Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Micron Technology Inc. |
IC SDRAM 512MBIT 167MHZ 54VFBGA
|
pacchetto: 54-VFBGA |
Azione108.732 |
|
DRAM | SDRAM - Mobile LPSDR | 512Mb (32M x 16) | Parallel | 166MHz | 15ns | 5ns | 1.7 V ~ 1.95 V | 0°C ~ 70°C (TA) | Surface Mount | 54-VFBGA | 54-VFBGA (6x9) |
||
Micron Technology Inc. |
IC FLASH 128MBIT 50MHZ 16SO
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione2.608 |
|
FLASH | FLASH - NOR | 128Mb (16M x 8) | SPI | 50MHz | 15ms, 7ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SO W |
||
ISSI, Integrated Silicon Solution Inc |
IC SRAM 4MBIT 55NS 48MINIBGA
|
pacchetto: 48-TFBGA |
Azione5.312 |
|
SRAM | SRAM - Asynchronous | 4Mb (256K x 16) | Parallel | - | 55ns | 55ns | 2.5 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFBGA | 48-miniBGA (6x8) |
||
Cypress Semiconductor Corp |
IC SRAM 256KBIT 70NS 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione2.048 |
|
SRAM | SRAM - Asynchronous | 256Kb (32K x 8) | Parallel | - | 70ns | 70ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 512MBIT 143MHZ 54TSOP
|
pacchetto: 54-TSOP (0.400", 10.16mm Width) |
Azione5.536 |
|
DRAM | SDRAM | 512Mb (32M x 16) | Parallel | 143MHz | - | 5.4ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 54-TSOP (0.400", 10.16mm Width) | 54-TSOP II |
||
Cypress Semiconductor Corp |
NOR
|
pacchetto: - |
Azione7.936 |
|
FLASH | FLASH - NOR | 128Mb (8M x 16) | Parallel | - | 60ns | 60ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | - | - | - |
||
Cypress Semiconductor Corp |
IC FLASH 256MBIT 133MHZ 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione2.960 |
|
FLASH | FLASH - NOR | 256Mb (32M x 8) | SPI - Quad I/O, QPI | 133MHz | - | - | 1.7 V ~ 2 V | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Cypress Semiconductor Corp |
MICROPOWER SRAMS
|
pacchetto: - |
Azione6.416 |
|
SRAM | SRAM - Asynchronous | 1Mb (64K x 16) | Parallel | - | 70ns | 70ns | 1.65 V ~ 1.95V | -40°C ~ 85°C (TA) | - | - | - |
||
Alliance Memory, Inc. |
IC SRAM 1MBIT 12NS 32SOJ
|
pacchetto: 32-BSOJ (0.300", 7.62mm Width) |
Azione4.336 |
|
SRAM | SRAM - Asynchronous | 1Mb (128K x 8) | Parallel | - | 12ns | 12ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 32-BSOJ (0.300", 7.62mm Width) | 32-SOJ |
||
Macronix |
IC FLASH 4MBIT 55NS 48TSOP
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione7.264 |
|
FLASH | FLASH - NOR | 4Mb (512K x 8) | Parallel | - | 55ns | 55ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
Winbond Electronics |
IC FLASH 8MBIT 104MHZ 8VSOP
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.592 |
|
FLASH | FLASH - NOR | 8Mb (1M x 8) | SPI | 104MHz | 3ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-VSOP |
||
Rohm Semiconductor |
IC EEPROM 1KBIT 400KHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione16.464 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I2C | 400kHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-DIP |
||
STMicroelectronics |
IC EEPROM 256KBIT 1MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.160 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | I2C | 1MHz | 5ms | 450ns | 1.8 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SO |
||
Microchip Technology |
IC FLASH 64MBIT 70NS 48TSOP
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione103.440 |
|
FLASH | FLASH | 64Mb (4M x 16) | Parallel | - | 10µs | 70ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
Micron Technology Inc. |
IC FLASH 8G SPI TBGA
|
pacchetto: - |
Azione5.856 |
|
FLASH | FLASH - NAND | 8Gb (8G x 1) | SPI | - | - | - | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | - | - | - |
||
Cypress Semiconductor Corp |
IC FLASH 128M PARALLEL 56TSOP
|
pacchetto: 56-TFSOP (0.724", 18.40mm Width) |
Azione5.648 |
|
FLASH | FLASH - NOR | 128Mb (8M x 16) | Parallel | - | 70ns | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 56-TFSOP (0.724", 18.40mm Width) | 56-TSOP |
||
Cypress Semiconductor Corp |
IC SRAM 8M PARALLEL 44TSOP II
|
pacchetto: 44-TSOP (0.400", 10.16mm Width) |
Azione6.880 |
|
SRAM | SRAM - Asynchronous | 8Mb (1M x 8) | Parallel | - | 12ns | 12ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP II |
||
Cypress Semiconductor Corp |
IC NOR
|
pacchetto: - |
Azione5.728 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Winbond Electronics |
IC DRAM 256M PARALLEL 90VFBGA
|
pacchetto: 90-TFBGA |
Azione2.288 |
|
DRAM | SDRAM - Mobile LPDDR | 256Mb (8M x 32) | Parallel | 200MHz | 15ns | 5ns | 1.7V ~ 1.95V | -25°C ~ 85°C (TC) | Surface Mount | 90-TFBGA | 90-VFBGA (8x13) |
||
Everspin Technologies Inc. |
LINEAR IC'S
|
pacchetto: - |
Request a Quote |
|
RAM | MRAM (Magnetoresistive RAM) | 1Gbit | Parallel | 667 MHz | 15ns | 18 ns | 1.14V ~ 1.26V | 0°C ~ 85°C (TC) | Surface Mount | 96-TFBGA | 96-BGA (10x13) |
||
Winbond Electronics |
IC DRAM 512MBIT HSUL 12 134VFBGA
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR2-S4B | 512Mbit | HSUL_12 | 533 MHz | 15ns | - | 1.14V ~ 1.3V, 1.7V ~ 1.95V | -25°C ~ 85°C (TC) | Surface Mount | 134-VFBGA | 134-VFBGA (10x11.5) |
||
Infineon Technologies |
IC FLASH 512MBIT SPI/QUAD 8WSON
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 512Mbit | SPI - Quad I/O, QPI | 133 MHz | - | - | 1.7V ~ 2V | -40°C ~ 105°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x8) |
||
Microchip Technology |
IC EEPROM 4KBIT I2C 1MHZ 8TSSOP
|
pacchetto: - |
Request a Quote |
|
EEPROM | EEPROM | 4Kbit | I2C | 1 MHz | - | - | 2.5V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Micron Technology Inc. |
LPDDR5 64G 1GX64 FBGA 8DP
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR5 | 64Gbit | Parallel | 3.2 GHz | - | - | 1.05V | -40°C ~ 95°C | Surface Mount | 441-TFBGA | 441-TFBGA (14x14) |
||
Etron Technology, Inc. |
IC DRAM 1GBIT PARALLEL 84FBGA
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - DDR2 | 1Gbit | Parallel | 400 MHz | 15ns | 400 ps | 1.7V ~ 1.9V | 0°C ~ 85°C (TC) | Surface Mount | 84-TFBGA | 84-FBGA (8x12.5) |
||
ISSI, Integrated Silicon Solution Inc |
IC FLASH 16MBIT SPI/QUAD 8WSON
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR | 16Mbit | SPI - Quad I/O, QPI, DTR | 133 MHz | 800µs | - | 2.3V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (8x6) |
||
Rohm Semiconductor |
512KBIT, SPI BUS, SERIAL EEPROM
|
pacchetto: - |
Request a Quote |
|
EEPROM | EEPROM | 512Kbit | SPI | 20 MHz | 3.5ms | 20 ns | 1.7V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-VSSOP, 8-MSOP (0.110", 2.80mm Width) | 8-MSOP |
||
SK Hynix |
Nand Flash 4Gb 512Mx8 MLC
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NAND (MLC) | 4Gbit | Parallel | - | - | - | 2.7V ~ 3.6V | 0°C ~ 70°C | Surface Mount | - | 48-TSOP |
||
Micron Technology Inc. |
LPDDR4 32G 1GX32 FBGA DDP
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR4X | 32Gbit | Parallel | 2.133 GHz | 18ns | - | 1.06V ~ 1.17V | -40°C ~ 95°C (TC) | Surface Mount | 200-TFBGA | 200-TFBGA (10x14.5) |
||
Winbond Electronics |
8G-BIT SLC NAND FLASH, 1.8V, 1-B
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NAND (SLC) | 8Gbit | ONFI | - | 35ns, 700µs | 25 ns | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |