Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC CODEC VOIP W/DSP LBGA-176-3
|
pacchetto: 176-LBGA |
Azione4.416 |
|
ADPCM | 4 | - | - | - | - | Surface Mount | 176-LBGA | PG-LBGA-176 |
||
Infineon Technologies |
IC MTSI-XL SWITCHING MQFP100
|
pacchetto: 100-BQFP |
Azione7.168 |
|
PCM, PLL | 1 | 3.13 V ~ 3.47 V | 200mA | - | -40°C ~ 85°C | Surface Mount | 100-BQFP | P-MQFP-100 |
||
Infineon Technologies |
IC NETWORK TERM QUAD MQFP64
|
pacchetto: 64-QFP |
Azione6.768 |
|
ISDN | 4 | 7V | 1mA | 840mW | 0°C ~ 70°C | Surface Mount | 64-QFP | P-64-MQFP |
||
Microsemi Corporation |
IC SLIC 1CH UNIV 100V 48TQFP
|
pacchetto: - |
Azione6.800 |
|
Parallel | 1 | 3.3V | 40mA | - | - | - | - | - |
||
Microsemi Corporation |
IC SLIC 1CH SWREG 63DB 32QFN
|
pacchetto: 32-VQFN Exposed Pad |
Azione2.352 |
|
2-Wire | 1 | 4.75 V ~ 5.25 V | - | - | -40°C ~ 85°C | Surface Mount | 32-VQFN Exposed Pad | 32-QFN (8x8) |
||
Exar Corporation |
IC LIU E3/DS3/STS-1 2CH 100TQFP
|
pacchetto: 100-LQFP |
Azione5.520 |
|
LIU | 2 | 3.135 V ~ 3.465 V | 260mA | - | -40°C ~ 85°C | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
Exar Corporation |
IC LIU EI SGL 28SOJ
|
pacchetto: 28-BSOJ (0.300", 7.62mm Width) |
Azione10.020 |
|
LIU | 1 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 28-BSOJ (0.300", 7.62mm Width) | 28-SOJ |
||
Cypress Semiconductor Corp |
IC RECEIVER HOTLINK 256LBGA
|
pacchetto: 256-LBGA Exposed Pad |
Azione7.312 |
|
LVTTL | 4 | 3.135 V ~ 3.465 V | 640mA | - | -40°C ~ 85°C | Surface Mount | 256-LBGA Exposed Pad | 256-BGA |
||
Silicon Labs |
IC SLIC PROG 1-CH 38QFN
|
pacchetto: 38-VFQFN Exposed Pad |
Azione4.480 |
|
SPI | 1 | 3.13 V ~ 5.25 V | 88mA | 700mW | - | Surface Mount | 38-VFQFN Exposed Pad | 38-QFN (5x7) |
||
IXYS Integrated Circuits Division |
IC SWITCH LINE CARD ACC 16MLP
|
pacchetto: 16-VDFN Exposed Pad |
Azione3.680 |
|
- | 1 | 4.5 V ~ 5.5 V | 1.3mA | 10mW | -40°C ~ 110°C | Surface Mount | 16-VDFN Exposed Pad | 16-MLP (7x6) |
||
IXYS Integrated Circuits Division |
IC RELAY OPTO 150MA 8SMD
|
pacchetto: 8-SMD, Gull Wing |
Azione2.064 |
|
- | 2 | - | - | 800mW | -40°C ~ 85°C | Surface Mount | 8-SMD, Gull Wing | 8-SMD |
||
IXYS Integrated Circuits Division |
IC OPT-ISOLATED MULTIFUNC 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione25.200 |
|
- | 1 | - | - | 1W | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Silicon Labs |
IC PROSLIC FXS 1CH -136V 42QFN
|
pacchetto: 42-WFQFN Exposed Pad |
Azione7.824 |
|
- | - | - | - | - | - | Surface Mount | 42-WFQFN Exposed Pad | 42-QFN (5x7) |
||
Silicon Labs |
IC LINE-SIDE DAA 20QFN
|
pacchetto: 20-VFQFN Exposed Pad |
Azione4.816 |
|
GCI, PCM, SPI | 1 | 3 V ~ 3.6 V | 8.5mA | - | 0°C ~ 70°C | Surface Mount | 20-VFQFN Exposed Pad | 20-QFN (3x3) |
||
Silicon Labs |
IC PROSLIC FXS DC-DC CTLR 42QFN
|
pacchetto: 42-WFQFN Exposed Pad |
Azione3.104 |
|
- | - | - | - | - | - | Surface Mount | 42-WFQFN Exposed Pad | 42-QFN (5x7) |
||
Silicon Labs |
IC VOICE DAA SYSTEM SIDE 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione23.016 |
|
GCI, PCM, SPI | 1 | 3 V ~ 3.6 V | 8.5mA | - | 0°C ~ 70°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Microsemi Corporation |
IC SLIC 2CH UNIV 150V 48QFN
|
pacchetto: 48-VFQFN Exposed Pad |
Azione3.152 |
|
4-Wire | 2 | 3.135 V ~ 3.465 V | 25mA | - | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
Microsemi Corporation |
IC VOICEPORT 2CH SLIC 150V 24QFN
|
pacchetto: 24-QFN |
Azione3.328 |
|
PCM | 2 | - | - | - | - | Surface Mount | 24-QFN | 24-QFN (6x6) |
||
Microsemi Solutions Sdn Bhd. |
24 PORT MANAGED LAYER 2-SWITCH
|
pacchetto: - |
Azione3.936 |
|
Serial | 1 | 1V | - | - | - | Surface Mount | - | 672-BGA |
||
IXYS Integrated Circuits Division |
IC PHONE LINE MONITOR 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione25.704 |
|
- | 1 | 3 V ~ 5.5 V | 10mA | 300mW | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Maxim Integrated |
IC TXRX T1/E1/J1 1-CHIP 100-LQFP
|
pacchetto: 100-LQFP |
Azione62.136 |
|
E1, HDLC, J1, T1 | 1 | 3.14 V ~ 3.47 V | 75mA | - | 0°C ~ 70°C | Surface Mount | 100-LQFP | 100-LQFP (14x14) |
||
Broadcom Limited |
SWITCH FABRIC
|
pacchetto: - |
Azione5.856 |
|
- | - | - | - | - | - | - | - | - |
||
Microsemi Corporation |
40G VT/TU SWITCHING ELEMENT
|
pacchetto: 672-BGA, FCBGA |
Azione6.096 |
|
Serial | - | 1.2V | - | - | - | Surface Mount | 672-BGA, FCBGA | 672-FCBGA (27x27) |
||
Microchip Technology |
STACKABLE MANAGED SWITCH 24 PORT
|
pacchetto: - |
Azione3.136 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC ETHERNET QUAD PORT 256BGA
|
pacchetto: - |
Azione3.280 |
|
- | 1 | 1V | - | - | - | Surface Mount | - | 256-BGA (17x17) |
||
Microchip Technology |
IC REDRIVER 3.5GBPS 32QFN
|
pacchetto: - |
Azione6.864 |
|
- | 2 | 2.5V | - | - | -40°C ~ 110°C | Surface Mount | - | 32-QFN (5x5) |
||
Broadcom Limited |
MULTI LAYER SWITCH--1588 DISABLE
|
pacchetto: - |
Azione3.232 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC RECEIVER DTMF 16PAIR 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione5.392 |
|
- | 1 | 4.75V ~ 5.25V | 3mA | 500mW | -40°C ~ 85°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-DIP |
||
Microchip Technology |
IC VOICEPORT 2CH FXS 8KHZ 80LQFP
|
pacchetto: 80-LQFP |
Azione7.216 |
|
PCM | 2 | 4.75V ~ 35V | - | - | - | Surface Mount | 80-LQFP | 80-eLQFP |
||
Microchip Technology |
IC SLIC 2CH UNIV 145V 40QFN
|
pacchetto: - |
Azione5.040 |
|
Serial | 2 | 3.3V | - | - | - | Surface Mount | - | 40-QFN |