Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Elements | Number of Bits per Element | Input Type | Output Type | Current - Output High, Low | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
IC BUFF/DVR TRI-ST DUAL 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione4.016 |
|
2 | 4 | - | Push-Pull | 8mA, 8mA | 1 V ~ 3.6 V | -40°C ~ 125°C (TA) | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SO |
||
NXP |
IC BUFF/DVR TRI-ST 6BIT 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione2.560 |
|
1 | 6 | - | Push-Pull | 8mA, 8mA | 1 V ~ 3.6 V | -40°C ~ 125°C (TA) | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SO |
||
NXP |
IC BUFF/DVR TRI-ST 6BIT 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione2.048 |
|
1 | 6 | - | Push-Pull | 8mA, 8mA | 1 V ~ 3.6 V | -40°C ~ 125°C (TA) | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SO |
||
NXP |
IC BUFF/DVR TRI-ST 6BIT 16SSOP
|
pacchetto: 16-SSOP (0.209", 5.30mm Width) |
Azione5.360 |
|
1 | 6 | - | Push-Pull | 8mA, 8mA | 1 V ~ 3.6 V | -40°C ~ 125°C (TA) | Surface Mount | 16-SSOP (0.209", 5.30mm Width) | 16-SSOP |
||
NXP |
IC BUFF/DVR TRI-ST 6BIT 16SSOP
|
pacchetto: 16-SSOP (0.209", 5.30mm Width) |
Azione6.656 |
|
1 | 6 | - | Push-Pull | 8mA, 8mA | 1 V ~ 3.6 V | -40°C ~ 125°C (TA) | Surface Mount | 16-SSOP (0.209", 5.30mm Width) | 16-SSOP |
||
NXP |
IC BUFFER TRI-ST QUAD 14DIP
|
pacchetto: 14-DIP (0.300", 7.62mm) |
Azione4.480 |
|
4 | 1 | - | Push-Pull | 15mA, 64mA | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 14-DIP (0.300", 7.62mm) | 14-DIP |
||
NXP |
IC BUFF/DVR TRI-ST DUAL 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione2.672 |
|
2 | 4 | - | Push-Pull | 15mA, 64mA | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SO |
||
NXP |
IC BUFF/DVR TRI-ST DUAL 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione5.888 |
|
2 | 4 | - | Push-Pull | 15mA, 64mA | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SO |
||
NXP |
IC TRANSCEIVER 3ST 8BIT 20DIP
|
pacchetto: 20-DIP (0.300", 7.62mm) |
Azione4.432 |
|
1 | 8 | - | Push-Pull | 3mA, 24mA; 15mA, 64mA | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 20-DIP (0.300", 7.62mm) | 20-DIP |
||
NXP |
IC 16BIT TXRX 3-ST 48-SSOP
|
pacchetto: 48-BSSOP (0.295", 7.50mm Width) |
Azione7.728 |
|
2 | 8 | - | Push-Pull | 32mA, 64mA | 2.3 V ~ 2.7 V, 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-BSSOP (0.295", 7.50mm Width) | 48-SSOP |
||
NXP |
IC 16BIT TXRX 3-ST 48SSOP
|
pacchetto: 48-BSSOP (0.295", 7.50mm Width) |
Azione3.824 |
|
2 | 8 | - | Push-Pull | 32mA, 64mA | 2.3 V ~ 2.7 V, 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-BSSOP (0.295", 7.50mm Width) | 48-SSOP |
||
NXP |
IC BUFF/DVR TRI-ST 8BIT 20DIP
|
pacchetto: 20-DIP (0.300", 7.62mm) |
Azione4.144 |
|
1 | 8 | - | Push-Pull | 32mA, 64mA | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 20-DIP (0.300", 7.62mm) | 20-DIP |
||
NXP |
IC BUFF DVR TRI-ST N-INV 5TSSOP
|
pacchetto: 5-TSSOP, SC-70-5, SOT-353 |
Azione5.648 |
|
1 | 1 | - | Push-Pull | 32mA, 32mA | 1.65 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 5-TSSOP, SC-70-5, SOT-353 | 5-TSSOP |
||
NXP |
IC BUS TRSCVR 3-ST 32BIT 96LFBGA
|
pacchetto: 96-LFBGA |
Azione5.216 |
|
4 | 8 | - | Push-Pull | 12mA, 12mA | 1.2 V ~ 3.6 V | -40°C ~ 125°C (TA) | Surface Mount | 96-LFBGA | 96-LFBGA (13.5x5.5) |
||
NXP |
IC BUS TRSCVR 3-ST 32BIT 96LFBGA
|
pacchetto: 96-LFBGA |
Azione2.336 |
|
4 | 8 | - | Push-Pull | 12mA, 12mA | 1.2 V ~ 3.6 V | -40°C ~ 125°C (TA) | Surface Mount | 96-LFBGA | 96-LFBGA (13.5x5.5) |
||
NXP |
IC BUS TRSCVR 3-ST 32BIT 96LFBGA
|
pacchetto: 96-LFBGA |
Azione4.480 |
|
4 | 8 | - | Push-Pull | 12mA, 12mA | 1.2 V ~ 3.6 V | -40°C ~ 125°C (TA) | Surface Mount | 96-LFBGA | 96-LFBGA (13.5x5.5) |
||
NXP |
IC BUFF/DVR TRI-ST DUAL 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione2.224 |
|
2 | 4 | - | Push-Pull | 15mA, 64mA | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
NXP |
IC BUFF/DVR TRI-ST DUAL 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione4.448 |
|
2 | 4 | - | Push-Pull | 15mA, 64mA | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
NXP |
IC BUFF/DVR TRI-ST DUAL 20DIP
|
pacchetto: 20-DIP (0.300", 7.62mm) |
Azione6.416 |
|
2 | 4 | - | Push-Pull | 7.8mA, 7.8mA | 2 V ~ 6 V | -40°C ~ 125°C (TA) | Through Hole | 20-DIP (0.300", 7.62mm) | 20-DIP |
||
NXP |
IC BUFF/DVR TRI-ST 8BIT 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione5.360 |
|
1 | 8 | - | Push-Pull | 8mA, 8mA | 1 V ~ 3.6 V | -40°C ~ 125°C (TA) | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
NXP |
IC BUFF/DVR TRI-ST 8BIT 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione3.216 |
|
1 | 8 | - | Push-Pull | 8mA, 8mA | 1 V ~ 3.6 V | -40°C ~ 125°C (TA) | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
NXP |
IC BUFFER DVR TRI-ST QD 14DIP
|
pacchetto: 14-DIP (0.300", 7.62mm) |
Azione5.408 |
|
4 | 1 | - | Push-Pull | 7.8mA, 7.8mA | 2 V ~ 6 V | -40°C ~ 125°C (TA) | Through Hole | 14-DIP (0.300", 7.62mm) | 14-DIP |
||
NXP |
IC BUFFER/LINE DVR OCT 20DIP
|
pacchetto: 20-DIP (0.300", 7.62mm) |
Azione5.072 |
|
2 | 4 | - | Push-Pull | 7.8mA, 7.8mA | 2 V ~ 6 V | -40°C ~ 125°C (TA) | Through Hole | 20-DIP (0.300", 7.62mm) | 20-DIP |
||
NXP |
IC INVERTER 8-INPUT 20DIP
|
pacchetto: 20-DIP (0.300", 7.62mm) |
Azione5.184 |
|
1 | 8 | - | Push-Pull | 7.8mA, 7.8mA | 2 V ~ 6 V | -40°C ~ 125°C (TA) | Through Hole | 20-DIP (0.300", 7.62mm) | 20-DIP |
||
NXP |
IC BUFFER/LINE DVR OCT 20DIP
|
pacchetto: 20-DIP (0.300", 7.62mm) |
Azione6.256 |
|
2 | 4 | - | Push-Pull | 6mA, 6mA | 4.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Through Hole | 20-DIP (0.300", 7.62mm) | 20-DIP |
||
NXP |
IC BUFF/DVR TRI-ST DUAL 20DIP
|
pacchetto: 20-DIP (0.300", 7.62mm) |
Azione5.520 |
|
2 | 4 | - | Push-Pull | 6mA, 6mA | 4.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Through Hole | 20-DIP (0.300", 7.62mm) | 20-DIP |
||
NXP |
IC BUFF/DVR TRI-ST 8BIT 20DIP
|
pacchetto: 20-DIP (0.300", 7.62mm) |
Azione5.232 |
|
1 | 8 | - | Push-Pull | 6mA, 6mA | 4.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Through Hole | 20-DIP (0.300", 7.62mm) | 20-DIP |
||
NXP |
IC TRANSCVR 3ST 8BIT INV 24TSSOP
|
pacchetto: 24-TSSOP (0.173", 4.40mm Width) |
Azione5.056 |
|
1 | 8 | - | Push-Pull | 32mA, 64mA | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 24-TSSOP (0.173", 4.40mm Width) | 24-TSSOP |
||
NXP |
IC TRANSCVR 3ST 8BIT INV 24TSSOP
|
pacchetto: 24-TSSOP (0.173", 4.40mm Width) |
Azione3.328 |
|
1 | 8 | - | Push-Pull | 32mA, 64mA | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 24-TSSOP (0.173", 4.40mm Width) | 24-TSSOP |
||
NXP |
IC BUFF INVERT 5.5V 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione4.544 |
|
2 | 4 | - | Push-Pull | 32mA, 64mA | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |