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Prodotti Xilinx Inc.

Record 7.167
Pagina  237/239
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Numero di parte
Produttore
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pacchetto
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Quantità
hot XC17256ELVO8C
Xilinx Inc.

IC 3V SER CFG PROM 256K 8-SOIC

  • Programmable Type: OTP
  • Memory Size: 256Kb
  • Voltage - Supply: 3 V ~ 3.6 V
  • Operating Temperature: 0°C ~ 70°C
  • Package / Case: 8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 8-TSOP
pacchetto: 8-SOIC (0.154", 3.90mm Width)
Azione133.584
XCZU17EG-1FFVE1924E
Xilinx Inc.

IC FPGA 668 I/O 1924FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 926K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1924-BBGA, FCBGA
  • Supplier Device Package: 1924-FCBGA (45x45)
pacchetto: 1924-BBGA, FCBGA
Azione3.984
XCZU3CG-2SBVA484I
Xilinx Inc.

IC FPGA 82 I/O 484FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 533MHz, 1.3GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 154K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-BBGA, FCBGA
  • Supplier Device Package: 484-FCBGA (19x19)
pacchetto: 484-BBGA, FCBGA
Azione7.408
XC7Z100-2FFG1156I
Xilinx Inc.

IC SOC CORTEX A-9 ZYNQ7 1156BGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 800MHz
  • Primary Attributes: Kintex?-7 FPGA, 444K Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
pacchetto: 1156-BBGA, FCBGA
Azione5.216
XC4VLX25-11FFG676I
Xilinx Inc.

IC FPGA 448 I/O 676FCBGA

  • Number of LABs/CLBs: 2688
  • Number of Logic Elements/Cells: 24192
  • Total RAM Bits: 1327104
  • Number of I/O: 448
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
pacchetto: 676-BBGA, FCBGA
Azione2.672
hot XC2V1500-6BGG575C
Xilinx Inc.

IC FPGA 392 I/O 575MBGA

  • Number of LABs/CLBs: 1920
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: 884736
  • Number of I/O: 392
  • Number of Gates: 1500000
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 575-BBGA
  • Supplier Device Package: 575-BGA (31x31)
pacchetto: 575-BBGA
Azione6.736
XC5VFX200T-2FF1738CES
Xilinx Inc.

IC FPGA 960 I/O 1738FCBGA

  • Number of LABs/CLBs: 15360
  • Number of Logic Elements/Cells: 196608
  • Total RAM Bits: 16809984
  • Number of I/O: 960
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1738-BBGA, FCBGA
  • Supplier Device Package: 1738-FCBGA (42.5x42.5)
pacchetto: 1738-BBGA, FCBGA
Azione4.336
hot XCV800-4HQ240C
Xilinx Inc.

IC FPGA 166 I/O 240HQFP

  • Number of LABs/CLBs: 4704
  • Number of Logic Elements/Cells: 21168
  • Total RAM Bits: 114688
  • Number of I/O: 166
  • Number of Gates: 888439
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 240-BFQFP Exposed Pad
  • Supplier Device Package: 240-PQFP (32x32)
pacchetto: 240-BFQFP Exposed Pad
Azione6.176
hot XCV300E-7PQ240C
Xilinx Inc.

IC FPGA 158 I/O 240QFP

  • Number of LABs/CLBs: 1536
  • Number of Logic Elements/Cells: 6912
  • Total RAM Bits: 131072
  • Number of I/O: 158
  • Number of Gates: 411955
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 240-BFQFP
  • Supplier Device Package: 240-PQFP (32x32)
pacchetto: 240-BFQFP
Azione5.680
XC4036XL-1HQ304I
Xilinx Inc.

IC FPGA 256 I/O 304HQFP

  • Number of LABs/CLBs: 1296
  • Number of Logic Elements/Cells: 3078
  • Total RAM Bits: 41472
  • Number of I/O: 256
  • Number of Gates: 36000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 304-BFQFP Exposed Pad
  • Supplier Device Package: 304-PQFP (40x40)
pacchetto: 304-BFQFP Exposed Pad
Azione2.688
XC4020XL-2PQ208I
Xilinx Inc.

IC FPGA 160 I/O 208QFP

  • Number of LABs/CLBs: 784
  • Number of Logic Elements/Cells: 1862
  • Total RAM Bits: 25088
  • Number of I/O: 160
  • Number of Gates: 20000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 208-BFQFP
  • Supplier Device Package: 208-PQFP (28x28)
pacchetto: 208-BFQFP
Azione4.912
hot XC4008E-3PQ160C
Xilinx Inc.

IC FPGA 129 I/O 160QFP

  • Number of LABs/CLBs: 324
  • Number of Logic Elements/Cells: 770
  • Total RAM Bits: 10368
  • Number of I/O: 129
  • Number of Gates: 8000
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 160-BQFP
  • Supplier Device Package: 160-PQFP (28x28)
pacchetto: 160-BQFP
Azione4.528
XQ6VSX475T-1RF1156I
Xilinx Inc.

IC FPGA VIRTEX 6 476K 1156-BGA

  • Number of LABs/CLBs: 37200
  • Number of Logic Elements/Cells: 476160
  • Total RAM Bits: 39223296
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
pacchetto: 1156-BBGA, FCBGA
Azione6.720
XC7VX415T-2FFG1157I
Xilinx Inc.

IC FPGA 600 I/O 1157FCBGA

  • Number of LABs/CLBs: 32200
  • Number of Logic Elements/Cells: 412160
  • Total RAM Bits: 32440320
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.97 V ~ 1.03 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1157-FCBGA (35x35)
pacchetto: 1156-BBGA, FCBGA
Azione4.608
XC7A100T-2FG484I
Xilinx Inc.

IC FPGA 285 I/O 484FCBGA

  • Number of LABs/CLBs: 7925
  • Number of Logic Elements/Cells: 101440
  • Total RAM Bits: 4976640
  • Number of I/O: 285
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
pacchetto: 484-BBGA
Azione7.856
hot XC3S4000-4FGG900I
Xilinx Inc.

IC FPGA 633 I/O 900FBGA

  • Number of LABs/CLBs: 6912
  • Number of Logic Elements/Cells: 62208
  • Total RAM Bits: 1769472
  • Number of I/O: 633
  • Number of Gates: 4000000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA
  • Supplier Device Package: 900-FBGA (31x31)
pacchetto: 900-BBGA
Azione3.968
hot XC6SLX45T-2CSG324I
Xilinx Inc.

IC FPGA 190 I/O 324CSBGA

  • Number of LABs/CLBs: 3411
  • Number of Logic Elements/Cells: 43661
  • Total RAM Bits: 2138112
  • Number of I/O: 190
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 324-LFBGA, CSPBGA
  • Supplier Device Package: 324-CSPBGA (15x15)
pacchetto: 324-LFBGA, CSPBGA
Azione13.920
XC6SLX25-L1CSG324C
Xilinx Inc.

IC FPGA 226 I/O 324CSBGA

  • Number of LABs/CLBs: 1879
  • Number of Logic Elements/Cells: 24051
  • Total RAM Bits: 958464
  • Number of I/O: 226
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 324-LFBGA, CSPBGA
  • Supplier Device Package: 324-CSPBGA (15x15)
pacchetto: 324-LFBGA, CSPBGA
Azione7.952
hot XC3S500E-5CPG132C
Xilinx Inc.

IC FPGA 92 I/O 132CSBGA

  • Number of LABs/CLBs: 1164
  • Number of Logic Elements/Cells: 10476
  • Total RAM Bits: 368640
  • Number of I/O: 92
  • Number of Gates: 500000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 132-TFBGA, CSPBGA
  • Supplier Device Package: 132-CSPBGA (8x8)
pacchetto: 132-TFBGA, CSPBGA
Azione9.252
XC3S400AN-5FTG256C
Xilinx Inc.

IC FPGA 195 I/O 256FTBGA

  • Number of LABs/CLBs: 896
  • Number of Logic Elements/Cells: 8064
  • Total RAM Bits: 368640
  • Number of I/O: 195
  • Number of Gates: 400000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FTBGA (17x17)
pacchetto: 256-LBGA
Azione6.896
hot XC3S400A-4FGG320C
Xilinx Inc.

IC FPGA 251 I/O 320FBGA

  • Number of LABs/CLBs: 896
  • Number of Logic Elements/Cells: 8064
  • Total RAM Bits: 368640
  • Number of I/O: 251
  • Number of Gates: 400000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 320-BGA
  • Supplier Device Package: 320-FBGA (19x19)
pacchetto: 320-BGA
Azione7.284
hot XC9572-15PQ100C
Xilinx Inc.

