Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Cypress Semiconductor Corp |
IC FLASH 1GBIT 110NS 64BGA
|
pacchetto: 64-LBGA |
Azione4.560 |
|
FLASH | FLASH - NOR | 1Gb (128M x 8) | Parallel | - | 110ns | 110ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 64-LBGA | 64-Fortified BGA (13x11) |
||
Micron Technology Inc. |
IC FLASH 1MBIT 75MHZ 8VFDFPN
|
pacchetto: 8-VDFN Exposed Pad |
Azione2.112 |
|
FLASH | FLASH - NOR | 1Mb (128K x 8) | SPI | 75MHz | 3ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-VDFN Exposed Pad | 8-VFQFPN (6x5) |
||
Micron Technology Inc. |
IC FLASH 1GBIT 25NS 130VFBGA
|
pacchetto: 130-VFBGA |
Azione5.728 |
|
FLASH | FLASH - NAND | 1Gb (64M x 16) | Parallel | - | - | - | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 130-VFBGA | 130-VFBGA (8x9) |
||
Micron Technology Inc. |
IC SDRAM 2GBIT 533MHZ 96FBGA
|
pacchetto: 96-TFBGA |
Azione4.352 |
|
DRAM | SDRAM - DDR3 | 2Gb (128M x 16) | Parallel | 533MHz | - | 13.125ns | 1.425 V ~ 1.575 V | 0°C ~ 95°C (TC) | Surface Mount | 96-TFBGA | 96-FBGA (9x14) |
||
ON Semiconductor |
IC EEPROM 16KBIT 200NS 24SOIC
|
pacchetto: 24-SOIC (0.295", 7.50mm Width) |
Azione4.544 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | Parallel | - | 10ms | 200ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 24-SOIC (0.295", 7.50mm Width) | 24-SOIC |
||
IDT, Integrated Device Technology Inc |
IC SRAM 4.5MBIT 7.5NS 165CABGA
|
pacchetto: 165-TBGA |
Azione4.464 |
|
SRAM | SRAM - Synchronous ZBT | 4.5Mb (256K x 18) | Parallel | - | - | 7.5ns | 3.135 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 165-TBGA | 165-CABGA (13x15) |
||
Microchip Technology |
IC EEPROM 8KBIT 20MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione2.256 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | SPI | 20MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Cypress Semiconductor Corp |
IC NVSRAM 256KBIT 25NS 32SOIC
|
pacchetto: 32-SOIC (0.295", 7.50mm Width) |
Azione5.072 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 256Kb (32K x 8) | Parallel | - | 25ns | 25ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 32-SOIC (0.295", 7.50mm Width) | 32-SOIC |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 16MBIT 143MHZ 60TFBGA
|
pacchetto: 60-TFBGA |
Azione2.736 |
|
DRAM | SDRAM | 16Mb (1M x 16) | Parallel | 143MHz | - | 5.5ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 60-TFBGA | 60-TFBGA (6.4x10.1) |
||
Cypress Semiconductor Corp |
IC SRAM 64KBIT 25NS 28DIP
|
pacchetto: 28-DIP (0.300", 7.62mm) |
Azione81.264 |
|
SRAM | SRAM - Asynchronous | 64Kb (8K x 8) | Parallel | - | 25ns | 25ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 28-DIP (0.300", 7.62mm) | 28-PDIP |
||
Microchip Technology |
IC OTP 2MBIT 150NS 32VSOP
|
pacchetto: 32-TFSOP (0.488", 12.40mm Width) |
Azione4.640 |
|
EPROM | EPROM - OTP | 2Mb (256K x 8) | Parallel | - | - | 150ns | 2.7 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-TFSOP (0.488", 12.40mm Width) | 32-VSOP |
||
Microchip Technology |
IC EEPROM 4KBIT 2.1MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione4.784 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | SPI | 3MHz | 5ms | - | 2.7 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
IDT, Integrated Device Technology Inc |
IC SRAM 64KBIT 55NS 68PLCC
|
pacchetto: 68-LCC (J-Lead) |
Azione2.192 |
|
SRAM | SRAM - Dual Port, Asynchronous | 64Kb (8K x 8) | Parallel | - | 55ns | 55ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 68-LCC (J-Lead) | 68-PLCC (24.21x24.21) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 64KBIT 35NS 68PLCC
|
pacchetto: 68-LCC (J-Lead) |
Azione2.080 |
|
SRAM | SRAM - Dual Port, Asynchronous | 64Kb (8K x 8) | Parallel | - | 35ns | 35ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 68-LCC (J-Lead) | 68-PLCC (24.21x24.21) |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 512MBIT 200MHZ 60BGA
|
pacchetto: 60-TFBGA |
Azione2.592 |
|
DRAM | SDRAM - DDR | 512Mb (32M x 16) | Parallel | 200MHz | 15ns | 700ps | 2.5 V ~ 2.7 V | -40°C ~ 85°C (TA) | Surface Mount | 60-TFBGA | 60-TFBGA (8x13) |
||
Micron Technology Inc. |
IC SDRAM 1GBIT 400MHZ 84FBGA
|
pacchetto: 84-TFBGA |
Azione7.376 |
|
DRAM | SDRAM - DDR2 | 1Gb (64M x 16) | Parallel | 400MHz | 15ns | 400ps | 1.7 V ~ 1.9 V | -40°C ~ 125°C (TC) | Surface Mount | 84-TFBGA | 84-FBGA (8x12.5) |
||
Cypress Semiconductor Corp |
NOR
|
pacchetto: - |
Azione4.272 |
|
FLASH | FLASH - NOR | 512Mb (64M x 8) | Parallel | - | 60ns | 120ns | 2.7 V ~ 3.6 V | -40°C ~ 125°C (TA) | - | - | - |
||
Micron Technology Inc. |
IC FLASH 4GBIT 63VFBGA
|
pacchetto: 63-VFBGA |
Azione5.488 |
|
FLASH | FLASH - NAND | 4Gb (512M x 8) | Parallel | - | - | - | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 63-VFBGA | 63-VFBGA (9x11) |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 256MBIT 166MHZ 54BGA
|
pacchetto: 54-TFBGA |
Azione2.000 |
|
DRAM | SDRAM | 256Mb (16M x 16) | Parallel | 166MHz | - | 5.4ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 54-TFBGA | 54-TFBGA (8x8) |
||
Microchip Technology |
IC SRAM 1MBIT 20MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione7.552 |
|
SRAM | SRAM | 1Mb (128K x 8) | SPI - Quad I/O | 16MHz | - | - | 2.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
SII Semiconductor Corporation |
IC EEPROM 16KBIT 2MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione7.520 |
|
EEPROM | EEPROM | 16Kb (1K x 16) | SPI | 2MHz | 4ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Texas Instruments |
IC OTP 1.5KBIT SDQ TO92-3
|
pacchetto: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads) |
Azione2.848 |
|
EPROM | EPROM - OTP | 1.5K (6 pages x 32 bytes) | Single Wire | - | - | - | 2.65 V ~ 5.5 V | -20°C ~ 70°C (TA) | Through Hole | TO-226-3, TO-92-3 (TO-226AA) (Formed Leads) | TO-92-3 |
||
Cypress Semiconductor Corp |
IC SRAM 72MBIT 300MHZ 165FBGA
|
pacchetto: 165-LBGA |
Azione4.496 |
|
SRAM | SRAM - Synchronous, QDR II | 72Mb (2M x 36) | Parallel | 300MHz | - | - | 1.7 V ~ 1.9 V | -40°C ~ 85°C (TA) | Surface Mount | 165-LBGA | 165-FBGA (13x15) |
||
Cypress Semiconductor Corp |
IC SRAM 4MB 45NS 48BGA
|
pacchetto: 48-VFBGA |
Azione9.132 |
|
SRAM | SRAM - Asynchronous | 4Mb (256K x 16) | Parallel | - | 45ns | 45ns | 2.2 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-VFBGA | 48-VFBGA (6x8) |
||
Cypress Semiconductor Corp |
256KB SERIAL I2C F-RAM 3VOLT 8
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.672 |
|
FRAM | FRAM (Ferroelectric RAM) | 256Kb (32K x 8) | I²C | 3.4MHz | - | 130ns | 2 V ~ 3.6 V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Cypress Semiconductor Corp |
IC MEMORY NOR
|
pacchetto: - |
Azione7.472 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC SRAM 8K PARALLEL 64TQFP
|
pacchetto: 64-LQFP |
Azione6.992 |
|
SRAM | SRAM - Dual Port, Asynchronous | 8Kb (1K x 8) | Parallel | - | 55ns | 55ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP | 64-TQFP (14x14) |
||
Micron Technology Inc. |
IC FLASH 2G PARALLEL FBGA
|
pacchetto: - |
Azione3.792 |
|
FLASH | FLASH - NAND | 2Gb (256M x 8) | Parallel | - | - | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | - | - | - |
||
Microchip Technology |
1.8V, 4MBIT SPI FLASH
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione19.704 |
|
FLASH | FLASH | 4Mb (512K x 8) | SPI | 40MHz | 1ms | - | 1.65V ~ 1.95V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
2K 256X8 2.5V SER EE HIGH TEMP
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.464 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | SPI | 10MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 150°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |