Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Voltage - Input | Number of Outputs | Voltage - Output | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
IC PWR MGMT I.MX6 56QFN
|
pacchetto: 56-VFQFN Exposed Pad |
Azione2.272 |
|
2.8 V ~ 4.5 V | 11 | Multiple | -40°C ~ 85°C | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN-EP (8x8) |
||
NXP |
IC PWR MGMT I.MX6 56QFN
|
pacchetto: 56-VFQFN Exposed Pad |
Azione7.904 |
|
2.8 V ~ 4.5 V | 11 | Multiple | -40°C ~ 85°C | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN (8x8) |
||
NXP |
IC PWR MGMT I.MX6 56QFN
|
pacchetto: 56-VFQFN Exposed Pad |
Azione7.456 |
|
2.8 V ~ 4.5 V | 11 | Multiple | -40°C ~ 85°C | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN-EP (8x8) |
||
NXP |
IC PWR MGMT I.MX6 56QFN
|
pacchetto: 56-VFQFN Exposed Pad |
Azione6.688 |
|
2.8 V ~ 4.5 V | 11 | Multiple | -40°C ~ 85°C | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN-EP (8x8) |
||
NXP |
IC PWR MGMT I.MX6 56QFN
|
pacchetto: 56-VFQFN Exposed Pad |
Azione6.864 |
|
2.8 V ~ 4.5 V | 11 | Multiple | -40°C ~ 85°C | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN-EP (8x8) |
||
NXP |
IC PWR MGMT I.MX6 56QFN
|
pacchetto: 56-VFQFN Exposed Pad |
Azione4.352 |
|
2.8 V ~ 4.5 V | 11 | Multiple | -40°C ~ 85°C | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN (8x8) |
||
NXP |
IC PWR MGMT I.MX6 56QFN
|
pacchetto: 56-VFQFN Exposed Pad |
Azione5.328 |
|
2.8 V ~ 4.5 V | 11 | Multiple | -40°C ~ 85°C | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN (8x8) |
||
NXP |
IC PWR MGMT I.MX6 56QFN
|
pacchetto: 56-VFQFN Exposed Pad |
Azione5.712 |
|
2.8 V ~ 4.5 V | 11 | Multiple | -40°C ~ 85°C | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN (8x8) |
||
NXP |
IC PWR MGMT I.MX6 56QFN
|
pacchetto: 56-VFQFN Exposed Pad |
Azione2.448 |
|
2.8 V ~ 4.5 V | 11 | Multiple | -40°C ~ 85°C | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN (8x8) |
||
NXP |
IC CONVERTER DDR 26QFN
|
pacchetto: 26-VFQFN Exposed Pad |
Azione4.288 |
|
3 V ~ 6 V | 2 | 0.7 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 26-VFQFN Exposed Pad | 26-QFN-EP (5x5) |
||
NXP |
IC CONVERTER DDR 24QFN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione2.592 |
|
3 V ~ 6 V | 1 | 0.7 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN-EP (4x4) |
||
NXP |
IC CONVERTER DDR 24QFN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione3.360 |
|
3 V ~ 6 V | 1 | 0.7 V ~ 1.35 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN-EP (4x4) |
||
NXP |
IC CONVERTER DDR 24QFN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione3.760 |
|
3 V ~ 6 V | 1 | 0.7 V ~ 1.35 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN-EP (4x4) |
||
NXP |
ALTERNATOR REGULATOR, 14V 12A, L
|
pacchetto: Die |
Azione2.100 |
|
5 V ~ 16.5 V | 1 | 10.6 V ~ 16 V | -40°C ~ 150°C | Surface Mount | Die | Die |
||
NXP |
IC PWR MGMT I.MX6 56QFN
|
pacchetto: 56-VFQFN Exposed Pad |
Azione7.680 |
|
2.8 V ~ 4.5 V | 12 | Multiple | -40°C ~ 105°C | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN (8x8) |
||
NXP |
IC CONVERTER DDR 24QFN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione6.448 |
|
3 V ~ 6 V | 1 | 0.7 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN-EP (4x4) |
||
NXP |
IC PWR MGMT I.MX6 56QFN
|
pacchetto: 56-VFQFN Exposed Pad |
Azione2.400 |
|
2.8 V ~ 4.5 V | 12 | Multiple | -40°C ~ 105°C | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN (8x8) |
||
NXP |
IC SYSTEM BASIS CHIP CAN 48LQFP
|
pacchetto: 48-LQFP Exposed Pad |
Azione5.984 |
|
-1 V ~ 40 V | 6 | Multiple | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) |
||
NXP |
IC SYSTEM BASIS CHIP CAN 48LQFP
|
pacchetto: 48-LQFP Exposed Pad |
Azione7.808 |
|
-1 V ~ 40 V | 6 | Multiple | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) |
||
NXP |
IC PWR MGMT I.MX6 56QFN
|
pacchetto: 56-VFQFN Exposed Pad |
Azione20.796 |
|
2.8 V ~ 4.5 V | 12 | Multiple | -40°C ~ 105°C | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN (8x8) |
||
NXP |
IC PWR MGMT I.MX6 56QFN
|
pacchetto: 56-VFQFN Exposed Pad |
Azione7.824 |
|
2.8 V ~ 4.5 V | 11 | Multiple | -40°C ~ 85°C | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN (8x8) |
||
NXP |
IC PWR MGMT I.MX6 56QFN
|
pacchetto: 56-VFQFN Exposed Pad |
Azione6.780 |
|
2.8 V ~ 4.5 V | 11 | Multiple | -40°C ~ 85°C | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN (8x8) |
||
NXP |
IC PWR MGMT I.MX6 56QFN
|
pacchetto: 56-VFQFN Exposed Pad |
Azione6.012 |
|
2.8 V ~ 4.5 V | 11 | Multiple | -40°C ~ 85°C | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN (8x8) |
||
NXP |
IC PWR MGMT I.MX6 56QFN
|
pacchetto: 56-VFQFN Exposed Pad |
Azione20.742 |
|
2.8 V ~ 4.5 V | 11 | Multiple | -40°C ~ 85°C | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN (8x8) |
||
NXP |
IC CONVERTER DDR 26QFN
|
pacchetto: 26-VFQFN Exposed Pad |
Azione5.392 |
|
3 V ~ 6 V | 2 | 0.7 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 26-VFQFN Exposed Pad | 26-QFN-EP (5x5) |
||
NXP |
IC SYSTEM BASIS CAN 1.5A 48LQFP
|
pacchetto: 48-LQFP Exposed Pad |
Azione6.416 |
|
-1 V ~ 40 V | 6 | Multiple | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) |
||
NXP |
IC SYSTEM BASIS CAN 0.8A 48LQFP
|
pacchetto: 48-LQFP Exposed Pad |
Azione7.080 |
|
-1 V ~ 40 V | 6 | Multiple | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) |
||
NXP |
IC PWR MGMT I.MX6 56QFN
|
pacchetto: 56-VFQFN Exposed Pad |
Azione13.578 |
|
2.8 V ~ 4.5 V | 12 | Multiple | -40°C ~ 85°C | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN (8x8) |
||
NXP |
IC PWR MGMT I.MX6 56QFN
|
pacchetto: 56-VFQFN Exposed Pad |
Azione32.064 |
|
2.8 V ~ 4.5 V | 12 | Multiple | -40°C ~ 85°C | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN (8x8) |
||
NXP |
IC CONVERTER DDR 26QFN
|
pacchetto: 26-VFQFN Exposed Pad |
Azione6.224 |
|
3 V ~ 6 V | 2 | 0.7 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 26-VFQFN Exposed Pad | 26-QFN-EP (5x5) |