Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Current - Supply | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|
Intersil |
IC CCD DRIVER 2-PHS HS 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.640 |
|
2.5mA | 4.5 V ~ 16 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Texas Instruments |
IC ENERGY MGMNT SYSTEM 16WQFN
|
pacchetto: 16-WFQFN Exposed Pad |
Azione7.584 |
|
140µA | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 16-WFQFN Exposed Pad | 16-WQFN (4x4) |
||
Texas Instruments |
IC PWR MGMT FOR DGTL CA 113NFBGA
|
pacchetto: 113-VFBGA |
Azione3.712 |
|
- | 1.5 V ~ 5.5 V | -20°C ~ 85°C | Surface Mount | 113-VFBGA | 113-NFBGA (8x8) |
||
Analog Devices Inc. |
IC ACTIVE BIAS CONT DIE
|
pacchetto: Die |
Azione7.120 |
|
7.5mA | 4 V ~ 12 V | -55°C ~ 85°C | Surface Mount | Die | Die |
||
Maxim Integrated |
IC DCDC CONV STPDN DL LDO 20TQFN
|
pacchetto: 20-WQFN Exposed Pad |
Azione7.392 |
|
- | 3.7 V ~ 28 V | -40°C ~ 125°C | Surface Mount | 20-WQFN Exposed Pad | 20-TQFN-EP (5x5) |
||
STMicroelectronics |
IC PRE-DRIVER MULTI-VALVE
|
pacchetto: - |
Azione3.952 |
|
- | - | - | - | - | - |
||
Maxim Integrated |
IC LOW POWER BATT MGMT 36WLP
|
pacchetto: - |
Azione3.632 |
|
- | 2.7 V ~ 5.5 V | -40°C ~ 85°C | - | - | - |
||
Texas Instruments |
IC LCD SUPP W/LINEAR REG24HTSSOP
|
pacchetto: 24-TSSOP (0.173", 4.40mm Width) Exposed Pad |
Azione3.712 |
|
700µA | 2.7 V ~ 5.8 V | -40°C ~ 85°C | Surface Mount | 24-TSSOP (0.173", 4.40mm Width) Exposed Pad | 24-HTSSOP |
||
Maxim Integrated |
IC REG LDO/SWITCH ADJ 16TQFN
|
pacchetto: 16-WQFN Exposed Pad |
Azione6.192 |
|
2.1mA | 4.5 V ~ 18 V | -40°C ~ 105°C | Surface Mount | 16-WQFN Exposed Pad | 16-TQFN (4x4) |
||
Active-Semi International Inc. |
IC REG BUCK LDO 40TQFN
|
pacchetto: 40-WFQFN Exposed Pad |
Azione2.576 |
|
420µA | 2.7 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 40-WFQFN Exposed Pad | 40-TQFN (5x5) |
||
Diodes Incorporated |
HEATER CONTROLLER SO-8
|
pacchetto: - |
Azione7.824 |
|
- | - | - | - | - | - |
||
Diodes Incorporated |
HEATER CONTROLLER SO-8
|
pacchetto: - |
Azione6.480 |
|
- | - | - | - | - | - |
||
Diodes Incorporated |
IRON CONTROLLER PDIP-8
|
pacchetto: - |
Azione2.416 |
|
- | - | - | - | - | - |
||
Rohm Semiconductor |
IC PD CTLR USB TYPE-C 40UQFN
|
pacchetto: 40-VFQFN Exposed Pad |
Azione4.800 |
|
- | 4.75 V ~ 20 V | -30°C ~ 105°C | Surface Mount | 40-VFQFN Exposed Pad | UQFN040V5050 |
||
NXP |
IC DSP SGL COIL 5W 5V STD 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione11.568 |
|
- | 2.7 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Texas Instruments |
IC DGTL PWM CTRLR SYNC 80TQFP
|
pacchetto: 80-TQFP |
Azione7.328 |
|
- | 3 V ~ 3.6 V | -40°C ~ 125°C | Surface Mount | 80-TQFP | 80-TQFP (12x12) |
||
Maxim Integrated |
IC DRVR TRANSF ISO 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione139.944 |
|
1.1mA | 2.5 V ~ 6 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Richtek USA Inc. |
IC POWER MANAGEMENT
|
pacchetto: - |
Azione16.332 |
|
- | - | - | - | - | - |
||
Analog Devices Inc./Maxim Integrated |
AMOLED DISPLAY DRIVER PMIC
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - |
||
NXP |
POWER MANAGEMENT IC, I.MX 8DX/DX
|
pacchetto: - |
Request a Quote |
|
10µA | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount, Wettable Flank | 48-VFQFN Exposed Pad | 48-HVQFN (7x7) |
||
Renesas Electronics Corporation |
ANALOG FOR MOBILE
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - |
||
Renesas Electronics Corporation |
P9180A-I5 BLUEFINXP
|
pacchetto: - |
Request a Quote |
|
- | 4.5V ~ 5.25V | -40°C ~ 85°C | Surface Mount | 100-VFQFN Dual Rows, Exposed Pad | 100-VFQFPN (8x8) |
||
Texas Instruments |
IC REGULATOR CONV SMD
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - |
||
NXP |
PF7100 PMIC I.MX8DXP/DX
|
pacchetto: - |
Request a Quote |
|
10µA | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount, Wettable Flank | 48-VFQFN Exposed Pad | 48-HVQFN (7x7) |
||
NXP |
POWER MANAGEMENT IC, S32, NON-PR
|
pacchetto: - |
Request a Quote |
|
- | 3.3V ~ 5.25V | -40°C ~ 125°C (TA) | Surface Mount, Wettable Flank | 40-PowerVFQFN | 40-HVQFN (6x6) |
||
Texas Instruments |
PROTOTYPE
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - |
||
Texas Instruments |
ADVANCED POWER MANAGEMENT IC (PM
|
pacchetto: - |
Azione2.040 |
|
- | - | -40°C ~ 85°C | Surface Mount | 169-LFBGA | 169-NFBGA (12x12) |
||
NXP |
IC FS86 SYSTEM BASIS CHIP ASIL
|
pacchetto: - |
Request a Quote |
|
- | 4.5V ~ 60V | -40°C ~ 125°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |