Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Elements | Number of Bits per Element | Input Type | Output Type | Current - Output High, Low | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Diodes Incorporated |
IC LOGIC
|
pacchetto: - |
Azione2.800 |
|
- | - | - | - | - | - | - | - | - | - |
||
Texas Instruments |
IC BUS TRANSCEIVER DUAL 24SOIC
|
pacchetto: 24-SOIC (0.295", 7.50mm Width) |
Azione3.296 |
|
1 | 8 | - | Push-Pull | 15mA, 24mA | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 24-SOIC (0.295", 7.50mm Width) | 24-SOIC |
||
ON Semiconductor |
IC BUFFER TRIPLE NON-INV 8ULLGA
|
pacchetto: 8-XFLGA |
Azione3.152 |
|
3 | 1 | - | Push-Pull | 8mA, 8mA | 1.65 V ~ 5.5 V | -55°C ~ 125°C (TA) | Surface Mount | 8-XFLGA | 8-ULLGA (1.6x1) |
||
Texas Instruments |
IC BUS BUFF TRI-ST N-INV 5DSBGA
|
pacchetto: 5-UFBGA, DSBGA |
Azione7.344 |
|
1 | 1 | - | Push-Pull | 9mA, 9mA | 0.8 V ~ 2.7 V | -40°C ~ 85°C (TA) | Surface Mount | 5-UFBGA, DSBGA | 5-DSBGA |
||
Texas Instruments |
IC BUS TRANSCEIVER DUAL 24DIP
|
pacchetto: 24-DIP (0.300", 7.62mm) |
Azione2.416 |
|
1 | 8 | - | Push-Pull | 15mA, 48mA | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 24-DIP (0.300", 7.62mm) | 24-PDIP |
||
Texas Instruments |
IC BUFF/DVR N-INV 24SOIC
|
pacchetto: 24-SOIC (0.295", 7.50mm Width) |
Azione6.080 |
|
1 | 10 | - | Push-Pull | 24mA, 48mA | 4.75 V ~ 5.25 V | 0°C ~ 70°C (TA) | Surface Mount | 24-SOIC (0.295", 7.50mm Width) | 24-SOIC |
||
Texas Instruments |
IC BUFFER HEX NON-INV 14SO
|
pacchetto: 14-SOIC (0.209", 5.30mm Width) |
Azione3.408 |
|
6 | 1 | - | Open Collector | -, 24mA | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 14-SOIC (0.209", 5.30mm Width) | 14-SOP |
||
Diodes Incorporated |
IC 2BIT LVL SHFT BUF/TXRX 12TDFN
|
pacchetto: 12-WFDFN Exposed Pad |
Azione7.168 |
|
2 | 1 | - | Push-Pull | 12mA, 12mA; 24mA, 24mA | 1.65 V ~ 3.6 V, 2.3 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 12-WFDFN Exposed Pad | 12-TDFN (3.0x3.5) |
||
NXP |
IC TRANSCVR 16BIT N-INV 56TSSOP
|
pacchetto: 56-TFSOP (0.240", 6.10mm Width) |
Azione7.520 |
|
2 | 8 | - | Push-Pull | 32mA, 64mA | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 56-TFSOP (0.240", 6.10mm Width) | 56-TSSOP |
||
NXP |
IC TRANSCVR TRI-ST 16BIT 56VFBGA
|
pacchetto: 56-VFBGA |
Azione4.128 |
|
2 | 8 | - | Push-Pull | 32mA, 64mA | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 56-VFBGA | 56-VFBGA (4.5x7) |
||
Fairchild/ON Semiconductor |
IC TRANSCVR TRI-ST 16BIT 56TSSOP
|
pacchetto: 56-TFSOP (0.240", 6.10mm Width) |
Azione45.192 |
|
2 | 8 | - | Push-Pull | 32mA, 64mA | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 56-TFSOP (0.240", 6.10mm Width) | 56-TSSOP |
||
Texas Instruments |
IC BUFF/DVR NON-INVERT 5DSBGA
|
pacchetto: 5-XFBGA, DSBGA |
Azione3.056 |
|
1 | 1 | - | Open Drain | -, 32mA | 1.65 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 5-XFBGA, DSBGA | 5-DSBGA, 5-WCSP (1.4x0.9) |
||
Texas Instruments |
IC BUFF/DVR TRI-ST 8BIT 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione3.424 |
|
1 | 8 | - | Push-Pull | 32mA, 64mA | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Texas Instruments |
IC INVERTER 1-INPUT SOT23-5
|
pacchetto: SC-74A, SOT-753 |
Azione5.536 |
|
1 | 1 | - | Push-Pull | 4mA, 4mA | 0.8 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | SC-74A, SOT-753 | SOT-23-5 |
||
Nexperia USA Inc. |
IC BUFFER NON-INVERTING 6XSON
|
pacchetto: 6-XFDFN |
Azione6.928 |
|
1 | 1 | - | Push-Pull | 32mA, 32mA | 1.65 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 6-XFDFN | 6-XSON, SOT1115 (0.9x1) |
||
Nexperia USA Inc. |
IC BUFFER NON-INV DUAL LP X2SON6
|
pacchetto: 6-XDFN |
Azione4.048 |
|
2 | 1 | - | Push-Pull | 4mA, 4mA | 0.8 V ~ 3.6 V | -40°C ~ 125°C (TA) | Surface Mount | 6-XDFN | 6-X2SON (1.0x0.8) |
||
Nexperia USA Inc. |
IC BUFFER/LINEDVR 3ST XSON6
|
pacchetto: 6-XFDFN |
Azione5.376 |
|
1 | 1 | - | Push-Pull | 8mA, 8mA | 4.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 6-XFDFN | 6-XSON, SOT886 (1.45x1) |
||
Diodes Incorporated |
IC BUS BUFF TRI-ST DL X2-DFN1410
|
pacchetto: 8-XFDFN |
Azione7.008 |
|
2 | 1 | - | Push-Pull | 32mA, 32mA | 1.65 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-XFDFN | X2-DFN1410-8 |
||
Nexperia USA Inc. |
IC BUFF/DVR INVERT 8BIT 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione3.472 |
|
1 | 8 | - | Push-Pull | 6mA, 6mA | 4.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SO |
||
IDT, Integrated Device Technology Inc |
IC TRANSCVR TRI-ST 32BIT 96LFBGA
|
pacchetto: 96-LFBGA |
Azione6.672 |
|
4 | 8 | - | Push-Pull | 24mA, 24mA | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 96-LFBGA | 96-CABGA (13.5x5.5) |
||
Nexperia USA Inc. |
IC BUFF DVR TRI-ST DL 8TSSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione5.712 |
|
2 | 1 | - | Push-Pull | 8mA, 8mA | 4.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-TSSOP |
||
Texas Instruments |
IC TRANSCVR TRI-ST 18BIT 56SSOP
|
pacchetto: 56-BSSOP (0.295", 7.50mm Width) |
Azione7.328 |
|
2 | 9 | - | Push-Pull | 24mA, 24mA | 1.65 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 56-BSSOP (0.295", 7.50mm Width) | 56-SSOP |
||
Fairchild/ON Semiconductor |
IC BUFF TRI-ST DL UHS 8MICROPAK
|
pacchetto: 8-UFQFN |
Azione1.023.288 |
|
2 | 1 | - | Push-Pull | 32mA, 32mA | 1.65 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFQFN | 8-MicroPak? |
||
ON Semiconductor |
IC BUFFER TRIPLE NON-INVERT US8
|
pacchetto: 8-VFSOP (0.091", 2.30mm Width) |
Azione1.272.120 |
|
3 | 1 | - | Push-Pull | 32mA, 32mA | 1.65 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-VFSOP (0.091", 2.30mm Width) | US8 |
||
Diodes Incorporated |
IC GATE LOGIC X2-DFN1210-8
|
pacchetto: 8-XFDFN |
Azione6.256 |
|
2 | 1 | - | Push-Pull | 4mA, 4mA | 0.8 V ~ 3.6 V | -40°C ~ 125°C (TA) | Surface Mount | 8-XFDFN | X2-DFN1210-8 |
||
Nexperia USA Inc. |
IC BUFF HEX OPEN DRAIN 14SOIC
|
pacchetto: 14-SOIC (0.154", 3.90mm Width) |
Azione14.520 |
|
6 | 1 | - | Open Drain | -, 32mA | 1.2 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | 14-SO |
||
ON Semiconductor |
IC BUF NON-INVERT 3.6V 14SOIC
|
pacchetto: 14-SOIC (0.154", 3.90mm Width) |
Azione5.248 |
|
4 | 1 | - | 3-State | 12mA, 12mA | 2 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | 14-SOIC |
||
ON Semiconductor |
IC BUFFER INVERT 3.6V 48TSSOP
|
pacchetto: 48-TFSOP (0.240", 6.10mm Width) |
Azione6.416 |
|
4 | 4 | - | 3-State | 12mA, 12mA | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.240", 6.10mm Width) | 48-TSSOP |
||
ON Semiconductor |
IC TXRX NON-INVERT 3.6V 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione5.264 |
|
1 | 8 | - | 3-State | 32mA, 64mA | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
ON Semiconductor |
IC BUF NON-INVERT 5.5V SC70-5
|
pacchetto: 5-TSSOP, SC-70-5, SOT-353 |
Azione8.796 |
|
1 | 1 | - | 3-State | 32mA, 32mA | 1.65 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 5-TSSOP, SC-70-5, SOT-353 | SC-70-5 |