Prodotti NXP

MRF18060ALR5

NXP

FET RF 65V 1.88GHZ NI-780

• Transistor Type: LDMOS
• Frequency: 1.81GHz ~ 1.88GHz
• Gain: 13dB
• Voltage - Test: 26V
• Current Rating: -
• Noise Figure: -
• Current - Test: 500mA
• Power - Output: 60W
• Voltage - Rated: 65V
• Package / Case: NI-780
• Supplier Device Package: NI-780

pacchetto: NI-780

PZM12NB2A,115

NXP

DIODE ZENER 12V 220MW SMT3

• Voltage - Zener (Nom) (Vz): 12V
• Tolerance: ±2%
• Power - Max: 220mW
• Impedance (Max) (Zzt): 10 Ohms
• Current - Reverse Leakage @ Vr: 100nA @ 9V
• Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
• Operating Temperature: -
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: SMT3; MPAK

pacchetto: TO-236-3, SC-59, SOT-23-3

LD6806TD/16P,125

NXP

IC REG LINEAR 1.6V 200MA 5TSOP

• Output Configuration: Positive
• Output Type: Fixed
• Number of Regulators: 1
• Voltage - Input (Max): 5.5V
• Voltage - Output (Min/Fixed): 1.6V
• Voltage - Output (Max): -
• Voltage Dropout (Max): 0.13V @ 200mA
• Current - Output: 200mA
• Current - Quiescent (Iq): -
• Current - Supply (Max): 100µA ~ 250µA
• PSRR: 55dB (1kHz)
• Control Features: Enable
• Protection Features: Over Current, Over Temperature
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: SC-74A, SOT-753
• Supplier Device Package: 5-TSOP

pacchetto: SC-74A, SOT-753

UBA2211AP/N1,112

NXP

IC CFL DRIVER 8DIP

• Type: CFL/TL Driver
• Frequency: 40.05kHz ~ 42.68kHz
• Voltage - Supply: 10.7 V ~ 13.8 V
• Current - Supply: -
• Current - Output Source/Sink: 900mA
• Dimming: No
• Operating Temperature: -40°C ~ 150°C
• Mounting Type: Through Hole
• Package / Case: 8-DIP (0.300", 7.62mm)
• Supplier Device Package: 8-DIP

pacchetto: 8-DIP (0.300", 7.62mm)

74AVCM162834DGG:11

NXP

IC TRANSCVR 3-ST 18BIT 56TSSOP

• Logic Type: Universal Bus Driver
• Number of Circuits: 18-Bit
• Current - Output High, Low: 12mA, 12mA
• Voltage - Supply: 1.2 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 56-TFSOP (0.240", 6.10mm Width)
• Supplier Device Package: 56-TSSOP

pacchetto: 56-TFSOP (0.240", 6.10mm Width)

74AVCH1T45GM-Q100H

NXP

IC TRANSLATOR/TXRX SGL 6XSON

• Translator Type: Voltage Level
• Channel Type: Bidirectional
• Number of Circuits: 1
• Channels per Circuit: 1
• Voltage - VCCA: 0.8V ~ 3.6V
• Voltage - VCCB: 0.8V ~ 3.6V
• Input Signal: -
• Output Signal: -
• Output Type: Tri-State, Non-Inverted
• Data Rate: 500Mbps
• Operating Temperature: -40°C ~ 125°C (TA)
• Features: -
• Mounting Type: Surface Mount
• Package / Case: 6-TSSOP, SC-88, SOT-363
• Supplier Device Package: 6-TSSOP

pacchetto: 6-TSSOP, SC-88, SOT-363

NTB0102GT,115

NXP

IC TRANSLATING TXRX 8XSON

• Translator Type: Voltage Level
• Channel Type: Bidirectional
• Number of Circuits: 1
• Channels per Circuit: 2
• Voltage - VCCA: 1.2V ~ 3.6V
• Voltage - VCCB: 1.65V ~ 5.5V
• Input Signal: -
• Output Signal: -
• Output Type: Tri-State, Non-Inverted
• Data Rate: 100Mbps
• Operating Temperature: -40°C ~ 125°C (TA)
• Features: Auto-Direction Sensing
• Mounting Type: Surface Mount
• Package / Case: 8-XFDFN
• Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)

pacchetto: 8-XFDFN

SSTUH32865ET/G,557

NXP

IC BUFFER 1.8V 28BIT SOT802-1

• Logic Type: 1:2 Registered Buffer with Parity
• Supply Voltage: 1.7 V ~ 1.9 V
• Number of Bits: 28
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 160-TFBGA
• Supplier Device Package: 160-TFBGA (9x13)

pacchetto: 160-TFBGA

CGY1032,112

NXP

IC AMP POWER SOT115J

• Applications: CATV
• Output Type: -
• Number of Circuits: 1
• -3db Bandwidth: -
• Slew Rate: -
• Current - Supply: 265mA
• Current - Output / Channel: -
• Voltage - Supply, Single/Dual (±): -
• Mounting Type: -
• Package / Case: SOT-115J
• Supplier Device Package: SOT115J

pacchetto: SOT-115J

SC16IS750IBS,157

NXP

IC UART 64BYTE 24HVQFN

• Protocol: RS232, RS485
• Function: Controller
• Interface: I2C, SPI, UART
• Standards: -
• Voltage - Supply: 2.5V, 3.3V
• Current - Supply: 6mA
• Operating Temperature: -40°C ~ 95°C
• Package / Case: 24-VFQFN Exposed Pad
• Supplier Device Package: 24-HVQFN (4x4)

pacchetto: 24-VFQFN Exposed Pad

MPC850ZQ66BU

NXP

IC MPU MPC8XX 66MHZ 256BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 66MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (1)
• SATA: -
• USB: USB 1.x (1)
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 95°C (TA)
• Security Features: -
• Package / Case: 256-BBGA
• Supplier Device Package: 256-PBGA (23x23)

pacchetto: 256-BBGA

XPC850VR50BU

NXP

IC MPU MPC8XX 50MHZ 256BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 50MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (1)
• SATA: -
• USB: USB 1.x (1)
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 95°C (TA)
• Security Features: -
• Package / Case: 256-BBGA
• Supplier Device Package: 256-PBGA (23x23)

pacchetto: 256-BBGA

MPC860SRZQ50D4

NXP

IC MPU MPC8XX 50MHZ 357BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 50MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 95°C (TA)
• Security Features: -
• Package / Case: 357-BBGA
• Supplier Device Package: 357-PBGA (25x25)

pacchetto: 357-BBGA

SVF532R3K1CMK4

NXP

IC MCU 32BIT ROMLESS 364MAPBGA

• Core Processor: ARM? Cortex?-A5 + Cortex?-M4
• Core Size: 32-Bit Dual-Core
• Speed: 400MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG
• Peripherals: LCD, SAI
• Number of I/O: 136
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 1.5MB
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 10x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 364-LFBGA
• Supplier Device Package: 364-MAPBGA (17x17)

pacchetto: 364-LFBGA

MCHC908QY2VDWE

NXP

IC MCU 8BIT 1.5KB FLASH 16SOIC

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: -
• Peripherals: LVD, POR, PWM
• Number of I/O: 13
• Program Memory Size: 1.5KB (1.5K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 4x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 16-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 16-SOIC

pacchetto: 16-SOIC (0.295", 7.50mm Width)

MC9S12XEP100CVL

NXP

IC MCU 16BIT 1MB FLASH 208MAPBGA

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 152
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 32x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 208-BGA
• Supplier Device Package: 208-MAPBGA (17x17)

pacchetto: 208-BGA

S9KEAZ64AMLK

NXP

IC MCU 32BIT 64KB FLASH 80LQFP

• Core Processor: ARM? Cortex?-M0+
• Core Size: 32-Bit
• Speed: 48MHz
• Connectivity: CAN, I2C, LIN, SPI, UART/USART
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 71
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 80-LQFP
• Supplier Device Package: 80-LQFP (14x14)

pacchetto: 80-LQFP

MC9S08SH4CTJR

NXP

IC MCU 8BIT 4KB FLASH 20TSSOP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 17
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 20-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 20-TSSOP

pacchetto: 20-TSSOP (0.173", 4.40mm Width)

MK30DN512VLQ10

NXP

IC MCU 32BIT 512KB FLASH 144LQFP

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART
• Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
• Number of I/O: 102
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 46x16b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

pacchetto: 144-LQFP

MKL05Z8VFK4

NXP

IC MCU 32BIT 8KB FLASH 24QFN

• Core Processor: ARM? Cortex?-M0+
• Core Size: 32-Bit
• Speed: 48MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
• Number of I/O: 22
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 12x12b, D/A 1x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 24-VFQFN Exposed Pad
• Supplier Device Package: 24-QFN (4x4)

pacchetto: 24-VFQFN Exposed Pad

MCF5206ECAB40

NXP

IC MCU 32BIT ROMLESS 160QFP

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 40MHz
• Connectivity: EBI/EMI, I2C, UART/USART
• Peripherals: DMA, WDT
• Number of I/O: 8
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 160-BQFP
• Supplier Device Package: 160-QFP (28x28)

pacchetto: 160-BQFP

MKE02Z32VLD4

NXP

IC MCU 32BIT 32KB FLASH 44LQFP

• Core Processor: ARM? Cortex?-M0+
• Core Size: 32-Bit
• Speed: 40MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: LVD, PWM, WDT
• Number of I/O: 37
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x12b, D/A 2x6b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 44-LQFP
• Supplier Device Package: 44-LQFP (10x10)

pacchetto: 44-LQFP

MK10DX64VFT5

NXP

IC MCU 32BIT 64KB FLASH 48QFN

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 33
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 16x16b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 48-VFQFN Exposed Pad
• Supplier Device Package: 48-QFN-EP (7x7)

pacchetto: 48-VFQFN Exposed Pad

KTY81/110,112

NXP

IC TEMPERATURE SENSOR SOD70

• Resistance in Ohms @ 25°C: 1k
• Resistance Tolerance: -
• Operating Temperature: -55°C ~ 150°C
• Power - Max: -
• Mounting Type: Through Hole
• Package / Case: TO-226-2, TO-92-2 (TO-226AC)
• Supplier Device Package: PBCYT2

pacchetto: TO-226-2, TO-92-2 (TO-226AC)

MPX2300DT1

NXP

PRESSURE SENSE MED 4SIP CHIP PAK

• Pressure Type: Differential
• Operating Pressure: 5.8 PSI (40 kPa)
• Output Type: Wheatstone Bridge
• Output: 0 mV ~ 3.006 mV (6V)
• Accuracy: ±1.5%
• Voltage - Supply: 6 V ~ 10 V
• Port Size: -
• Port Style: No Port
• Features: Temperature Compensated
• Termination Style: PCB
• Maximum Pressure: 125 PSI (861.84 kPa)
• Operating Temperature: 15°C ~ 40°C
• Package / Case: 4-SIP Module
• Supplier Device Package: -

pacchetto: 4-SIP Module

PCF7945MTT/C1AC220

NXP

IC MCU RISC 28TSSOP

• Frequency: -
• Applications: -
• Modulation or Protocol: -
• Data Rate (Max): -
• Power - Output: -
• Current - Transmitting: -
• Data Interface: -
• Antenna Connector: -
• Memory Size: -
• Features: -
• Voltage - Supply: -
• Operating Temperature: -
• Package / Case: -

pacchetto: -

TEF6721HL/V1,518

NXP

IC DIGITAL IF FRONT END 64LQFP

• Frequency: -
• Sensitivity: -
• Data Rate (Max): -
• Modulation or Protocol: AM, FM, WB
• Applications: AM/FM Radio Receiver
• Current - Receiving: -
• Data Interface: PCB, Surface Mount
• Memory Size: -
• Antenna Connector: PCB, Surface Mount
• Features: -
• Voltage - Supply: 5V, 8.5V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

pacchetto: 64-LQFP

SPC5777CRK3MME3

NXP

NXP 32-BIT MCU POWER ARCH CORES

• Core Processor: e200z7
• Core Size: 32-Bit Tri-Core
• Speed: 264MHz
• Connectivity: EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
• Peripherals: DMA, LVD, POR, Zipwire
• Number of I/O: -
• Program Memory Size: 8MB (8M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 512K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 16b Sigma-Delta, eQADC
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 416-BGA
• Supplier Device Package: 416-MAPBGA (27x27)

pacchetto: 416-BGA

SPC5604EEF2MLHR

NXP

NXP 32-BIT MCU POWER ARCH CORE

• Core Processor: e200z0h
• Core Size: 32-Bit
• Speed: 64MHz
• Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
• Peripherals: DMA, POR, WDT
• Number of I/O: 39
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 64K x 8
• RAM Size: 96K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

pacchetto: 64-LQFP

MKV56F512VLQ24

NXP

KINETIS KV56: 220MHZ CORTEX-M7F

• Core Processor: ARM® Cortex®-M7
• Core Size: 32-Bit
• Speed: 240MHz
• Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART
• Peripherals: DMA, LVD, POR, PWM, WDT
• Number of I/O: 111
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 4x12b, 1x16b, D/A 1x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

pacchetto: 144-LQFP