Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Size | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|
Altera |
IC CONFIG DEVICE
|
pacchetto: 100-BQFP |
Azione3.776 |
|
8MB | 3 V ~ 3.6 V | 0°C ~ 70°C | 100-BQFP | 100-PQFP (14x20) |
||
Altera |
IC CONFIG DEVICE 100QFP
|
pacchetto: 100-BQFP |
Azione3.424 |
|
8MB | 3 V ~ 3.6 V | 0°C ~ 70°C | 100-BQFP | 100-PQFP (14x20) |
||
Altera |
IC CONFIG DEVICE 100QFP
|
pacchetto: 100-BQFP |
Azione7.472 |
|
4MB | 3 V ~ 3.6 V | 0°C ~ 70°C | 100-BQFP | 100-PQFP (14x20) |
||
Xilinx Inc. |
PROM 16M-BIT 3.3V 44CCC
|
pacchetto: 44-CCC (J-Lead) |
Azione23.568 |
|
16Mb | 3 V ~ 3.6 V | -55°C ~ 125°C (TC) | 44-CCC (J-Lead) | 44-CCCP (16.51x16.51) |
||
Xilinx Inc. |
IC PROM SERIAL 3.3V 200K 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.648 |
|
200kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Microchip Technology |
IC FLASH CONFIG 7MBIT 20-TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione3.104 |
|
7Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Microchip Technology |
IC FLASH CONFIG 4M 8LAP
|
pacchetto: 8-TDFN |
Azione6.944 |
|
4Mb | 2.97 V ~ 3.63 V | 0°C ~ 70°C | 8-TDFN | 8-LAP (6x6) |
||
Microchip Technology |
IC CONFIG SEEPROM 4M 3.3V 44TQFP
|
pacchetto: 44-TQFP |
Azione6.896 |
|
4Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 44-TQFP | 44-TQFP (10x10) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 64K 20-PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione5.584 |
|
64kb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 512K 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione6.736 |
|
512kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC SRL CONFIG EEPROM 512K 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione69.072 |
|
512kb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC SRL CONFIG EEPROM 1M 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione7.968 |
|
1Mb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM SER I-TEMP 3.3V 44-VQFP
|
pacchetto: 44-TQFP |
Azione32.016 |
|
4Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 44-TQFP | 44-VQFP (10x10) |
||
Xilinx Inc. |
IC PROM SER 4MBIT 3.3V 20-PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione29.100 |
|
4Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC PROM SER 500K 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione112.572 |
|
500kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Xilinx Inc. |
IC PROM SER 30000 C-TEMP 20-SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione7.136 |
|
300kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Xilinx Inc. |
IC PROM SER 5K 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione86.388 |
|
150kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Xilinx Inc. |
IC PROM SER 100000 C-TEMP 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione4.560 |
|
1Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM SER C-TEMP 1K 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione7.548 |
|
1Mb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC PROM SER CONF 2M 3.3V 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione6.464 |
|
2Mb | 3.15 V ~ 3.45 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC EEPROM FPGA 128KB 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione2.592 |
|
128kb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC SER CFG PROM 256K 3.3V 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione5.056 |
|
256Kb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC SERIAL CONFIG PROM 256K 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione32.124 |
|
256Kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM SERIAL CONFIG 65K 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione7.596 |
|
65kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Altera |
IC QUAD-SERIAL CONFIG DEVICE 512
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione6.512 |
|
512Mb | 2.7 V ~ 3.6 V | -40°C ~ 85°C | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Altera |
IC CONFIG DEVICE 1MBIT 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione4.048 |
|
1Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM SERIAL CONFIG 1M 20-PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione99.660 |
|
1Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
RE-PROGRAMMABLE 1MB PROM
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione4.832 |
|
1Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC CONFIG SEEPROM 1M 3.3V 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione101.868 |
|
1Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Intel |
IC CONFIG DEVICE
|
pacchetto: 88-LFBGA |
Azione4.832 |
|
16Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 88-LFBGA | 88-UBGA (11x8) |