Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Size | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|
Xilinx Inc. |
IC PROM SERIAL 1K 20-PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione3.488 |
|
1Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC FLASH CONFIG 16M 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione5.536 |
|
16Mb | 2.97 V ~ 3.63 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC CONFIG SEEPROM 4M 3.3V 44TQFP
|
pacchetto: 44-TQFP |
Azione6.016 |
|
4Mb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 44-TQFP | 44-TQFP (10x10) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 64K 8LAP
|
pacchetto: 8-TDFN |
Azione2.192 |
|
64kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-TDFN | 8-LAP (6x6) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 1M 8LAP
|
pacchetto: 8-TDFN |
Azione4.800 |
|
1Mb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-TDFN | 8-LAP (6x6) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 1M 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione4.624 |
|
1Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM SER I-TEMP 3.3V 44-VQFP
|
pacchetto: 44-TQFP |
Azione20.532 |
|
1Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 44-TQFP | 44-VQFP (10x10) |
||
Xilinx Inc. |
IC PROM SER 30000 I-TEMP 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione4.016 |
|
300kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM SER 5000 I-TEMP 20-SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione5.024 |
|
150kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Xilinx Inc. |
IC PROM SER 10K 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione126.300 |
|
1Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Xilinx Inc. |
IC PROM SER I-TEMP 128K 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione5.680 |
|
128kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC SERIAL CONFIG PROM 128K 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione76.248 |
|
128kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM FPGA 256KB 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione7.056 |
|
256Kb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Altera |
IC CONFIG DEVICE 8MBIT 100QFP
|
pacchetto: 100-BQFP |
Azione55.980 |
|
8MB | 3 V ~ 3.6 V | -40°C ~ 85°C | 100-BQFP | 100-PQFP (14x20) |
||
Altera |
IC CONFIG DEVICE 1.6MBIT 32TQFP
|
pacchetto: 32-TQFP |
Azione3.984 |
|
1.6Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 32-TQFP | 32-TQFP (7x7) |
||
Altera |
IC CONFIG DEVICE 1MBIT 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione10.296 |
|
1Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM SERIAL 16MB 44-VQFN
|
pacchetto: 44-TQFP |
Azione2.880 |
|
16Mb | 3 V ~ 3.6 V | -55°C ~ 125°C (TJ) | 44-TQFP | 44-VQFP (10x10) |
||
Xilinx Inc. |
IC PROM REPROGR 4MB 44-VQFP
|
pacchetto: 44-TQFP |
Azione3.616 |
|
4Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 44-TQFP | 44-VQFP (10x10) |
||
Xilinx Inc. |
IC PROM SRL 1.8V 16M 48CSBGA
|
pacchetto: 48-TFBGA, CSPBGA |
Azione7.944 |
|
16Mb | 1.65 V ~ 2 V | -40°C ~ 85°C | 48-TFBGA, CSPBGA | 48-CSP (8x9) |
||
Xilinx Inc. |
IC PROM SRL CONFIG 512K 44-VQFP
|
pacchetto: 44-TQFP |
Azione184.248 |
|
512kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 44-TQFP | 44-VQFP (10x10) |
||
Altera |
IC CONFIG DEVICE 32MBIT 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione9.768 |
|
32Mb | 2.7 V ~ 3.6 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Altera |
IC QUAD-SERIAL LOW VOLTAGE CONFI
|
pacchetto: 24-TBGA |
Azione6.936 |
|
512MB | 1.7 V ~ 2 V | -40°C ~ 85°C | 24-TBGA | 24-FBGA (6x8) |
||
Xilinx Inc. |
IC PROM SRL 1.8V 8M GATE 48TSOP
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione113.772 |
|
8Mb | 1.65 V ~ 2 V | -40°C ~ 85°C | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
Microchip Technology |
IC FPGA EEPROM 512K ALTERA 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione6.032 |
|
512kb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM SRL FOR 1M GATE 20-TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione277.920 |
|
1Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Intel |
IC CONFIG DEVICE 1MBIT 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione324.000 |
|
1Mb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Intel |
IC CONFIG DEVICE 1MBIT 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione2.784 |
|
1Mb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Intel |
IC CONFIG DEVICE 1MBIT 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione7.872 |
|
212kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Intel |
IC QUAD-SERIAL LOW VOLTAGE CONFI
|
pacchetto: 24-TBGA |
Azione4.816 |
|
256MB | 1.7 V ~ 2 V | -40°C ~ 85°C | 24-TBGA | 24-FBGA (6x8) |
||
Intel |
IC CONFIG DEVICE 1.6MBIT 32TQFP
|
pacchetto: 32-TQFP |
Azione5.888 |
|
1.6Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 32-TQFP | 32-TQFP (7x7) |