Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Cypress Semiconductor Corp |
NOR
|
pacchetto: - |
Azione7.024 |
|
FLASH | FLASH - NOR | 128Mb (16M x 8) | Parallel | - | 60ns | 100ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | - | - | - |
||
Micron Technology Inc. |
IC FLASH 128MBIT 70NS 64TBGA
|
pacchetto: 64-TBGA |
Azione2.100 |
|
FLASH | FLASH - NOR | 128Mb (16M x 8, 8M x 16) | Parallel | - | 70ns | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 64-TBGA | 64-TBGA (10x13) |
||
Micron Technology Inc. |
IC FLASH 64GBIT 153WFBGA
|
pacchetto: 153-WFBGA |
Azione3.824 |
|
FLASH | FLASH - NAND | 64Gb (8G x 8) | MMC | - | - | - | 2.7 V ~ 3.6 V | -25°C ~ 85°C (TA) | Surface Mount | 153-WFBGA | 153-WFBGA (11.5x13) |
||
Microchip Technology |
IC FLASH 2MBIT 45NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione4.032 |
|
FLASH | FLASH | 2Mb (256K x 8) | Parallel | - | 20µs | 45ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Cypress Semiconductor Corp |
IC NVSRAM 256KBIT 25NS 32SOIC
|
pacchetto: 32-SOIC (0.295", 7.50mm Width) |
Azione4.016 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 256Kb (32K x 8) | Parallel | - | 25ns | 25ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 32-SOIC (0.295", 7.50mm Width) | 32-SOIC |
||
Micron Technology Inc. |
IC FLASH 1GBIT 35NS 63VFBGA
|
pacchetto: 63-VFBGA |
Azione5.664 |
|
FLASH | FLASH - NAND | 1Gb (64M x 16) | Parallel | - | - | - | 1.7 V ~ 1.95 V | 0°C ~ 70°C (TA) | Surface Mount | 63-VFBGA | 63-VFBGA |
||
IDT, Integrated Device Technology Inc |
IC SRAM 9MBIT 7.5NS 100TQFP
|
pacchetto: 100-LQFP |
Azione2.592 |
|
SRAM | SRAM - Synchronous | 9Mb (256K x 36) | Parallel | 117MHz | - | 7.5ns | 3.135 V ~ 3.465 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
Cypress Semiconductor Corp |
IC SRAM 36MBIT 250MHZ 100LQFP
|
pacchetto: 100-LQFP |
Azione3.712 |
|
SRAM | SRAM - Synchronous | 36Mb (1M x 36) | Parallel | 250MHz | - | 2.6ns | 2.375 V ~ 2.625 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x20) |
||
Micron Technology Inc. |
IC FLASH 2GBIT 48TSOP
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione4.480 |
|
FLASH | FLASH - NAND | 2Gb (256M x 8) | Parallel | - | - | - | 1.7 V ~ 1.95 V | 0°C ~ 70°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP I |
||
Micron Technology Inc. |
IC SDRAM 512MBIT 133MHZ 66TSOP
|
pacchetto: 66-TSSOP (0.400", 10.16mm Width) |
Azione5.616 |
|
DRAM | SDRAM - DDR | 512Mb (64M x 8) | Parallel | 133MHz | 15ns | 750ps | 2.3 V ~ 2.7 V | 0°C ~ 70°C (TA) | Surface Mount | 66-TSSOP (0.400", 10.16mm Width) | 66-TSOP |
||
Microchip Technology |
IC EEPROM 1KBIT 2MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione4.896 |
|
EEPROM | EEPROM | 1Kb (128 x 8 , 64 x 16) | SPI | 2MHz | 10ms | - | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC FLASH 2MBIT 55NS 32VSOP
|
pacchetto: 32-TFSOP (0.488", 12.40mm Width) |
Azione4.448 |
|
FLASH | FLASH | 2Mb (256K x 8) | Parallel | - | 50µs | 55ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-TFSOP (0.488", 12.40mm Width) | 32-VSOP |
||
Cypress Semiconductor Corp |
IC SRAM 1MBIT 70NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione10.860 |
|
SRAM | SRAM - Asynchronous | 1Mb (128K x 8) | Parallel | - | 70ns | 70ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP I |
||
IDT, Integrated Device Technology Inc |
IC SRAM 16KBIT 35NS 48LCC
|
pacchetto: 48-LCC |
Azione3.392 |
|
SRAM | SRAM - Dual Port, Asynchronous | 16Kb (2K x 8) | Parallel | - | 35ns | 35ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TA) | Surface Mount | 48-LCC | 48-LCC (14.22x14.22) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 256KBIT 35NS 28CDIP
|
pacchetto: 28-CDIP (0.600", 15.24mm) |
Azione4.320 |
|
SRAM | SRAM - Asynchronous | 256Kb (32K x 8) | Parallel | - | 35ns | 35ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TA) | Through Hole | 28-CDIP (0.600", 15.24mm) | 28-CerDip |
||
IDT, Integrated Device Technology Inc |
IC SRAM 128KBIT 20NS 64TQFP
|
pacchetto: 64-LQFP |
Azione7.648 |
|
SRAM | SRAM - Dual Port, Asynchronous | 128Kb (16K x 8) | Parallel | - | 20ns | 20ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 64-LQFP | 64-TQFP (14x14) |
||
Cypress Semiconductor Corp |
IC NVSRAM 1MBIT 25NS 48FBGA
|
pacchetto: 48-TFBGA |
Azione5.008 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 1Mb (128K x 8) | Parallel | - | 25ns | 25ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFBGA | 48-FBGA (6x10) |
||
Everspin Technologies Inc. |
IC MRAM 1MBIT 35NS 44TSOP
|
pacchetto: 44-TSOP (0.400", 10.16mm Width) |
Azione6.864 |
|
RAM | MRAM (Magnetoresistive RAM) | 1Mb (64K x 16) | Parallel | - | 35ns | 35ns | 3 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP2 |
||
IDT, Integrated Device Technology Inc |
IC SRAM 8KBIT 55NS 52PLCC
|
pacchetto: 52-LCC (J-Lead) |
Azione7.520 |
|
SRAM | SRAM - Dual Port, Asynchronous | 8Kb (1K x 8) | Parallel | - | 55ns | 55ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 52-LCC (J-Lead) | 52-PLCC (19.13x19.13) |
||
Alliance Memory, Inc. |
IC SDRAM 128MBIT 200MHZ 60BGA
|
pacchetto: 60-TFBGA |
Azione2.880 |
|
DRAM | SDRAM - DDR | 128Mb (8M x 16) | Parallel | 200MHz | 15ns | 700ps | 2.3 V ~ 2.7 V | 0°C ~ 70°C (TA) | Surface Mount | 60-TFBGA | 60-TFBGA (13x8) |
||
Microchip Technology |
IC EEPROM 8KBIT 10MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione5.872 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | SPI | 10MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC FLASH 8MBIT 70NS 48WFBGA
|
pacchetto: 48-WFBGA |
Azione5.904 |
|
FLASH | FLASH | 8Mb (512K x 16) | Parallel | - | 10µs | 70ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-WFBGA | 48-WFBGA (6x4) |
||
Rohm Semiconductor |
IC EEPROM 64KBIT 400KHZ 8VSON
|
pacchetto: 8-UFDFN Exposed Pad |
Azione3.376 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | I2C | 400kHz | 5ms | - | 1.6 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | VSON008X2030 |
||
Microchip Technology |
IC EEPROM 256KBIT 10MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione14.934 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | SPI | 10MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 1K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione5.056 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I²C | 400kHz | 5ms | 3500ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Maxim Integrated |
IC EEPROM 4K 1WIRE 6TDFN
|
pacchetto: 6-WDFN Exposed Pad |
Azione5.968 |
|
EEPROM | EEPROM | 4Kb (256 x 16) | 1-Wire® | - | - | 2µs | 1.71 V ~ 1.89 V | -40°C ~ 85°C (TA) | Surface Mount | 6-WDFN Exposed Pad | 6-TDFN-EP (3x3) |
||
Macronix |
IC FLASH SERIAL NOR 1G 16SOP
|
pacchetto: - |
Azione6.864 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Macronix |
IC FLASH 128MBIT
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione2.976 |
|
FLASH | FLASH - NOR | 128Mb (16M x 8) | SPI | 104MHz | 300µs, 5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOP |
||
Cypress Semiconductor Corp |
IC FLASH 16M PARALLEL 64FBGA
|
pacchetto: 64-LBGA |
Azione3.040 |
|
FLASH | FLASH - NOR | 16Mb (2M x 8, 1M x 16) | Parallel | - | 70ns | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 64-LBGA | 64-FBGA (13x11) |
||
Macronix |
IC FLASH 512M SPI 166MHZ 8WSON
|
pacchetto: 8-WDFN Exposed Pad |
Azione20.904 |
|
FLASH | FLASH - NOR | 512Mb (64M x 8) | SPI - Quad I/O, QPI, DTR | 166MHz | 60µs, 750µs | - | 1.65V ~ 2V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (8x6) |