Expanded micro DFN packaging for discrete components | Heisener Electronics
Contattaci
SalesDept@heisener.com +86-755-83210559 ext. 814
Language Translation

* Please refer to the English Version as our Official Version.

Expanded micro DFN packaging for discrete components

Technology Cover
Data di Pubblicazione: 2022-05-19, Nexperia USA Inc.

     Nexperia has released its latest standalone device. AEC-Q101 series devices cover all of the company's product groups, including BC817QBH-Q and BC807QBH-Q series 45V, 500mA NPN/PNP general purpose transistor DFN1110D-3; PDTA143/114/124/144EQB-Q series 50V 100mA PNP resistor DFN1110D-3 package 2N7002KQB - 60V n-channel trench MOSFET and BSS84AKQB - 50V p-channel trench MOSFET. It is available in a lead-free DFN package with side wettable flanks. These space-saving and rugged components help meet the needs of next-generation smart and electric vehicle applications

     The lead-free DFN package is 90% smaller than the SOT23 package, which helps reduce the amount of board space to meet the growing number of electronic components used in the latest vehicles. The side-wettable side feature provides very reliable AOI solder joint quality. Its DFN package offers superior thermal performance with a high Ptot and is also the toughest in the industry, tested for extended life and reliability.

     “Nexperia pioneered side-wetted DFNs and now offers the widest range of AEC-Q101 qualified discrete components in these tiny lead-free packages,” said Mark Roeloffzen, senior vice president and general manager of Nexperia’s Bipolar Discrete Business Group. More than 460 different high-volume devices are available in the DFN1412D-3, DFN1110D-3, and DFN1006BD-2 packages. By offering more devices in these tiny packages, Nexperia offers design engineers greater opportunities to make their The design is forward-thinking and has implications for future mobility. This new technology has been successful with design and commitment from Tier 1 automotive suppliers.”

Prodotti Correlati