Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
400KHZ AUTO TEMP 8-TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione6.944 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | I²C | 1MHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
8KB I2C EEPROM AUTO GRADE 1
|
pacchetto: SOT-23-5 Thin, TSOT-23-5 |
Azione6.976 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | I²C | 1MHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | SOT-23-5 Thin, TSOT-23-5 | TSOT-23-5 |
||
Microchip Technology |
400KHZ AUTO GRADE 8-SOIC-N
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.680 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | I²C | 1MHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
1MHZ AUTO GRADE1 8-UDFN
|
pacchetto: 8-UFDFN Exposed Pad |
Azione2.048 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | I²C | 1MHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
1MHZ AUTO GRADE1 8-UDFN
|
pacchetto: 8-UFDFN Exposed Pad |
Azione6.304 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | I²C | 1MHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
400KHZ AUTO TEMP 8-TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione5.568 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | I²C | 400kHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
4KB I2C EEPROM AUTO GRADE 1
|
pacchetto: SOT-23-5 Thin, TSOT-23-5 |
Azione7.200 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | I²C | 1MHz | 5ms | 450ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | SOT-23-5 Thin, TSOT-23-5 | TSOT-23-5 |
||
Microchip Technology |
400KHZ AUTO GRADE 8-SOIC-N
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.488 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | I²C | 400kHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
1MHZ AUTO GRADE1 8-UDFN
|
pacchetto: 8-UFDFN Exposed Pad |
Azione2.656 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | I²C | 400kHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
1MHZ AUTO GRADE1 8-UDFN
|
pacchetto: 8-UFDFN Exposed Pad |
Azione4.112 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | I²C | 400kHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
400KHZ AUTO TEMP 8-TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione2.496 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I²C | 1MHz | 5ms | 450ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
2KB I2C EEPROM AUTO GRADE 1
|
pacchetto: SOT-23-5 Thin, TSOT-23-5 |
Azione4.304 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I²C | 1MHz | 5ms | 450ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | SOT-23-5 Thin, TSOT-23-5 | TSOT-23-5 |
||
Microchip Technology |
400KHZ AUTO GRADE 8-SOIC-N
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.904 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I²C | 1MHz | 5ms | 450ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
1MHZ AUTO GRADE1 8-UDFN
|
pacchetto: 8-UFDFN Exposed Pad |
Azione5.632 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I²C | 1MHz | 5ms | 450ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
1MHZ AUTO GRADE1 8-UDFN
|
pacchetto: 8-UFDFN Exposed Pad |
Azione3.840 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I²C | 1MHz | 5ms | 450ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
400KHZ AUTO TEMP 8-TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione3.104 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I²C | 1MHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
1KB I2C EEPROM AUTO GRADE 1
|
pacchetto: SOT-23-5 Thin, TSOT-23-5 |
Azione3.584 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I²C | 1MHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | SOT-23-5 Thin, TSOT-23-5 | TSOT-23-5 |
||
Microchip Technology |
400KHZ AUTO GRADE 8-SOIC-N
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione7.616 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I²C | 1MHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
1MHZ AUTO GRADE1 8-UDFN
|
pacchetto: 8-UFDFN Exposed Pad |
Azione3.136 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I²C | 1MHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
1MHZ AUTO GRADE1 8-UDFN
|
pacchetto: 8-UFDFN Exposed Pad |
Azione5.696 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I²C | 1MHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
APG STANDARD
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.224 |
|
EEPROM | EEPROM | 16Kb (2K x 8, 1K x 16) | SPI | 2MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
16K 1024X16 OR 2048X8 SERIAL EE
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione7.584 |
|
EEPROM | EEPROM | 16Kb (2K x 8, 1K x 16) | SPI | 2MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
16K 1024X16 OR 2048X8 SERIAL EE
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.992 |
|
EEPROM | EEPROM | 16Kb (2K x 8, 1K x 16) | SPI | 2MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
APG STANDARD
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.072 |
|
EEPROM | EEPROM | 8Kb (1K x 8, 512 x 16) | SPI | 3MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
8K 1024X8 SERIAL EE
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.104 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | SPI | 3MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
APG STANDARD
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.360 |
|
EEPROM | EEPROM | 4Kb (512 x 8, 256 x 16) | SPI | 2MHz | 6ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
APG STANDARD
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.096 |
|
EEPROM | EEPROM | 4Kb (512 x 8, 256 x 16) | SPI | 2MHz | 6ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
APG STANDARD
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.184 |
|
EEPROM | EEPROM | 4Kb (256 x 16) | SPI | 2MHz | 6ms | - | 2.5V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
2K 256X16 SERIAL EE
|
pacchetto: SOT-23-6 |
Azione7.056 |
|
EEPROM | EEPROM | 4Kb (256 x 16) | SPI | 2MHz | 6ms | - | 2.5V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | SOT-23-6 | SOT-23-6 |
||
Microchip Technology |
4K 256X16 SER EE
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione5.184 |
|
EEPROM | EEPROM | 4Kb (256 x 16) | SPI | 2MHz | 6ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |