Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Micron Technology Inc. |
IC FLASH 256GBIT 83MHZ 48TSOP
|
pacchetto: - |
Azione7.408 |
|
FLASH | FLASH - NAND | 256Gb (32G x 8) | Parallel | 83MHz | - | - | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | - | 48-TSOP |
||
Microchip Technology |
IC EEPROM 1MBIT 400KHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione4.768 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | I2C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 8KBIT 3MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione7.072 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | SPI | 3MHz | 2ms | - | 4.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Micron Technology Inc. |
IC SDRAM 1GBIT 167MHZ 90VFBGA
|
pacchetto: 90-VFBGA |
Azione6.528 |
|
DRAM | SDRAM - Mobile LPDDR | 1Gb (32M x 32) | Parallel | 166MHz | 15ns | 5.0ns | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 90-VFBGA | 90-VFBGA (8x13) |
||
Micron Technology Inc. |
IC SDRAM 2GBIT 800MHZ 78FBGA
|
pacchetto: 78-TFBGA |
Azione3.312 |
|
DRAM | SDRAM - DDR3 | 2Gb (512M x 4) | Parallel | 800MHz | - | 13.75ns | 1.425 V ~ 1.575 V | 0°C ~ 95°C (TC) | Surface Mount | 78-TFBGA | 78-FBGA (9x11.5) |
||
Cypress Semiconductor Corp |
IC SRAM 36MBIT 400MHZ 165FBGA
|
pacchetto: 165-LBGA |
Azione7.856 |
|
SRAM | SRAM - Synchronous, DDR II+ | 36Mb (2M x 18) | Parallel | 400MHz | - | - | 1.7 V ~ 1.9 V | 0°C ~ 70°C (TA) | Surface Mount | 165-LBGA | 165-FBGA (13x15) |
||
Rohm Semiconductor |
IC EEPROM 2KBIT 5MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione3.904 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | SPI | 5MHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC SRAM 9MBIT 8NS 100TQFP
|
pacchetto: 100-LQFP |
Azione5.504 |
|
SRAM | SRAM - Synchronous | 9Mb (256K x 36) | Parallel | 100MHz | - | 8ns | 3.135 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
Micron Technology Inc. |
IC FLASH 64MBIT 85NS 56TSOP
|
pacchetto: 56-TFSOP (0.724", 18.40mm Width) |
Azione173.136 |
|
FLASH | FLASH - NOR | 64Mb (4M x 16) | Parallel | 40MHz | 85ns | 85ns | 2.3 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 56-TFSOP (0.724", 18.40mm Width) | 56-TSOP (14x20) |
||
Micron Technology Inc. |
IC SDRAM 256MBIT 167MHZ 54TSOP
|
pacchetto: 54-TSOP (0.400", 10.16mm Width) |
Azione4.640 |
|
DRAM | SDRAM | 256Mb (16M x 16) | Parallel | 167MHz | 12ns | 5.4ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 54-TSOP (0.400", 10.16mm Width) | 54-TSOP II |
||
Microchip Technology |
IC EEPROM 512KBIT 1MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione170.592 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | I2C | 1MHz | 10ms | 550ns | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM 256KBIT 2.1MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione7.696 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | SPI | 2.1MHz | 10ms | - | 1.8 V ~ 3.6 V | 0°C ~ 70°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
IDT, Integrated Device Technology Inc |
IC SRAM 2MBIT 133MHZ 256CABGA
|
pacchetto: 256-LBGA |
Azione5.328 |
|
SRAM | SRAM - Dual Port, Synchronous | 2Mb (128K x 18) | Parallel | 133MHz | - | 4.2ns | 2.4 V ~ 2.6 V | 0°C ~ 70°C (TA) | Surface Mount | 256-LBGA | 256-CABGA (17x17) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 1.125MBIT 12NS 208CABGA
|
pacchetto: 208-LFBGA |
Azione7.088 |
|
SRAM | SRAM - Dual Port, Asynchronous | 1.125Mb (32K x 36) | Parallel | - | 12ns | 12ns | 3.15 V ~ 3.45 V | -40°C ~ 85°C (TA) | Surface Mount | 208-LFBGA | 208-CABGA (15x15) |
||
Micron Technology Inc. |
IC SDRAM 1GBIT 400MHZ 60FBGA
|
pacchetto: 60-TFBGA |
Azione19.128 |
|
DRAM | SDRAM - DDR2 | 1Gb (256M x 4) | Parallel | 400MHz | 15ns | 400ps | 1.7 V ~ 1.9 V | 0°C ~ 85°C (TC) | Surface Mount | 60-TFBGA | 60-FBGA (8x10) |
||
Micron Technology Inc. |
IC FLASH 2GBIT 48TSOP
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione7.488 |
|
FLASH | FLASH - NAND | 2Gb (128M x 16) | Parallel | - | - | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP I |
||
Winbond Electronics |
IC PSRAM 128MBIT 133MHZ 54VFBGA
|
pacchetto: 54-VFBGA |
Azione6.128 |
|
PSRAM | PSRAM (Pseudo SRAM) | 128Mb (8M x 16) | Parallel | 133MHz | - | 70ns | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TC) | Surface Mount | 54-VFBGA | 54-VFBGA (6x8) |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 64MBIT 200MHZ 54BGA
|
pacchetto: 54-TFBGA |
Azione5.184 |
|
DRAM | SDRAM | 64Mb (4M x 16) | Parallel | 200MHz | - | 4.8ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 54-TFBGA | 54-TFBGA (8x8) |
||
Microchip Technology |
IC FLASH 4MBIT 70NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione10.740 |
|
FLASH | FLASH | 4Mb (512K x 8) | Parallel | - | 20µs | 70ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 16KBIT 10MHZ 8MSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione2.064 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | SPI | 10MHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Winbond Electronics |
IC FLASH 16MBIT 50MHZ 8SVSOP
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.248 |
|
FLASH | FLASH - NOR | 16Mb (2M x 8) | SPI | 50MHz | 3ms | - | 2.3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-VSOP |
||
Microchip Technology |
IC EEPROM 2KBIT 3MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione4.048 |
|
EEPROM | EEPROM | 2Kb (256 x 8, 128 x 16) | SPI | 3MHz | 2ms | - | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Cypress Semiconductor Corp |
IC SRAM 144KBIT 25NS 100TQFP
|
pacchetto: 100-LQFP |
Azione3.744 |
|
SRAM | SRAM - Dual Port, Asynchronous | 144Kb (8K x 18) | Parallel | - | 25ns | 25ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
Microchip Technology |
IC SRAM 512KBIT 20MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione8.256 |
|
SRAM | SRAM | 512Kb (64K x 8) | SPI - Quad I/O | 20MHz | - | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Micron Technology Inc. |
IC FLASH 32G PARALLEL 166MHZ
|
pacchetto: - |
Azione4.080 |
|
FLASH | FLASH - NAND | 32Gb (4G x 8) | Parallel | 166MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | - | - | - |
||
Macronix |
IC FLASH SERIAL NOR 1GBIT
|
pacchetto: - |
Azione7.424 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Alliance Memory, Inc. |
IC DRAM 512M PARALLEL 96FBGA
|
pacchetto: 96-VFBGA |
Azione7.264 |
|
DRAM | SDRAM - DDR3 | 512Mb (32M x 16) | Parallel | 800MHz | - | 20ns | 1.283 V ~ 1.45 V | 0°C ~ 95°C (TC) | Surface Mount | 96-VFBGA | 96-FBGA (13x8) |
||
ISSI, Integrated Silicon Solution Inc |
IC DRAM 16M PARALLEL 50TSOP II
|
pacchetto: 50-TSOP (0.400", 10.16mm Width), 44 Leads |
Azione5.312 |
|
DRAM | DRAM - EDO | 16Mb (1M x 16) | Parallel | - | 85ns | 25ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 50-TSOP (0.400", 10.16mm Width), 44 Leads | 50/44-TSOP II |
||
Micron Technology Inc. |
SLC 64G DIE 8GX8
|
pacchetto: - |
Azione3.216 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
8K 16B PAGE 2.5V SER EE
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.568 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | SPI | 10MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |