Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 64MBIT 166MHZ 60BGA
|
pacchetto: 60-TFBGA |
Azione3.344 |
|
DRAM | SDRAM - Mobile DDR | 64Mb (4M x 16) | Parallel | 166MHz | 15ns | 5.5ns | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 60-TFBGA | 60-TFBGA (8x10) |
||
Winbond Electronics |
IC FLASH 32MBIT 70NS 48TFBGA
|
pacchetto: 48-TFBGA |
Azione7.024 |
|
FLASH | FLASH - NOR | 32Mb (4M x 8, 2M x 16) | Parallel | - | 70ns | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFBGA | 48-TFBGA (6x8) |
||
Cypress Semiconductor Corp |
IC SRAM 72MBIT 200MHZ 165FBGA
|
pacchetto: 165-LBGA |
Azione4.128 |
|
SRAM | SRAM - Synchronous | 72Mb (2M x 36) | Parallel | 200MHz | - | 3ns | 3.135 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 165-LBGA | 165-FBGA (15x17) |
||
Cypress Semiconductor Corp |
IC SRAM 1MBIT 12NS 44SOJ
|
pacchetto: 44-BSOJ (0.400", 10.16mm Width) |
Azione2.768 |
|
SRAM | SRAM - Asynchronous | 1Mb (64K x 16) | Parallel | - | 12ns | 12ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 44-BSOJ (0.400", 10.16mm Width) | 44-SOJ |
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Microchip Technology |
IC FLASH 1MBIT 70NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione6.416 |
|
FLASH | FLASH | 1Mb (128K x 8) | Parallel | - | 50µs | 70ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
IDT, Integrated Device Technology Inc |
IC SRAM 256KBIT 9NS 100TQFP
|
pacchetto: 100-LQFP |
Azione7.040 |
|
SRAM | SRAM - Dual Port, Synchronous | 256Kb (32K x 8) | Parallel | - | - | 9ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 144KBIT 35NS 68PLCC
|
pacchetto: 68-LCC (J-Lead) |
Azione2.288 |
|
SRAM | SRAM - Dual Port, Asynchronous | 144Kb (16K x 9) | Parallel | - | 35ns | 35ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 68-LCC (J-Lead) | 68-PLCC (24.21x24.21) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 256KBIT 55NS 80TQFP
|
pacchetto: 80-LQFP |
Azione4.704 |
|
SRAM | SRAM - Dual Port, Asynchronous | 256Kb (32K x 8) | Parallel | - | 55ns | 55ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 80-LQFP | 80-TQFP (14x14) |
||
Micron Technology Inc. |
IC SDRAM 8GBIT 933MHZ FBGA
|
pacchetto: - |
Azione2.080 |
|
DRAM | SDRAM - Mobile LPDDR3 | 8Gb (256M x 32) | - | 933MHz | - | - | 1.2V | -30°C ~ 85°C (TC) | - | - | - |
||
Cypress Semiconductor Corp |
ASYNC SRAMS
|
pacchetto: - |
Azione6.368 |
|
SRAM | SRAM - Asynchronous | 4Mb (256K x 16) | Parallel | - | 10ns | 10ns | 2.2 V ~ 3.6 V | -40°C ~ 85°C (TA) | - | - | - |
||
ISSI, Integrated Silicon Solution Inc |
IC SRAM 4.5MBIT 7.5NS 100TQFP
|
pacchetto: 100-LQFP |
Azione4.016 |
|
SRAM | SRAM - Synchronous | 4.5Mb (128K x 36) | Parallel | 117MHz | - | 7.5ns | 3.135 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | 100-LQFP (14x20) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 4MBIT 10NS 44TSOP
|
pacchetto: 44-TSOP (0.400", 10.16mm Width) |
Azione4.384 |
|
SRAM | SRAM - Asynchronous | 4Mb (512K x 8) | Parallel | - | 10ns | 10ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP II |
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Cypress Semiconductor Corp |
NOR
|
pacchetto: - |
Azione5.600 |
|
FLASH | FLASH - NOR | 64Mb (8M x 8) | SPI - Quad I/O, QPI | 80MHz | - | - | 1.7 V ~ 2 V | -40°C ~ 125°C (TA) | - | - | - |
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STMicroelectronics |
IC EEPROM 512KBIT 5MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione5.008 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | SPI | 16MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC FLASH 2MBIT 55NS 48TSOP
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione2.848 |
|
FLASH | FLASH | 2Mb (128K x 16) | Parallel | - | 20µs | 55ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
Rohm Semiconductor |
IC EEPROM 8KBIT 5MHZ 8SO
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione3.504 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | SPI | 5MHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SO |
||
Cypress Semiconductor Corp |
IC FLASH 1GBIT 100NS 64BGA
|
pacchetto: 64-LBGA |
Azione8.448 |
|
FLASH | FLASH - NOR | 1Gb (128M x 8) | Parallel | - | 60ns | 100ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 64-LBGA | 64-FBGA (9x9) |
||
Microchip Technology |
IC EEPROM 8KBIT 400KHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione15.564 |
|
EEPROM | EEPROM | 8Kb (256 x 8 x 4) | I2C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Everspin Technologies Inc. |
IC MRAM 4MBIT 35NS 48FBGA
|
pacchetto: 48-LFBGA |
Azione5.168 |
|
RAM | MRAM (Magnetoresistive RAM) | 4Mb (256K x 16) | Parallel | - | 35ns | 35ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-LFBGA | 48-FBGA (8x8) |
||
Cypress Semiconductor Corp |
IC FLASH 256M PARALLEL 56TSOP
|
pacchetto: 56-TFSOP (0.724", 18.40mm Width) |
Azione3.568 |
|
FLASH | FLASH - NOR | 256Mb (32M x 8) | Parallel | - | 110ns | 110ns | 1.65 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 56-TFSOP (0.724", 18.40mm Width) | 56-TSOP |
||
Maxim Integrated |
IC EEPROM 2K 1WIRE 6TDFN
|
pacchetto: 6-WFDFN Exposed Pad |
Azione6.128 |
|
EEPROM | EEPROM | 2Kb (2K x 1) | 1-Wire® | - | - | - | 2.97 V ~ 3.63 V | -40°C ~ 85°C (TA) | Surface Mount | 6-WFDFN Exposed Pad | 6-TDFN-EP (3x3) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 32K PARALLEL 64TQFP
|
pacchetto: 64-LQFP |
Azione5.472 |
|
SRAM | SRAM - Dual Port, Asynchronous | 32Kb (4K x 8) | Parallel | - | 55ns | 55ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP | 64-TQFP (14x14) |
||
Winbond Electronics |
IC FLASH 64MBIT SPI/QUAD 8SOIC
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR | 64Mbit | SPI - Quad I/O, QPI, DTR | 133 MHz | 3ms | 6 ns | 1.7V ~ 1.95V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
||
Renesas Electronics Corporation |
IC FLASH 16MBIT SPI/QUAD 8WLCSP
|
pacchetto: - |
Azione14.424 |
|
FLASH | FLASH - NOR | 16Mbit | SPI - Quad I/O | 133 MHz | 12µs, 8ms | - | 1.65V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 8-XFBGA, WLCSP | 8-WLCSP (1.77x1.74) |
||
Winbond Electronics |
IC DRAM 1GBIT HSUL 12 178VFBGA
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR3 | 1Gbit | HSUL_12 | 800 MHz | 15ns | 5.5 ns | 1.14V ~ 1.3V, 1.7V ~ 1.95V | -40°C ~ 85°C (TC) | Surface Mount | 178-VFBGA | 178-VFBGA (11x11.5) |
||
BYTe Semiconductor |
8 MBIT, 3.0V (2.7V TO 3.6V), -40
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 8Mbit | SPI - Quad I/O | 120 MHz | 55µs, 2ms | 7 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 8-XFDFN Exposed Pad | 8-USON (2x3) |
||
Rohm Semiconductor |
IC EEPROM 128KBIT I2C 1MHZ 8SOP
|
pacchetto: - |
Azione795 |
|
EEPROM | EEPROM | 128Kbit | I2C | 1 MHz | 3.5ms | - | 1.7V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.173", 4.40mm Width) | 8-SOP |
||
Micron Technology Inc. |
LPDDR5 96G 1.5GX64 FBGA
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR5 | 96Gbit | - | 3.2 GHz | - | - | - | -25°C ~ 85°C | Surface Mount | 441-TFBGA | 441-TFBGA (14x14) |
||
onsemi |
IC EEPROM 2KBIT MICROWIRE 8SOIC
|
pacchetto: - |
Request a Quote |
|
EEPROM | EEPROM | 2Kbit | Microwire | 2 MHz | - | 250 ns | 2.5V ~ 5.5V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Fujitsu Semiconductor Memory Solution |
IC FRAM 4MBIT SPI 50MHZ 8DFN
|
pacchetto: - |
Request a Quote |
|
FRAM | FRAM (Ferroelectric RAM) | 4Mbit | SPI | 50 MHz | - | - | 1.7V ~ 1.95V | -40°C ~ 125°C (TA) | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (5x6) |