHY (2) | 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 780-BBGA, FCBGA | 780-FCPBGA (23x23) |
||
Texas Instruments |
IC MPU OMAP-L1X 300MHZ 361NFBGA
|
pacchetto: 361-LFBGA |
Azione5.472 |
|
1 Core, 32-Bit | 300MHz | Signal Processing; C674x, System Control; CP15 | SDRAM | No | LCD | 10/100 Mbps (1) | SATA 3Gbps (1) | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | 1.8V, 3.3V | 0°C ~ 90°C (TJ) | Boot Security, Cryptography | 361-LFBGA | 361-NFBGA (13x13) |
||
NXP |
IC MPU MPC85XX 1.067GHZ 1023BGA
|
pacchetto: 1023-BFBGA, FCBGA |
Azione4.080 |
|
2 Core, 32-Bit | 1.067GHz | Signal Processing; SPE, Security; SEC | DDR2, DDR3 | No | - | 10/100/1000 Mbps (4) | - | - | 1.5V, 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | Cryptography, Random Number Generator | 1023-BFBGA, FCBGA | 1023-FCPBGA (33x33) |
||
NXP |
IC MPU MPC83XX 800MHZ 689TEBGA
|
pacchetto: 689-BBGA Exposed Pad |
Azione4.576 |
|
1 Core, 32-Bit | 800MHz | - | DDR, DDR2 | No | - | 10/100/1000 Mbps (2) | SATA 3Gbps (4) | USB 2.0 + PHY (1) | 1.8V, 2.5V, 3.3V | 0°C ~ 125°C (TA) | - | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
||
NXP |
IC MPU MPC83XX 333MHZ 516BGA
|
pacchetto: 516-BBGA Exposed Pad |
Azione8.376 |
|
1 Core, 32-Bit | 333MHz | Security; SEC 2.2 | DDR, DDR2 | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1) | 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TA) | Cryptography | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) |
||
NXP |
IC MPU MPC83XX 800MHZ 689TEBGA
|
pacchetto: 689-BBGA Exposed Pad |
Azione7.200 |
|
1 Core, 32-Bit | 800MHz | Security; SEC 3.0 | DDR, DDR2 | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1) | 1.8V, 2.5V, 3.3V | 0°C ~ 125°C (TA) | Cryptography, Random Number Generator | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
||
NXP |
IC MPU MPC83XX 533MHZ 740TBGA
|
pacchetto: 740-LBGA |
Azione5.056 |
|
1 Core, 32-Bit | 533MHz | Communications; QUICC Engine | DDR, DDR2 | No | - | 10/100/1000 Mbps (1) | - | USB 1.x (1) | 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TA) | - | 740-LBGA | 740-TBGA (37.5x37.5) |
||
NXP |
IC MPU MPC83XX 266MHZ 740TBGA
|
pacchetto: 740-LBGA |
Azione5.856 |
|
1 Core, 32-Bit | 266MHz | Communications; QUICC Engine | DDR, DDR2 | No | - | 10/100/1000 Mbps (1) | - | USB 1.x (1) | 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TA) | - | 740-LBGA | 740-TBGA (37.5x37.5) |
||
NXP |
IC MPU MPC8XX 66MHZ 256BGA
|
pacchetto: 256-BBGA |
Azione3.680 |
|
1 Core, 32-Bit | 66MHz | Communications; RISC CPM | DRAM | No | LCD, Video | 10 Mbps (1) | - | USB 1.x (1) | 3.3V | -40°C ~ 95°C (TA) | - | 256-BBGA | 256-PBGA (23x23) |
||
NXP |
IC MPU MPC74XX 667MHZ 360FCCLGA
|
pacchetto: 360-CLGA, FCCLGA |
Azione7.664 |
|
1 Core, 32-Bit | 667MHz | Multimedia; SIMD | - | No | - | - | - | - | 1.5V, 1.8V, 2.5V | 0°C ~ 105°C (TA) | - | 360-CLGA, FCCLGA | 360-FCCLGA (25x25) |
||
NXP |
IC MPU MPC82XX 200MHZ 408TBGA
|
pacchetto: 480-LBGA |
Azione2.016 |
|
1 Core, 32-Bit | 200MHz | Communications; RISC CPM | DRAM, SDRAM | No | - | 10/100 Mbps (3) | - | - | 3.3V | -40°C ~ 105°C (TA) | - | 480-LBGA | 408-TBGA (37.5x37.5) |
||
NXP |
IC MPU M683XX 16MHZ 100LQFP
|
pacchetto: 100-LQFP |
Azione5.696 |
|
1 Core, 8/16-Bit | 16MHz | Communications; RISC CPM | DRAM | No | - | - | - | - | 5.0V | 0°C ~ 70°C (TA) | - | 100-LQFP | 100-LQFP (14x14) |
||
NXP |
IC MPU MPC82XX 200MHZ 408TBGA
|
pacchetto: 480-LBGA |
Azione4.176 |
|
1 Core, 32-Bit | 200MHz | Communications; RISC CPM | DRAM, SDRAM | No | - | 10/100 Mbps (3) | - | - | 3.3V | -40°C ~ 105°C (TA) | - | 480-LBGA | 408-TBGA (37.5x37.5) |
||
NXP |
IC MPU MPC85XX 1.5GHZ 783FCBGA
|
pacchetto: 783-BBGA, FCBGA |
Azione3.936 |
|
1 Core, 32-Bit | 1.5GHz | Security; SEC | DDR2, DDR3 | No | - | 10/100/1000 Mbps (2) | SATA 3Gbps (2) | USB 2.0 (3) | 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TA) | Cryptography | 783-BBGA, FCBGA | 783-FCPBGA (29x29) |
||
Advantech Corp |
CORE 3.3G 3M 1155P 2CORE I3-2120
|
pacchetto: - |
Azione2.336 |
|
2 Core, 64-Bit | 3.3GHz | - | - | - | - | - | - | - | - | - | - | - | - |
||
NXP |
IC MPU Q OR IQ 1.2GHZ 689TEBGA
|
pacchetto: 689-BBGA Exposed Pad |
Azione5.216 |
|
1 Core, 32-Bit | 1.2GHz | Security; SEC 3.3 | DDR2, DDR3 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | - | -40°C ~ 125°C (TA) | Cryptography, Random Number Generator | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
||
NXP |
IC MPU I.MX50 800MHZ 400MAPBGA
|
pacchetto: 400-LFBGA |
Azione2.400 |
|
1 Core, 32-Bit | 800MHz | Multimedia; NEON? SIMD | LPDDR, LPDDR2, DDR2 | Yes | EPDC, LCD | 10/100 Mbps (1) | - | USB 2.0 + PHY (2) | 1.2V, 1.875V, 2.775V, 3.0V | 0°C ~ 70°C (TA) | Boot Security, Cryptography, Secure JTAG | 400-LFBGA | 400-MAPBGA (17x17) |
||
Texas Instruments |
IC PROCESSOR RISC
|
pacchetto: 298-LFBGA |
Azione4.752 |
|
- | - | - | - | - | - | - | - | - | - | - | - | 298-LFBGA | 298-NFBGA (13x13) |
||
NXP |
IC MPU Q OR IQ 800MHZ 689TEBGA
|
pacchetto: 689-BBGA Exposed Pad |
Azione6.064 |
|
1 Core, 32-Bit | 800MHz | Security; SEC 3.3 | DDR2, DDR3 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | - | -40°C ~ 105°C (TA) | Cryptography, Random Number Generator | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
||
Texas Instruments |
IC MPU SITARA 375MHZ 361NFBGA
|
pacchetto: 361-LFBGA |
Azione12.006 |
|
1 Core, 32-Bit | 375MHz | System Control; CP15 | LPDDR, DDR2 | No | LCD | - | - | USB 2.0 + PHY (1) | 1.8V, 3.3V | -40°C ~ 105°C (TJ) | - | 361-LFBGA | 361-NFBGA (13x13) |
||
Texas Instruments |
IC MPU SITARA 600MHZ 298NFBGA
|
pacchetto: 298-LFBGA |
Azione5.744 |
|
1 Core, 32-Bit | 600MHz | Multimedia; NEON? SIMD | LPDDR, DDR2, DDR3, DDR3L | Yes | LCD, Touchscreen | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (2) | 1.8V, 3.3V | 0°C ~ 90°C (TJ) | Cryptography, Random Number Generator | 298-LFBGA | 298-NFBGA (13x13) |
||
Texas Instruments |
IC MPU OMAP-35XX 600MHZ 423FCBGA
|
pacchetto: 423-LFBGA, FCBGA |
Azione4.224 |
|
1 Core, 32-Bit | 600MHz | Signal Processing; C64x+, Multimedia; NEON? SIMD | LPDDR | Yes | LCD | - | - | USB 1.x (3), USB 2.0 (1) | 1.8V, 3.0V | 0°C ~ 90°C (TJ) | - | 423-LFBGA, FCBGA | 423-FCBGA (16x16) |
||
Texas Instruments |
IC MPU SITARA 800MHZ 324NFBGA
|
pacchetto: 324-LFBGA |
Azione5.904 |
|
1 Core, 32-Bit | 800MHz | Multimedia; NEON? SIMD | LPDDR, DDR2, DDR3, DDR3L | Yes | LCD, Touchscreen | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (2) | 1.8V, 3.3V | 0°C ~ 90°C (TJ) | Cryptography, Random Number Generator | 324-LFBGA | 324-NFBGA(15x15) |
||
NXP |
I.MX 6 SERIES 32-BIT MPU QUAD A
|
pacchetto: 624-FBGA, FCBGA |
Azione7.280 |
|
4 Core, 32-Bit | 1.0GHz | Multimedia; NEON™ SIMD | LPDDR2, DDR3L, DDR3 | Yes | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | 1.8V, 2.5V, 2.8V, 3.3V | -40°C ~ 125°C (TJ) | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | 624-FBGA, FCBGA | 624-FCBGA (21x21) |
||
NXP |
LS1 32BIT ARM SOC 1GHZ DDR3/4
|
pacchetto: 525-FBGA, FCBGA |
Azione5.712 |
|
2 Core, 32-Bit | 1.2GHz | Multimedia; NEON™ SIMD | DDR3L, DDR4 | No | - | GbE (3) | SATA 3Gbps (1) | USB 2.0 (1), USB 3.0 + PHY | - | -40°C ~ 105°C | - | 525-FBGA, FCBGA | 525-FCPBGA (19x19) |
||
NXP |
QORIQ 64B POWER ARCH 8X 1.8GHZ
|
pacchetto: - |
Azione5.392 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
NXP |
IC MPU I.MX6QP ENHAN 624FCBGA
|
pacchetto: 624-FBGA, FCBGA |
Azione6.480 |
|
4 Core, 32-Bit | 800MHz | Multimedia; NEON™ SIMD | LPDDR2, DDR3L, DDR3 | Yes | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | 1.8V, 2.5V, 2.8V, 3.3V | -40°C ~ 105°C (TA) | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | 624-FBGA, FCBGA | 624-FCBGA (21x21) |
||
NXP |
IC MPU I.MX35 532MHZ 400MAPBGA
|
pacchetto: 400-LFBGA |
Azione3.920 |
|
1 Core, 32-Bit | 532MHz | Multimedia; VFP | LPDDR, DDR2 | No | Keypad, KPP, LCD | 10/100Mbps (1) | - | USB 2.0 + PHY (2) | 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V | -40°C ~ 85°C | Secure Fusebox, Secure JTAG | 400-LFBGA | 400-MAPBGA (17x17) |