Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC CLK BUFFER 1:8 750MHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione3.552 |
|
1 | 1:8 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFFER 1:8 750MHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione6.432 |
|
1 | 1:8 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFFER 1:8 750MHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione5.632 |
|
1 | 1:8 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVDS | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFFER 1:8 750MHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione2.960 |
|
1 | 1:8 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVDS | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFFER 1:8 750MHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione7.584 |
|
1 | 1:8 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFFER 1:8 750MHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione4.480 |
|
1 | 1:8 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFF MUX 2:6 750MHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione5.200 |
|
1 | 2:6 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVDS | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFFER 2:6 750MHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione6.896 |
|
1 | 2:6 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVDS | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFF MUX 2:6 750MHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione5.616 |
|
1 | 2:6 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFF MUX 2:6 750MHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione4.864 |
|
1 | 2:6 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFF MUX 2:6 750MHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione3.600 |
|
1 | 2:6 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVDS | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFFER 2:6 750MHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione5.984 |
|
1 | 2:6 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVDS | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFF MUX 2:6 750MHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione5.856 |
|
1 | 2:6 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFF MUX 2:6 750MHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione2.064 |
|
1 | 2:6 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFFER 1:6 750MHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione7.936 |
|
1 | 1:6 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFFER 1:6 750MHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione3.872 |
|
1 | 1:6 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFFER 1:6 750MHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione5.808 |
|
1 | 1:6 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVDS | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFFER 1:6 750MHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione6.752 |
|
1 | 1:6 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVDS | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFFER 1:6 750MHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione3.104 |
|
1 | 1:6 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVDS | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFFER 1:6 750MHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione4.032 |
|
1 | 1:6 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVDS | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFFER 1:6 750MHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione4.592 |
|
1 | 1:6 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFFER 1:6 750MHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione6.304 |
|
1 | 1:6 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
LOW SKEW, LOW ADDITIVE JITTER 2
|
pacchetto: 40-VFQFN Exposed Pad |
Azione2.192 |
|
1 | 3:5 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL, SSTL | HCSL, LVCMOS, LVDS, LVPECL | 1.6GHz | 1.35V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-QFN (6x6) |
||
Microchip Technology |
TEN LVCMOS OUTPUT LOW ADDITIVE J
|
pacchetto: 32-VFQFN Exposed Pad |
Azione4.416 |
|
1 | 3:10 | Yes/No | CML, HCSL, LVCMOS, LVDS, LVPECL, SSTL | LVCMOS | 250MHz | 1.35V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
LOW SKEW, LOW ADDITIVE JITTER 3
|
pacchetto: 32-VFQFN Exposed Pad |
Azione6.720 |
|
1 | 3:5 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL, SSTL | HCSL, LVCMOS, LVDS, LVPECL | 1.6GHz | 1.35V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFFER 1:4 750MHZ 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione2.624 |
|
1 | 1:4 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVDS | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:4 750MHZ 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione6.928 |
|
1 | 1:4 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVDS | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:4 750MHZ 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione2.048 |
|
1 | 1:4 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:4 750MHZ 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione5.488 |
|
1 | 1:4 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:4 750MHZ 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione4.832 |
|
1 | 1:4 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVDS | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |