Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC ECHO CANCELLER DGTL TQFP144
|
pacchetto: 144-LQFP |
Azione2.896 |
|
PCM, Serial, UCC | 1 | 3 V ~ 3.6 V | 350mA | 900mW | 0°C ~ 70°C | Surface Mount | 144-LQFP | P-TQFP-144 |
||
Infineon Technologies |
IC CONTROLLER PCM 80MQFP
|
pacchetto: 80-QFP |
Azione5.952 |
|
ISDN, PCM | 1 | 5V | 15mA | - | 0°C ~ 70°C | Surface Mount | 80-QFP | PG-MQFP-80 |
||
Microsemi Corporation |
IC ENHANCED DIGITAL SWITCH
|
pacchetto: - |
Azione7.424 |
|
- | - | - | - | - | - | - | - | - |
||
Microsemi Corporation |
IC ECHO CANCEL ACOUSTIC 36SSOP
|
pacchetto: 36-BSOP (0.295", 7.50mm Width) |
Azione3.376 |
|
Serial | 1 | 2.7 V ~ 3.6 V | 3µA | - | -40°C ~ 85°C | Surface Mount | 36-BSOP (0.295", 7.50mm Width) | 36-QSOP |
||
Microsemi Corporation |
IC DGTL SWITCH DHS 100MQFP
|
pacchetto: 100-BQFP |
Azione71.472 |
|
Parallel | 1 | 4.75 V ~ 5.25 V | 100mA | - | -40°C ~ 85°C | Surface Mount | 100-BQFP | 100-MQFP (14x20) |
||
Silicon Labs |
IC PROSLIC/CODEC DUAL 64TQFP
|
pacchetto: 64-TQFP |
Azione3.040 |
|
GCI, PCM, SPI | 2 | 3.3V, 5V | 65mA | 941mW | 0°C ~ 70°C | Surface Mount | 64-TQFP | 64-TQFP (10x10) |
||
Silicon Labs |
IC SLIC/CODEC DUAL-CH 64TQFP
|
pacchetto: 64-TQFP |
Azione6.848 |
|
GCI, PCM, SPI | 2 | 3.3V, 5V | 65mA | 941mW | 0°C ~ 70°C | Surface Mount | 64-TQFP | 64-TQFP (10x10) |
||
IXYS Integrated Circuits Division |
IC SWITCH LINE CARD ACC 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione4.256 |
|
- | 1 | 4.5 V ~ 5.5 V | 1.3mA | 10mW | -40°C ~ 110°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
IXYS Integrated Circuits Division |
IC SWITCH LINE CARD ACC 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione31.236 |
|
- | 1 | 4.5 V ~ 5.5 V | 1.3mA | 10mW | -40°C ~ 110°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Texas Instruments |
IC 1 LINE RING GEN CONTR 16-SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione5.024 |
|
- | 1 | 12V | 1mA | - | -55°C ~ 125°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Microsemi Solutions Sdn Bhd. |
IC ETHERNET RGMII/RMII 48-QFN
|
pacchetto: - |
Azione3.616 |
|
- | - | - | - | - | - | - | - | - |
||
Microsemi Corporation |
IC VOICE ECHO CANCELLER 100LQFP
|
pacchetto: 100-LQFP |
Azione2.752 |
|
LIU | 1 | 1.6 V ~ 2 V | 40mA | - | -40°C ~ 85°C | Surface Mount | 100-LQFP | 100-LQFP (14x14) |
||
Microsemi Corporation |
IC DGTL SWITCH 2048X2048 120BGA
|
pacchetto: 120-BGA |
Azione3.632 |
|
- | 1 | 3 V ~ 3.6 V | 45mA | - | -40°C ~ 85°C | Surface Mount | 120-BGA | 120-PBGA (23x23) |
||
IDT, Integrated Device Technology Inc |
IC LIU T1/J1/E1 4CH 128-TQFP
|
pacchetto: 128-LQFP |
Azione5.184 |
|
LIU | - | 3.13 V ~ 3.47 V | - | - | -40°C ~ 85°C | Surface Mount | 128-LQFP | 128-TQFP (14x20) |
||
IDT, Integrated Device Technology Inc |
IC LIU T1/E1/J1 OCTAL 256BGA
|
pacchetto: 256-BGA |
Azione7.760 |
|
E1, J1, T1 | 8 | 1.8V, 3.3V | - | 2.57W | -40°C ~ 85°C | Surface Mount | 256-BGA | 256-PBGA (17x17) |
||
Silicon Labs |
IC PROSLIC FXS PCM DTMF 56QFN
|
pacchetto: - |
Azione4.112 |
|
3-Wire, PCM | 2 | 3.3V | - | - | 0°C ~ 70°C | - | - | - |
||
IXYS Integrated Circuits Division |
DAA LITELINK III RING DETECT
|
pacchetto: - |
Azione66.960 |
|
- | - | - | - | - | - | - | - | - |
||
Silicon Labs |
IC PROSLIC PCM/SPI -110V 42QFN
|
pacchetto: 42-WFQFN Exposed Pad |
Azione16.764 |
|
GCI, PCM, SPI | 1 | 3.3V | - | - | 0°C ~ 70°C | Surface Mount | 42-WFQFN Exposed Pad | 42-QFN (5x7) |
||
IXYS Integrated Circuits Division |
IC LITELINK III HALF RING 32SOIC
|
pacchetto: 32-SOIC (0.295", 7.50mm Width) |
Azione61.092 |
|
- | 1 | 3 V ~ 5.5 V | 9mA | 1W | -40°C ~ 85°C | Surface Mount | 32-SOIC (0.295", 7.50mm Width) | 32-SOIC |
||
Microsemi Solutions Sdn Bhd. |
26-PORT L2/L3 STACKABLE GIGABIT
|
pacchetto: - |
Azione7.140 |
|
PCI | 1 | - | - | - | -40°C ~ 110°C | Surface Mount | - | 672-FCBGA (27x27) |
||
Microsemi Solutions Sdn Bhd. |
IC ETHERNET RGMII/RMII 68QFN
|
pacchetto: 68-VFQFN Exposed Pad |
Azione16.998 |
|
RMII | 1 | - | - | - | -40°C ~ 125°C | Surface Mount | 68-VFQFN Exposed Pad | 68-QFN (8x8) |
||
Rohm Semiconductor |
IC DTMF RCVR FOR PHN SSOP-A16 TR
|
pacchetto: 16-LSOP (0.173", 4.40mm Width) |
Azione31.404 |
|
- | 1 | 4.5 V ~ 5.5 V | 3.4mA | 650mW | -40°C ~ 85°C | Surface Mount | 16-LSOP (0.173", 4.40mm Width) | 16-SSOPA |
||
Broadcom Limited |
ETH SWITCH 24GE 4X10GE
|
pacchetto: - |
Azione4.992 |
|
- | - | - | - | - | - | - | - | - |
||
Microsemi Corporation |
HIGH DENSITY FRAMER/MAPPER FOR 8
|
pacchetto: - |
Azione6.640 |
|
- | - | - | - | - | - | - | - | - |
||
Microsemi Corporation |
32 LINK, 256 HDLC CHANNEL FRAME
|
pacchetto: - |
Azione3.280 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC CNIC CIDCW CWD CID 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione5.616 |
|
3-Wire | 1 | 2.7V ~ 5.5V | 4.3mA | - | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC SLIC 1CH P RV 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione4.928 |
|
2-Wire | 1 | 4.75V ~ 5.25V | - | - | 0°C ~ 70°C | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
Microchip Technology |
IC TDM SWITCH 4K-CH ENH 256LQFP
|
pacchetto: 256-LQFP |
Azione2.768 |
|
- | 1 | 1.71V ~ 1.89V | 1.75mA | - | -40°C ~ 85°C | Surface Mount | 256-LQFP | 256-LQFP (28x28) |
||
Microchip Technology |
IC FXO CODEC 1CH 3V 44QFN
|
pacchetto: 44-QFN |
Azione6.160 |
|
PCM | 1 | 3V, 5V | - | - | - | Surface Mount | 44-QFN | 44-QFN (7x7) |
||
Microchip Technology |
IC TXRX DTMF 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione15.648 |
|
- | 1 | 4.75V ~ 5.25V | 7mA | - | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |