Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Supply Voltage | Number of Bits | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC LN RCVR DIFF 3.3V/5V 8-MLF
|
pacchetto: 8-VFDFN Exposed Pad, 8-MLF? |
Azione3.760 |
|
3 V ~ 5.5 V | - | -40°C ~ 85°C | Surface Mount | 8-VFDFN Exposed Pad, 8-MLF? | 8-MLF? (2x2) |
||
IDT, Integrated Device Technology Inc |
IC REGIST BUFF 25BIT DDR2 96-BGA
|
pacchetto: 96-LFBGA |
Azione6.496 |
|
1.7 V ~ 1.9 V | 25, 14 | 0°C ~ 70°C | Surface Mount | 96-LFBGA | 96-CABGA (13.5x5.5) |
||
IDT, Integrated Device Technology Inc |
IC BUFFER 13-26BIT SSTL 56VFQFPN
|
pacchetto: 56-VFQFN Exposed Pad |
Azione5.584 |
|
2.3 V ~ 2.7 V | 13, 26 | 0°C ~ 70°C | Surface Mount | 56-VFQFN Exposed Pad | 56-VFQFPN (8x8) |
||
IDT, Integrated Device Technology Inc |
IC BUFFER 1:1/1:2 96-LFBGA
|
pacchetto: 96-LFBGA |
Azione7.360 |
|
1.7 V ~ 1.9 V | 25, 14 | 0°C ~ 70°C | Surface Mount | 96-LFBGA | 96-CABGA (13.5x5.5) |
||
Texas Instruments |
IC IEEE STD 1284 TXRX 48TVSOP
|
pacchetto: 48-TFSOP (0.173", 4.40mm Width) |
Azione6.612 |
|
3 V ~ 3.6 V | 19 | 0°C ~ 70°C | Surface Mount | 48-TFSOP (0.173", 4.40mm Width) | 48-TVSOP |
||
Microchip Technology |
IC RCVR DIFF 3.3/5V 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione7.312 |
|
3.3V, 5V | 1 | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Texas Instruments |
IC REGISTERED TXRX 8BIT 52-QFP
|
pacchetto: 52-QFP |
Azione5.264 |
|
4.75 V ~ 5.25 V | 8 | 0°C ~ 70°C | Surface Mount | 52-QFP | 52-QFP (10x10) |
||
ON Semiconductor |
IC ADDER/SUBTR DUAL 2BIT 16-DIP
|
pacchetto: 16-DIP (0.300", 7.62mm) |
Azione9.216 |
|
- | 2 | 0°C ~ 75°C | Through Hole | 16-DIP (0.300", 7.62mm) | 16-DIP |
||
NXP |
IC BUFFER 1.8V 28BIT SOT802
|
pacchetto: 160-TFBGA |
Azione7.312 |
|
1.7 V ~ 2 V | 28 | 0°C ~ 70°C | Surface Mount | 160-TFBGA | 160-TFBGA (9x13) |
||
NXP |
IC BUFFER 1.8V 25BIT SOT536
|
pacchetto: 96-LFBGA |
Azione2.320 |
|
1.7 V ~ 2 V | 25, 14 | 0°C ~ 70°C | Surface Mount | 96-LFBGA | 96-LFBGA (13.5x5.5) |
||
NXP |
IC BUFFER 1.8V 28BIT SOT802-1
|
pacchetto: 160-TFBGA |
Azione5.232 |
|
1.7 V ~ 1.9 V | 28 | 0°C ~ 70°C | Surface Mount | 160-TFBGA | 160-TFBGA (9x13) |
||
Diodes Incorporated |
IC REG BUFFER 14BIT 48TVSOP
|
pacchetto: 48-TFSOP (0.173", 4.40mm Width) |
Azione5.168 |
|
2.3 V ~ 2.7 V | 14 | 0°C ~ 70°C | Surface Mount | 48-TFSOP (0.173", 4.40mm Width) | 48-TVSOP |
||
Microchip Technology |
IC LINE RCVR QUINT DIFF 28-PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione2.240 |
|
4.2 V ~ 5.5 V | 5 | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.5x11.5) |
||
Microchip Technology |
IC LINE RCVR QUINT DIFF 28-PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione3.520 |
|
4.2 V ~ 5.5 V | 5 | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.5x11.5) |
||
Microchip Technology |
IC RCVR DIFF 5V/3.3V 8-MSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione4.752 |
|
3.3V, 5V | 1 | -40°C ~ 85°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Microchip Technology |
IC RCVR AMP DIFF 3.3V-5V 10-MSOP
|
pacchetto: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
Azione5.408 |
|
3.3V, 5V | 1 | -40°C ~ 85°C | Surface Mount | 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) | 10-MSOP |
||
Microchip Technology |
IC RCVR DIFF 5V/3.3V 8-MSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione15.708 |
|
3.3V, 5V | 1 | -40°C ~ 85°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Texas Instruments |
IC REG TXRX LVTTL-GTLP 48-TVSOP
|
pacchetto: 48-TFSOP (0.173", 4.40mm Width) |
Azione18.528 |
|
3.15 V ~ 3.45 V | 8 | -40°C ~ 85°C | Surface Mount | 48-TFSOP (0.173", 4.40mm Width) | 48-TVSOP |
||
Texas Instruments |
IC TEST-BUS CONTROLLER 44-PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione15.156 |
|
4.5 V ~ 5.5 V | 16 | 0°C ~ 70°C | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.58x16.58) |
||
ON Semiconductor |
IC EQUALIZER RECEIVER 24-QFN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione10.788 |
|
1.71 V ~ 2.625 V | 1 | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
Texas Instruments |
IC SCAN TEST DEVICE 28-SSOP
|
pacchetto: 28-BSSOP (0.295", 7.50mm Width) |
Azione2.960 |
|
4.5 V ~ 5.5 V | 8 | -40°C ~ 85°C | Surface Mount | 28-BSSOP (0.295", 7.50mm Width) | 28-SSOP |
||
IDT, Integrated Device Technology Inc |
IC BUFFER DDR 13-26BIT 64-TSSOP
|
pacchetto: 64-TFSOP (0.240", 6.10mm Width) |
Azione2.736 |
|
2.3 V ~ 2.7 V | 13, 26 | 0°C ~ 70°C | Surface Mount | 64-TFSOP (0.240", 6.10mm Width) | 64-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC BUFFER DDR 13-26BIT 56VFQFPN
|
pacchetto: 56-VFQFN Exposed Pad |
Azione23.496 |
|
2.3 V ~ 2.7 V | 13, 26 | 0°C ~ 70°C | Surface Mount | 56-VFQFN Exposed Pad | 56-VFQFPN (8x8) |
||
Texas Instruments |
IC 4BIT BINARY FILL ADDER 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione3.536 |
|
4.5 V ~ 5.5 V | 4 | -55°C ~ 125°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Texas Instruments |
IC 4BIT BINARY FULL ADDER 16-DIP
|
pacchetto: 16-DIP (0.300", 7.62mm) |
Azione5.040 |
|
4.75 V ~ 5.25 V | 4 | 0°C ~ 70°C | Through Hole | 16-DIP (0.300", 7.62mm) | 16-PDIP |
||
Texas Instruments |
IC FULL ADDER 4BIT BIN 16-SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione4.464 |
|
4.5 V ~ 5.5 V | 4 | 0°C ~ 70°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Texas Instruments |
IC REGISTERED BUFFER 160-TFBGA
|
pacchetto: 160-TFBGA |
Azione7.792 |
|
1.7 V ~ 1.9 V | 28 | -40°C ~ 85°C | Surface Mount | 160-TFBGA | 160-NFBGA (9x13) |
||
Diodes Incorporated |
XO CLOCK
|
pacchetto: - |
Azione2.304 |
|
- | - | - | - | - | - |
||
Diodes Incorporated |
XO CLOCK
|
pacchetto: - |
Azione5.088 |
|
- | - | - | - | - | - |
||
Nexperia USA Inc. |
NXS0104PW/SOT402/TSSOP14
|
pacchetto: 14-TSSOP (0.173", 4.40mm Width) |
Azione51.840 |
|
1.65V ~ 5.5V | 4 | -40°C ~ 125°C | Surface Mount | 14-TSSOP (0.173", 4.40mm Width) | 14-TSSOP |