Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC EEPROM 16KBIT 3MHZ 8MSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione2.464 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | SPI | 3MHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
ON Semiconductor |
IC EEPROM 2KBIT 400KHZ 8MSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione4.608 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I2C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Cypress Semiconductor Corp |
IC NVSRAM 64KBIT 55NS 28CDIP
|
pacchetto: 28-CDIP (0.300", 7.62mm) |
Azione13.080 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 64Kb (8K x 8) | Parallel | - | 55ns | 55ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TA) | Through Hole | 28-CDIP (0.300", 7.62mm) | 28-CDIP |
||
Micron Technology Inc. |
IC SDRAM 128MBIT 167MHZ 90VFBGA
|
pacchetto: 90-VFBGA |
Azione6.624 |
|
DRAM | SDRAM - Mobile LPDDR | 128Mb (4M x 32) | Parallel | 166MHz | 15ns | 5.0ns | 1.7 V ~ 1.95 V | -40°C ~ 105°C (TA) | Surface Mount | 90-VFBGA | 90-VFBGA (8x13) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 18MBIT 200MHZ 119BGA
|
pacchetto: 119-BGA |
Azione4.432 |
|
SRAM | SRAM - Synchronous ZBT | 18Mb (512K x 36) | Parallel | 200MHz | - | 3.2ns | 2.375 V ~ 2.625 V | -40°C ~ 85°C (TA) | Surface Mount | 119-BGA | 119-PBGA (14x22) |
||
Cypress Semiconductor Corp |
IC SRAM 72MBIT 250MHZ 165FBGA
|
pacchetto: 165-LBGA |
Azione5.968 |
|
SRAM | SRAM - Synchronous, QDR II | 72Mb (2M x 36) | Parallel | 250MHz | - | - | 1.7 V ~ 1.9 V | 0°C ~ 70°C (TA) | Surface Mount | 165-LBGA | 165-FBGA (15x17) |
||
ISSI, Integrated Silicon Solution Inc |
IC SRAM 256KBIT 70NS 28SOP
|
pacchetto: 28-SOP |
Azione47.028 |
|
SRAM | SRAM - Asynchronous | 256Kb (32K x 8) | Parallel | - | 70ns | 70ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 28-SOP | 28-SOP |
||
Microchip Technology |
IC FLASH 4MBIT 20MHZ 8SOIC
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione1.469.256 |
|
FLASH | FLASH | 4Mb (264 Bytes x 2048 pages) | SPI | 20MHz | 14ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
||
Microchip Technology |
IC FLASH 32MBIT 70NS 48CBGA
|
pacchetto: 48-TFBGA, CSPBGA |
Azione5.360 |
|
FLASH | FLASH | 32Mb (4M x 8, 2M x 16) | Parallel | - | 200µs | 70ns | 2.65 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 48-TFBGA, CSPBGA | 48-CBGA (6x8) |
||
STMicroelectronics |
IC SRAM 2MBIT 70NS 48TFBGA
|
pacchetto: 48-TFBGA |
Azione4.656 |
|
SRAM | SRAM - Asynchronous | 2Mb (128K x 16) | Parallel | - | 70ns | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFBGA | 48-TFBGA (7x12) |
||
Microchip Technology |
IC FLASH 1MBIT 55NS 32DIP
|
pacchetto: 32-DIP (0.600", 15.24mm) |
Azione2.288 |
|
FLASH | FLASH | 1Mb (128K x 8) | Parallel | - | 50µs | 55ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-DIP |
||
Microchip Technology |
IC OTP 4MBIT 150NS 32VSOP
|
pacchetto: 32-TFSOP (0.488", 12.40mm Width) |
Azione5.808 |
|
EPROM | EPROM - OTP | 4Mb (512K x 8) | Parallel | - | - | 150ns | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-TFSOP (0.488", 12.40mm Width) | 32-VSOP |
||
Microchip Technology |
IC EEPROM 1KBIT 400KHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione3.456 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I2C | 400kHz | 10ms | 900ns | 1.8 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Cypress Semiconductor Corp |
IC SRAM 72MBIT 633MHZ 165FBGA
|
pacchetto: 165-LBGA |
Azione6.896 |
|
SRAM | SRAM - Synchronous, DDR II+ | 72Mb (4M x 18) | Parallel | 633MHz | - | - | 1.7 V ~ 1.9 V | 0°C ~ 70°C (TA) | Surface Mount | 165-LBGA | 165-FBGA (13x15) |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 512MBIT 143MHZ 54BGA
|
pacchetto: 54-TFBGA |
Azione2.048 |
|
DRAM | SDRAM | 512Mb (32M x 16) | Parallel | 143MHz | - | 5.4ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 54-TFBGA | 54-TWBGA (13x8) |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 256MBIT 143MHZ 90BGA
|
pacchetto: 90-TFBGA |
Azione6.896 |
|
DRAM | SDRAM | 256Mb (32M x 8) | Parallel | 143MHz | - | 5.4ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 90-TFBGA | 90-TFBGA (8x13) |
||
Micron Technology Inc. |
IC FLASH 32GBIT 153VFBGA
|
pacchetto: - |
Azione3.904 |
|
FLASH | FLASH - NAND | 32Gb (4G x 8) | MMC | - | - | - | 2.7 V ~ 3.6 V | -25°C ~ 85°C (TA) | - | - | - |
||
STMicroelectronics |
IC EEPROM 512KBIT 5MHZ 8SO
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione6.624 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | SPI | 16MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-SO |
||
SII Semiconductor Corporation |
IC EEPROM 128KBIT 400KHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione481.344 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | I2C | 400kHz | 5ms | 900ns | 1.6 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Rohm Semiconductor |
IC EEPROM 256KBIT 400KHZ 8SOP
|
pacchetto: 8-SOIC (0.173", 4.40mm Width) |
Azione117.600 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | I2C | 400kHz | 5ms | - | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.173", 4.40mm Width) | 8-SOP |
||
Rohm Semiconductor |
IC EEPROM 512KBIT 1MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione4.096 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | I2C | 1MHz | 5ms | - | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP-B |
||
Rohm Semiconductor |
IC EEPROM 16KBIT 400KHZ 8TSSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione3.376 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | I2C | 400kHz | 5ms | - | 1.6 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-TSSOP-BJ |
||
Microchip Technology |
1.6-5.5V, 1MHZ, IND TMP, 8-UDFN
|
pacchetto: 8-UFDFN Exposed Pad |
Azione28.356 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I²C | 1MHz | 5ms | 450ns | 1.6 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
ON Semiconductor |
IC EEPROM 16K I2C 100KHZ 14SOIC
|
pacchetto: 14-SOIC (0.154", 3.90mm Width) |
Azione3.616 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | I²C | 100kHz | 10ms | 3.5µs | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | 14-SOIC |
||
Macronix |
IC FLASH SERIAL NOR 1GBIT
|
pacchetto: - |
Azione6.960 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Cypress Semiconductor Corp |
IC GATE NOR
|
pacchetto: - |
Azione3.264 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
ALL IN ONE MCP 544G
|
pacchetto: - |
Azione5.744 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
LPDDR4 8G DDP
|
pacchetto: - |
Azione7.440 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC SRAM 256K PARALLEL 84PLCC
|
pacchetto: 84-LCC (J-Lead) |
Azione7.808 |
|
SRAM | SRAM - Dual Port, Asynchronous | 256Kb (16K x 16) | Parallel | - | 25ns | 25ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 84-LCC (J-Lead) | 84-PLCC (29.21x29.21) |
||
Micron Technology Inc. |
IC DRAM 16G 1866MHZ
|
pacchetto: - |
Azione2.544 |
|
DRAM | SDRAM - Mobile LPDDR4 | 16Gb (512M x 32) | - | 1866MHz | - | - | 1.1V | -30°C ~ 85°C (TC) | - | - | - |