Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microsemi Corporation |
IC SLAC CODEC/FILTER 8CH 121BGA
|
pacchetto: 121-LFBGA |
Azione30.780 |
|
PCI | 1 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 121-LFBGA | 121-LFBGA (10x10) |
||
Microsemi Corporation |
IC SLIC 1CH UNIV 145V 64TQFP
|
pacchetto: - |
Azione6.912 |
|
Parallel | 1 | 3.3V | 40mA | - | - | - | - | - |
||
Microsemi Corporation |
IC DIGITAL SWITCH 24K CH 484BGA
|
pacchetto: 484-BGA |
Azione4.880 |
|
- | 1 | 1.71 V ~ 1.89 V | 500mA | - | -40°C ~ 85°C | Surface Mount | 484-BGA | 484-PBGA (23x23) |
||
Microsemi Corporation |
IC DGTL SWITCH F12KDX 272BGA
|
pacchetto: 272-BGA |
Azione2.496 |
|
- | 1 | 3 V ~ 3.6 V | 160mA | - | -40°C ~ 85°C | Surface Mount | 272-BGA | 272-PBGA (27x27) |
||
Microsemi Corporation |
IC LINE CARD LCAS 1CH 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione26.964 |
|
- | 1 | 4.5 V ~ 5.5 V | - | - | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 144CBSGA
|
pacchetto: 144-BGA, CSPBGA |
Azione9.156 |
|
LIU | 1 | 3.135 V ~ 3.465 V | 80mA | - | -40°C ~ 85°C | Surface Mount | 144-BGA, CSPBGA | 144-TECSBGA (13x13) |
||
Cirrus Logic Inc. |
IC LIU T1/E1 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione5.664 |
|
E1, T1 | 1 | 4.75 V ~ 5.25 V | - | 350mW | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC |
||
Silicon Labs |
IC PROSLIC FXS DTMF -110V 42QFN
|
pacchetto: 42-WFQFN Exposed Pad |
Azione6.896 |
|
GCI, PCM, SPI | 1 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 42-WFQFN Exposed Pad | 42-QFN (5x7) |
||
Maxim Integrated |
IC BIT ERROR RATE TESTER 32TQFP
|
pacchetto: 32-TQFP |
Azione2.688 |
|
- | 1 | 4.5 V ~ 5.5 V | 10mA | - | -40°C ~ 85°C | Surface Mount | 32-TQFP | 32-TQFP (7x7) |
||
Cypress Semiconductor Corp |
IC TXRX HOTLINK 100-LBGA
|
pacchetto: 100-LBGA |
Azione4.832 |
|
LVTTL | - | 3.135 V ~ 3.465 V | 390mA | - | 0°C ~ 70°C | Surface Mount | 100-LBGA | 100-TBGA (11x11) |
||
Cypress Semiconductor Corp |
IC TXRX HOTLINK 256LBGA
|
pacchetto: 256-LBGA Exposed Pad |
Azione6.976 |
|
LVTTL | 4 | 3.135 V ~ 3.465 V | 830mA | - | 0°C ~ 70°C | Surface Mount | 256-LBGA Exposed Pad | 256-BGA |
||
Silicon Labs |
IC LINE-SIDE DAA 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione132.024 |
|
GCI, PCM, SPI | 1 | 3 V ~ 3.6 V | 8.5mA | - | 0°C ~ 70°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Maxim Integrated |
IC TXRX T1 1-CHIP 5V 100-LQFP
|
pacchetto: 100-LQFP |
Azione7.056 |
|
E1, HDLC, J1, T1 | 1 | 4.75 V ~ 5.25 V | 75mA | - | 0°C ~ 70°C | Surface Mount | 100-LQFP | 100-LQFP (14x14) |
||
Maxim Integrated |
IC LIU LN T1/E1/J1 3.3V 44-TQFP
|
pacchetto: 44-TQFP |
Azione31.896 |
|
- | 1 | 3.135 V ~ 3.465 V | 66mA | - | -40°C ~ 85°C | Surface Mount | 44-TQFP | 44-TQFP (10x10) |
||
Texas Instruments |
IC CIRCUIT TIME SLOT 20-DIP
|
pacchetto: 20-DIP (0.300", 7.62mm) |
Azione219.144 |
|
Serial | 1 | - | 1mA | - | -25°C ~ 125°C | Through Hole | 20-DIP (0.300", 7.62mm) | 20-DIP |
||
Exar Corporation |
IC LIU E3/DS3/STS-1 2CH 100TQFP
|
pacchetto: 100-LQFP |
Azione7.776 |
|
LIU | 1 | 3.135 V ~ 3.465 V | 210mA | - | -40°C ~ 85°C | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
IDT, Integrated Device Technology Inc |
IC LIU T1/E1 QUAD SHORT 128-TQFP
|
pacchetto: 128-LQFP |
Azione5.808 |
|
LIU | - | 3.13 V ~ 3.47 V | 55mA | - | -40°C ~ 85°C | Surface Mount | 128-LQFP | 128-TQFP (14x20) |
||
Silicon Labs |
IC LINE-SIDE DAA 16TSSOP
|
pacchetto: - |
Azione36.696 |
|
GCI, PCM, SPI | 1 | 3 V ~ 3.6 V | 8.5mA | - | 0°C ~ 70°C | - | - | - |
||
Microsemi Corporation |
IC RECEIVER DTMF 50DB 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione3.936 |
|
Parallel | 1 | 4.75 V ~ 5.25 V | 3mA | - | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
Microsemi Corporation |
IC RECEIVER DTMF 50DB 18SOIC
|
pacchetto: 18-SOIC (0.295", 7.50mm Width) |
Azione2.640 |
|
Parallel | 1 | 4.75 V ~ 5.25 V | 3mA | - | -40°C ~ 85°C | Surface Mount | 18-SOIC (0.295", 7.50mm Width) | 18-SOIC |
||
Silicon Labs |
IC PROSLIC FXS DC-DC -135V 42QFN
|
pacchetto: 42-WFQFN Exposed Pad |
Azione3.648 |
|
GCI, PCM, SPI | 1 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 42-WFQFN Exposed Pad | 42-QFN (5x7) |
||
Microsemi Corporation |
IC RECEIVER DTMF 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione17.928 |
|
- | 1 | 4.75 V ~ 5.25 V | 3mA | - | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
STMicroelectronics |
IC PROTECTION RINGING SLIC 8SOIC
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione12.168 |
|
- | 1 | - | - | - | -55°C ~ 125°C | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SO |
||
Microchip Technology |
12X1G + 24X1G OR 24X1G + 2X10G (
|
pacchetto: - |
Azione5.216 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC ETHERNET SWITCH 672FCBGA
|
pacchetto: - |
Azione6.544 |
|
PCI | 1 | - | - | - | -40°C ~ 110°C | Surface Mount | - | 672-FCBGA (27x27) |
||
Microchip Technology |
MODULE SONET/SDH
|
pacchetto: - |
Azione4.448 |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
MULTI LAYER SWITCH - 1588 DISA
|
pacchetto: - |
Azione5.616 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC SLIC 1CH 100V MTRG 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione5.488 |
|
2-Wire | 1 | 5V | - | - | 0°C ~ 70°C | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
Broadcom Limited |
MULTI LAYER SWITCH--1588 DISABLE
|
pacchetto: - |
Azione7.504 |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
GIGABIT ETH SWITCH 24GE 4XHG
|
pacchetto: - |
Azione7.984 |
|
PCI Express | - | - | - | - | - | - | - | - |