IC CPLD 72MC 15NS 100QFP

  • Programmable Type: In System Programmable (min 10K program/erase cycles)
  • Delay Time tpd(1) Max: 15.0ns
  • Voltage Supply - Internal: 4.75 V ~ 5.25 V
  • Number of Logic Elements/Blocks: 4
  • Number of Macrocells: 72
  • Number of Gates: 1600
  • Number of I/O: 72
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 100-BQFP
  • Supplier Device Package: 100-PQFP (14x20)
pacchetto: 100-BQFP
Azione17.988
XCR3256XL-10PQ208C
Xilinx Inc.

IC CPLD 256MC 9NS 208QFP

  • Programmable Type: In System Programmable (min 1K program/erase cycles)
  • Delay Time tpd(1) Max: 9.1ns
  • Voltage Supply - Internal: 3 V ~ 3.6 V
  • Number of Logic Elements/Blocks: 16
  • Number of Macrocells: 256
  • Number of Gates: 6000
  • Number of I/O: 164
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 208-BFQFP
  • Supplier Device Package: 208-PQFP (28x28)
pacchetto: 208-BFQFP
Azione3.440
hot XCR3064XL-7VQG44I
Xilinx Inc.

IC CPLD 64MC 7NS 44VQFP

  • Programmable Type: In System Programmable (min 1K program/erase cycles)
  • Delay Time tpd(1) Max: 7.0ns
  • Voltage Supply - Internal: 2.7 V ~ 3.6 V
  • Number of Logic Elements/Blocks: 4
  • Number of Macrocells: 64
  • Number of Gates: 1500
  • Number of I/O: 36
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 44-TQFP
  • Supplier Device Package: 44-VQFP (10x10)
pacchetto: 44-TQFP
Azione5.664
hot XC2C64A-5VQG44C
Xilinx Inc.

IC CPLD 64MC 4.6NS 44VQFP

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 4.6ns
  • Voltage Supply - Internal: 1.7 V ~ 1.9 V
  • Number of Logic Elements/Blocks: 4
  • Number of Macrocells: 64
  • Number of Gates: 1500
  • Number of I/O: 33
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 44-TQFP
  • Supplier Device Package: 44-VQFP (10x10)
pacchetto: 44-TQFP
Azione5.456
hot XC2C32A-6VQG44I
Xilinx Inc.

IC CPLD 32MC 5.5NS 44VQFP

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 5.5ns
  • Voltage Supply - Internal: 1.7 V ~ 1.9 V
  • Number of Logic Elements/Blocks: 2
  • Number of Macrocells: 32
  • Number of Gates: 750
  • Number of I/O: 33
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 44-TQFP
  • Supplier Device Package: 44-VQFP (10x10)
pacchetto: 44-TQFP
Azione8.688
XCDAISY-CPG132
Xilinx Inc.

IC 132 BALL CHIP-SCALE BGA

  • Number of LABs/CLBs: -
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: -
  • Number of I/O: -
  • Number of Gates: -
  • Voltage - Supply: -
  • Mounting Type: -
  • Operating Temperature: -
  • Package / Case: -
  • Supplier Device Package: -
pacchetto: -
Azione5.424
XC7S6-2CSGA225I
Xilinx Inc.

XC7S6-2CSGA225I

  • Number of LABs/CLBs: -
  • Number of Logic Elements/Cells: 6000
  • Total RAM Bits: 184320
  • Number of I/O: 100
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 225-LFBGA, CSPBGA
  • Supplier Device Package: 225-CSPBGA (13x13)
pacchetto: 225-LFBGA, CSPBGA
Azione6.936
XCVU13P-2FHGA2104I
Xilinx Inc.

IC FPGA VIRTEX-UP 2104FCBGA

  • Number of LABs/CLBs: 216000
  • Number of Logic Elements/Cells: 3780000
  • Total RAM Bits: 514867200
  • Number of I/O: 832
  • Number of Gates: -
  • Voltage - Supply: 0.825 V ~ 0.876 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 2104-BBGA, FCBGA
  • Supplier Device Package: 2104-FCBGA (52.5x52.5)
pacchetto: 2104-BBGA, FCBGA
Azione5.552
XCKU3P-L1FFVD900I
Xilinx Inc.

XCKU3P-L1FFVD900I

  • Number of LABs/CLBs: 20340
  • Number of Logic Elements/Cells: 355950
  • Total RAM Bits: 31641600
  • Number of I/O: 304
  • Number of Gates: -
  • Voltage - Supply: 0.698 V ~ 0.876 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
pacchetto: 900-BBGA, FCBGA
Azione7.952