Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC SLIC VOICE ACCESS PDSO-20
|
pacchetto: 20-SOIC (0.433", 11.00mm Width) Exposed Pad |
Azione4.800 |
|
IOM-2, PCM | 2 | 5V | 60mA, 90mA | - | - | Surface Mount | 20-SOIC (0.433", 11.00mm Width) Exposed Pad | P-DSO-20 |
||
Infineon Technologies |
IC VOICE ACCESS CODEC TQFP64
|
pacchetto: 64-LQFP |
Azione3.520 |
|
- | 1 | - | - | - | 0°C ~ 70°C | Surface Mount | 64-LQFP | P-TQFP-64 |
||
Infineon Technologies |
IC MIXER BIPOLAR P-TSSOP-10
|
pacchetto: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
Azione6.816 |
|
- | 1 | 2.7 V ~ 4.5 V | 4.6mA | - | -40°C ~ 85°C | Surface Mount | 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) | P-TSSOP-10 |
||
Microchip Technology |
IC RING GENERATOR 48LQFP
|
pacchetto: 48-LQFP |
Azione10.032 |
|
- | 1 | 3 V ~ 3.6 V | 7mA | - | -40°C ~ 85°C | Surface Mount | 48-LQFP | 48-LQFP (7x7) |
||
Microsemi Corporation |
IC LINE CARD LCAS 1CHIPLE 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione6.000 |
|
- | 1 | 4.5 V ~ 5.5 V | - | - | -40°C ~ 85°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microsemi Corporation |
IC SLAC CODEC/FILTER 8CH 121BGA
|
pacchetto: 121-LFBGA |
Azione76.632 |
|
PCI | 1 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 121-LFBGA | 121-LFBGA (10x10) |
||
Silicon Labs |
IC SLIC PROG 1-CH 38QFN
|
pacchetto: 38-VFQFN Exposed Pad |
Azione659.964 |
|
SPI | 1 | 3.13 V ~ 5.25 V | 88mA | 700mW | - | Surface Mount | 38-VFQFN Exposed Pad | 38-QFN (5x7) |
||
Silicon Labs |
IC PROSLIC LINE FEED 100V 40QFN
|
pacchetto: 40-VFQFN Exposed Pad |
Azione2.496 |
|
GCI, PCM, SPI | 4 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-QFN (6x6) |
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 144CBSGA
|
pacchetto: 144-BGA, CSPBGA |
Azione3.936 |
|
LIU | 3 | 3.135 V ~ 3.465 V | 220mA | - | 0°C ~ 70°C | Surface Mount | 144-BGA, CSPBGA | 144-TECSBGA (13x13) |
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 144CSBGA
|
pacchetto: 144-BGA, CSPBGA |
Azione4.720 |
|
LIU | 2 | 3.135 V ~ 3.465 V | 150mA | - | 0°C ~ 70°C | Surface Mount | 144-BGA, CSPBGA | 144-TECSBGA (13x13) |
||
Maxim Integrated |
IC FRAMER TRPL DS3/E3 144TCBGA
|
pacchetto: 144-BGA, CSPBGA |
Azione4.864 |
|
LIU | 3 | 3.135 V ~ 3.465 V | 225mA | - | -40°C ~ 85°C | Surface Mount | 144-BGA, CSPBGA | 144-CSPBGA (13x13) |
||
Exar Corporation |
IC LIU/FRAMER T1/E1/J1 8CH 484BG
|
pacchetto: 484-BGA |
Azione14.892 |
|
- | - | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 484-BGA | 484-STBGA (23x23) |
||
Silicon Labs |
IC SLIC PROG 1CH 38TSSOP
|
pacchetto: 38-TFSOP (0.173", 4.40mm Width) |
Azione7.856 |
|
SPI | 1 | 3.13 V ~ 5.25 V | 88mA | 700mW | - | Surface Mount | 38-TFSOP (0.173", 4.40mm Width) | 38-TSSOP |
||
IXYS Integrated Circuits Division |
IC TRANSCEIVER DTMF CMOS 20-SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione6.576 |
|
- | 1 | 4.75 V ~ 5.25 V | 10mA | 78.75mW | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Maxim Integrated |
IC TRANSCEIVER T1 QUAD 5V 256BGA
|
pacchetto: 256-BGA |
Azione19.320 |
|
T1 | 4 | 5V | - | - | - | Surface Mount | 256-BGA | 256-BGA (27x27) |
||
Microsemi Corporation |
IC DGTL SWITCH IDX 64X64 68PLCC
|
pacchetto: 68-LCC (J-Lead) |
Azione5.456 |
|
- | 1 | 4.5 V ~ 5.5 V | 10mA | - | -40°C ~ 85°C | Surface Mount | 68-LCC (J-Lead) | 68-PLCC |
||
NXP |
IC C2K 1.2GHZ 8CH VOIP 625BGA
|
pacchetto: - |
Azione5.664 |
|
- | - | - | - | - | - | - | - | - |
||
Maxim Integrated |
IC TRANSCEIVER T1 40-DIP
|
pacchetto: 40-DIP (0.600", 15.24mm) |
Azione6.864 |
|
T1 | 1 | 4.5 V ~ 5.5 V | 3mA | - | 0°C ~ 70°C | Through Hole | 40-DIP (0.600", 15.24mm) | 40-PDIP |
||
Exar Corporation |
IC LIU SH E1 OCTAL 225BGA
|
pacchetto: 225-BGA |
Azione7.500 |
|
LIU | 8 | 3.14 V ~ 3.47 V | - | - | -40°C ~ 85°C | Surface Mount | 225-BGA | 225-BGA (19x19) |
||
Microsemi Corporation |
IC TDM/TSI SWITCH 512X256 40DIP
|
pacchetto: 40-DIP (0.600", 15.24mm) |
Azione5.248 |
|
- | 1 | 4.75 V ~ 5.25 V | 10mA | - | -40°C ~ 85°C | Through Hole | 40-DIP (0.600", 15.24mm) | 40-PDIP |
||
Microsemi Corporation |
IC CODEC/FILTER 4CH 20I/O 44TQFP
|
pacchetto: 44-TQFP |
Azione6.560 |
|
PCM | 4 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 44-TQFP | 44-TQFP (10x10) |
||
Microsemi Corporation |
IC VOICEPORT 2CH FXS 8KHZ 64QFN
|
pacchetto: - |
Azione263.520 |
|
PCM | 2 | 4.75 V ~ 35 V | - | - | - | Surface Mount | - | 64-QFN |
||
Microsemi Corporation |
IC TRACKING BATT 150V 2CH 64QFN
|
pacchetto: 64-VFQFN Exposed Pad |
Azione5.136 |
|
PCM | 1 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 64-VFQFN Exposed Pad | 64-QFN (9x9) |
||
Microsemi Corporation |
IC CNIC CIDCW CID 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione5.552 |
|
4-Wire | 1 | 2.7 V ~ 5.5 V | 2.8mA | - | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microsemi Corporation |
TSE-NX160
|
pacchetto: - |
Azione5.664 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
10-PORT CE SWITCH WITH CUPHY
|
pacchetto: - |
Azione7.216 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
4P Q/SGMII CU/FI 3E, 256, 4NS CO
|
pacchetto: - |
Azione5.616 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC SYNCHRONIZER T1/E1 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione3.552 |
|
- | 1 | 4.5V ~ 5.5V | 60mA | - | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC |
||
Microchip Technology |
IC TXRX SGL E1 W/LIU 68PLCC
|
pacchetto: 68-LCC (J-Lead) |
Azione3.104 |
|
- | 1 | 4.75V ~ 5.25V | 150mA | - | -40°C ~ 85°C | Surface Mount | 68-LCC (J-Lead) | 68-PLCC |
||
Microchip Technology |
MICROPROCESSOR
|
pacchetto: - |
Azione6.640 |
|
JTAG, Microprocessor, Parallel, Serial | 1 | 1.2V | - | - | - | - | - | - |