Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics |
IC FLASH 256MBIT 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione2.208 |
|
FLASH | FLASH - NOR | 256Mb (32M x 8) | SPI | 104MHz | 3ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Micron Technology Inc. |
IC FLASH 32MBIT 108MHZ 8SO
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione3.856 |
|
FLASH | FLASH - NOR | 32Mb (8M x 4) | SPI | 108MHz | 8ms, 5ms | - | 1.7 V ~ 2 V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP2 |
||
ISSI, Integrated Silicon Solution Inc |
IC SRAM 1MBIT 45NS 32SOP
|
pacchetto: 32-SOIC (0.450", 11.40mm Width) |
Azione23.280 |
|
SRAM | SRAM - Asynchronous | 1Mb (128K x 8) | Parallel | - | 45ns | 45ns | 2.3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 32-SOIC (0.450", 11.40mm Width) | 32-SOP |
||
Micron Technology Inc. |
IC SDRAM 16GBIT 400MHZ FBGA
|
pacchetto: 253-TFBGA |
Azione4.800 |
|
DRAM | SDRAM - Mobile LPDDR2 | 16Gb (256M x 64) | Parallel | 400MHz | - | - | 1.14 V ~ 1.3 V | -30°C ~ 85°C (TC) | Surface Mount | 253-TFBGA | 253-FBGA (11x11) |
||
Micron Technology Inc. |
IC FLASH/LPDRAM 1.5GBIT 107TFBGA
|
pacchetto: 107-TFBGA |
Azione36.000 |
|
FLASH, RAM | FLASH - NAND, Mobile LPDRAM | 1Gb (64M x 16)(NAND), 512Mb (32M x 16)(LPDRAM) | Parallel | 200MHz | - | - | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 107-TFBGA | 107-TFBGA |
||
IDT, Integrated Device Technology Inc |
IC SRAM 4.5MBIT 8.5NS 165CABGA
|
pacchetto: 165-TBGA |
Azione6.992 |
|
SRAM | SRAM - Synchronous ZBT | 4.5Mb (256K x 18) | Parallel | - | - | 8.5ns | 3.135 V ~ 3.465 V | 0°C ~ 70°C (TA) | Surface Mount | 165-TBGA | 165-CABGA (13x15) |
||
Micron Technology Inc. |
IC SDRAM 256MBIT 166MHZ 90VFBGA
|
pacchetto: 90-VFBGA |
Azione3.056 |
|
DRAM | SDRAM | 256Mb (8M x 32) | Parallel | 166MHz | 12ns | 5.5ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 90-VFBGA | 90-VFBGA (8x13) |
||
Cypress Semiconductor Corp |
IC SRAM 144KBIT 15NS 80TQFP
|
pacchetto: 80-LQFP |
Azione4.992 |
|
SRAM | SRAM - Dual Port, Asynchronous | 144Kb (16K x 9) | Parallel | - | 15ns | 15ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 80-LQFP | 80-TQFP (14x14) |
||
Microchip Technology |
IC FLASH 1MBIT 70NS 32DIP
|
pacchetto: 32-DIP (0.600", 15.24mm) |
Azione4.240 |
|
FLASH | FLASH | 1Mb (128K x 8) | Parallel | - | 50µs | 70ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-DIP |
||
Microchip Technology |
IC FLASH 1MBIT 120NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione7.392 |
|
FLASH | FLASH | 1Mb (128K x 8) | Parallel | - | 50µs | 120ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
IDT, Integrated Device Technology Inc |
IC SRAM 512KBIT 55NS 84PGA
|
pacchetto: 84-BPGA |
Azione6.880 |
|
SRAM | SRAM - Dual Port, Asynchronous | 512Kb (64K x 8) | Parallel | - | 55ns | 55ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 84-BPGA | 84-PGA (27.94x27.94) |
||
Micron Technology Inc. |
IC FLASH 256GBIT 169VFBGA
|
pacchetto: 169-VFBGA |
Azione5.328 |
|
FLASH | FLASH - NAND | 256Gb (32G x 8) | MMC | - | - | - | 1.65 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 169-VFBGA | 169-VFBGA (14x18) |
||
Cypress Semiconductor Corp |
IC FLASH MEMORY 48TSOP
|
pacchetto: - |
Azione5.248 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
IC FLASH 4GBIT 63VFBGA
|
pacchetto: - |
Azione6.112 |
|
FLASH | FLASH - NAND | 4Gb (512M x 8) | Parallel | - | - | - | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | - | - | - |
||
Alliance Memory, Inc. |
IC SRAM 1MBIT 12NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione2.112 |
|
SRAM | SRAM - Asynchronous | 1Mb (128K x 8) | Parallel | - | 12ns | 12ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP I (8x18.4) |
||
Cypress Semiconductor Corp |
IC FLASH 16MBIT 108MHZ 24BGA
|
pacchetto: 24-TBGA |
Azione20.112 |
|
FLASH | FLASH - NOR | 16Mb (2M x 8) | SPI - Quad I/O | 108MHz | 3ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 24-TBGA | 24-BGA (6x8) |
||
Renesas Electronics America |
IC SRAM IBIS ASYNC
|
pacchetto: 44-TSOP (0.400", 10.16mm Width) |
Azione7.920 |
|
SRAM | SRAM | 4Mb (256K x 16) | Parallel | - | 12ns | 12ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP II |
||
Alliance Memory, Inc. |
IC DRAM 4G PARALLEL 78FBGA
|
pacchetto: 78-VFBGA |
Azione4.656 |
|
DRAM | SDRAM - DDR3 | 4Gb (512M x 8) | Parallel | 800MHz | 15ns | 20ns | 1.425 V ~ 1.575 V | -40°C ~ 95°C (TC) | Surface Mount | 78-VFBGA | 78-FBGA (10.5x9) |
||
Microchip Technology |
8K 1KX8 2.5V SERIAL EE IND
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.640 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | I²C | 400kHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
BYTe Semiconductor |
32 MBIT, 3.0V (2.7V TO 3.6V), -4
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 32Mbit | SPI - Quad I/O | 108 MHz | 60µs, 4ms | 7 ns | 2.7V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
||
Micron Technology Inc. |
EMCP1056GB254/432
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
LPDDR5 32G 512MX64 FBGA QDP
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR5 | 32Gbit | Parallel | 3.2 GHz | - | - | - | -40°C ~ 125°C | Surface Mount | 441-TFBGA | 441-TFBGA (14x14) |
||
Winbond Electronics |
2GB LPDDR4, DDP, X32, 1600MHZ, -
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR4 | 2Gbit | LVSTL_11 | 1.6 GHz | 18ns | 3.6 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | Surface Mount | 200-TFBGA | 200-TFBGA (10x14.5) |
||
ISSI, Integrated Silicon Solution Inc |
IC FLASH 128MBIT PAR 24VFBGA
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR | 128Mbit | Parallel | 100 MHz | - | 96 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 24-VBGA | 24-VFBGA (6x8) |
||
Winbond Electronics |
RPMC SPIFLASH, 3V, 256M-BIT, DRV
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 256Mbit | SPI - Quad I/O | 133 MHz | 3ms | 7 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (8x6) |
||
Infineon Technologies |
STD SPI
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 512Mbit | SPI - Quad I/O | 66 MHz | 750µs | 6.5 ns | 2.7V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount | 24-TBGA | 24-BGA (8x6) |
||
Cypress Semiconductor Corp |
IC SRAM 1MBIT PARALLEL 44TSOP II
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM - Asynchronous | 1Mbit | Parallel | - | 10ns | 10 ns | 3V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP II |
||
Winbond Electronics |
IC FLASH 1GBIT SPI/QUAD 8WSON
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR | 1Gbit | SPI - Quad I/O, QPI | 133 MHz | 3ms | 7 ns | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (8x6) |