Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
---|---|---|---|---|---|---|
Microchip Technology |
OSC MEMS 180.0000MHZ LVDS SMD
|
pacchetto: 6-SMD, No Lead |
Azione2.304 |
|
||
Microchip Technology |
OSC MEMS 25.000MHZ CMOS SMD
|
pacchetto: 4-SMD, No Lead Exposed Pad |
Azione5.598 |
|
||
Microchip Technology |
OSC MEMS 4.9152MHZ LVCMOS SMD
|
pacchetto: 4-SMD, No Lead |
Azione7.812 |
|
||
Microchip Technology |
IC SUPERVISOR 3.00V LOW TO92
|
pacchetto: TO-226-3, TO-92-3 (TO-226AA) |
Azione5.648 |
|
||
Microchip Technology |
USB TYPE-C/PD CONTROLLER WITH I2
|
pacchetto: - |
Azione4.176 |
|
||
Microchip Technology |
IC EEPROM 1MBIT 1MHZ 8SAP
|
pacchetto: 8-UDFN Exposed Pad |
Azione5.552 |
|
||
Microchip Technology |
IC FLASH 8MBIT 90NS 48CBGA
|
pacchetto: 48-VFBGA, CSBGA |
Azione2.496 |
|
||
Microchip Technology |
IC FLASH 2MBIT 120NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione7.248 |
|
||
Microchip Technology |
IC EEPROM 2KBIT 400KHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione2.432 |
|
||
Microchip Technology |
IC EEPROM 512KBIT 400KHZ 8DFN
|
pacchetto: 8-VDFN Exposed Pad |
Azione35.436 |
|
||
Microchip Technology |
IC EEPROM 256KBIT 400KHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione13.308 |
|
||
Microchip Technology |
IC EEPROM 8KBIT 10MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione5.968 |
|
||
Microchip Technology |
IC EEPROM 1KBIT 100KHZ 8MSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione5.536 |
|
||
Microchip Technology |
IC EEPROM 16KBIT 5MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione3.488 |
|
||
Microchip Technology |
IC I/O EXPANDER I2C 8B 16QSOP
|
pacchetto: 16-SSOP (0.154", 3.90mm Width) |
Azione7.040 |
|
||
Microchip Technology |
IC MCU 16BIT 8KB FLASH 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione4.208 |
|
||
Microchip Technology |
IC MCU 8BIT ROMLESS 44PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione129.756 |
|
||
Microchip Technology |
IC MCU 8BIT 8KB FLASH 44QFN
|
pacchetto: 44-VQFN Exposed Pad |
Azione112.536 |
|
||
Microchip Technology |
IC MCU 8BIT 3.5KB OTP 18SOIC
|
pacchetto: 18-SOIC (0.295", 7.50mm Width) |
Azione4.448 |
|
||
Microchip Technology |
IC MCU 8BIT 3.5KB OTP 28SSOP
|
pacchetto: 28-SSOP (0.209", 5.30mm Width) |
Azione3.760 |
|
||
Microchip Technology |
IC MCU 32BIT 128KB FLASH 100BGA
|
pacchetto: 100-VFBGA |
Azione56.028 |
|
||
Microchip Technology |
IC MCU 16BIT 128KB FLASH 48UQFN
|
pacchetto: 48-UFQFN Exposed Pad |
Azione4.080 |
|
||
Microchip Technology |
IC MCU 8BIT 14KB FLASH 40UQFN
|
pacchetto: 40-UFQFN Exposed Pad |
Azione5.280 |
|
||
Microchip Technology |
IC MCU 8BIT 7KB FLASH 28SDIP
|
pacchetto: 28-DIP (0.300", 7.62mm) |
Azione36.492 |
|
||
Microchip Technology |
IC MCU 8BIT 7KB OTP 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione7.680 |
|
||
Microchip Technology |
IC RHEO DGTL SNGL 10K SPI 8DFN
|
pacchetto: 8-VDFN Exposed Pad |
Azione6.208 |
|
||
Microchip Technology |
SENSOR TEMPERATURE I2C 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione31.812 |
|
||
Microchip Technology |
IC ADC 12BIT 2.7V 8CH SPI 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione5.392 |
|
||
Microchip Technology |
IC ADC 12BIT 2.7V 2CH SPI 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.856 |
|
||
Microchip Technology |
1X10G + 1X10G/8XSFP MULTI-RATE,
|
pacchetto: - |
Azione7.792 |
|