Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC SPEECH/VOICE INCA-S TQFP-144
|
pacchetto: 144-LQFP |
Azione3.392 |
|
IOM-2 | 1 | - | - | - | - | Surface Mount | 144-LQFP | P-TQFP-144 |
||
Infineon Technologies |
IC CODEC FILTER 2CHAN MQFP-64
|
pacchetto: 64-QFP |
Azione6.576 |
|
IOM-2 PCM, SPI | 2 | 5V | 18mA | 90mW | - | Surface Mount | 64-QFP | P-64-MQFP |
||
Infineon Technologies |
IC MODULAR ISDN NT ORD MQFP-44
|
pacchetto: 44-QFP |
Azione6.896 |
|
ISDN | - | - | - | - | - | Surface Mount | 44-QFP | P-MQFP-44 |
||
Microsemi Corporation |
IC DIGITAL SWITCH 32K CH 324BGA
|
pacchetto: 324-BGA |
Azione3.264 |
|
- | 1 | 1.71 V ~ 1.89 V | 500mA | - | -40°C ~ 85°C | Surface Mount | 324-BGA | 324-PBGA (19x19) |
||
Microsemi Corporation |
IC DIGITAL SWITCH 16K CH 256BGA
|
pacchetto: 256-BGA |
Azione6.880 |
|
- | 1 | 1.71 V ~ 1.89 V | 240mA | - | -40°C ~ 85°C | Surface Mount | 256-BGA | 256-BGA (17x17) |
||
Microsemi Corporation |
IC SYNCHRONIZER T1/E1 44MQFP
|
pacchetto: 44-QFP |
Azione4.224 |
|
- | 1 | 4.5 V ~ 5.5 V | 90mA | - | -40°C ~ 85°C | Surface Mount | 44-QFP | 44-MQFP (10x10) |
||
Microsemi Corporation |
IC SLIC 1CH SWREG 63DB 44TQFP
|
pacchetto: 44-TQFP |
Azione7.200 |
|
2-Wire | 1 | 4.75 V ~ 5.25 V | - | - | -40°C ~ 85°C | Surface Mount | 44-TQFP | 44-TQFP (10x10) |
||
ams |
IC TELEPHONE CMOS MULTIFU 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione6.144 |
|
- | 1 | 3.8 V ~ 5 V | 4mA | - | -25°C ~ 70°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Silicon Labs |
IC SLIC/CODEC 2CHANNEL 64TQFP
|
pacchetto: 64-TQFP |
Azione5.712 |
|
GCI, PCM, SPI | 2 | 3.3V | - | - | - | Surface Mount | 64-TQFP | 64-TQFP (10x10) |
||
Silicon Labs |
IC PROSLIC FXS -135V 42QFN
|
pacchetto: 42-WFQFN Exposed Pad |
Azione4.256 |
|
GCI, PCM, SPI | 1 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 42-WFQFN Exposed Pad | 42-QFN (5x7) |
||
Exar Corporation |
IC LIU E3/DS3/STS-1 6CH 217BGA
|
pacchetto: 217-BBGA |
Azione4.800 |
|
LIU | 6 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 217-BBGA | 217-BGA (23x23) |
||
Exar Corporation |
IC FRAMER DS3/E3 2CH 160QFP
|
pacchetto: 160-BQFP |
Azione8.760 |
|
- | - | 3.3V | 100mA | - | -40°C ~ 85°C | Surface Mount | 160-BQFP | 160-PQFP (28x28) |
||
Exar Corporation |
IC LIU SH T1/E1/J1 8CH 225BGA
|
pacchetto: 225-BGA |
Azione7.136 |
|
LIU | 8 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 225-BGA | 225-BGA (19x19) |
||
Maxim Integrated |
IC LIU E1/T1/J1 3.3V 144-ELQFP
|
pacchetto: 144-LQFP Exposed Pad |
Azione4.400 |
|
LIU | 8 | 3.135 V ~ 3.465 V | 250mA | - | 0°C ~ 70°C | Surface Mount | 144-LQFP Exposed Pad | 144-LQFP-EP (20x20) |
||
Texas Instruments |
IC TONE DECODER CMOS 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione204.948 |
|
- | 1 | 2 V ~ 9 V | - | 500mW | -25°C ~ 100°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Silicon Labs |
IC SLIC/CODEC 100V LINE 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) Exposed Pad |
Azione8.028 |
|
GCI, PCM, SPI | 2 | 3.3V, 5V | 110µA | 941mW | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) Exposed Pad | 16-SOIC |
||
Maxim Integrated |
IC TXRX 1-CHIP T1 3.3V 100-LQFP
|
pacchetto: 100-LQFP |
Azione5.616 |
|
HDLC, T1 | 1 | 3.14 V ~ 3.47 V | 75mA | - | 0°C ~ 70°C | Surface Mount | 100-LQFP | 100-LQFP (14x14) |
||
Maxim Integrated |
IC TXRX E1 QUAD 5V 256BGA
|
pacchetto: 256-BGA |
Azione12.924 |
|
E1 | 4 | 5V | - | - | - | Surface Mount | 256-BGA | 256-BGA (27x27) |
||
Microsemi Corporation |
IC TDM/TSI SWITCH 128X128 44PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione7.264 |
|
- | 1 | 4.75 V ~ 5.25 V | 6mA | - | -40°C ~ 85°C | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.51x16.51) |
||
Silicon Labs |
IC SLIC/CODEC PROG 1CH 38QFN
|
pacchetto: 38-VFQFN Exposed Pad |
Azione179.616 |
|
PCM, SPI | 1 | 3.3V, 5V | 88mA | 700mW | 0°C ~ 70°C | Surface Mount | 38-VFQFN Exposed Pad | 38-QFN (5x7) |
||
Silicon Labs |
IC ISOMODEM LINE-SIDE DAA 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione311.700 |
|
Parallel, SPI, UART | 1 | 3 V ~ 3.6 V | 8.5mA | - | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Maxim Integrated |
IC LIU QUAD E1/T1/J1 128-LQFP
|
pacchetto: 128-LQFP |
Azione6.704 |
|
- | 4 | 3.135 V ~ 3.465 V | 320mA | - | 0°C ~ 70°C | Surface Mount | 128-LQFP | 128-LQFP (14x20) |
||
Microchip Technology |
QUAD GIGABIT IEEE 1588 10NS Q/SG
|
pacchetto: - |
Azione6.048 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC INTERFACE CONTROLLER
|
pacchetto: - |
Azione2.896 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC VOICEPORT FXS 8KHZ 44LQFP
|
pacchetto: 44-LQFP |
Azione5.888 |
|
PCM | 1 | 3V, 5V | - | - | - | Surface Mount | 44-LQFP | 44-eLQFP |
||
Microchip Technology |
IC TDM/TSI SWITCH 256X256 48SSOP
|
pacchetto: 48-BSSOP (0.295", 7.50mm Width) |
Azione2.944 |
|
- | 1 | 3V ~ 3.6V | 4mA | - | -40°C ~ 85°C | Surface Mount | 48-BSSOP (0.295", 7.50mm Width) | 48-SSOP |
||
Microchip Technology |
IC ECHO CANCEL DUAL CODEC 81CBGA
|
pacchetto: 81-LBGA |
Azione3.008 |
|
Serial | 1 | - | - | - | -40°C ~ 85°C | Surface Mount | 81-LBGA | 81-CABGA (10x10) |
||
Microchip Technology |
IC VOICEPORT 2CH FXS 4KHZ 80LQFP
|
pacchetto: 80-LQFP |
Azione7.440 |
|
PCM | 2 | - | - | - | - | Surface Mount | 80-LQFP | 80-eLQFP |
||
Microchip Technology |
IC VOICEPORT 1CH FXS 4KHZ 44LQFP
|
pacchetto: 44-LQFP |
Azione2.416 |
|
PCM | 1 | 3V, 5V | - | - | - | Surface Mount | 44-LQFP | 44-eLQFP |
||
Microchip Technology |
2CH ADSL2+ LINE DRIVER 12V QFN16
|
pacchetto: - |
Azione22.530 |
|
- | - | - | - | - | - | - | - | - |