Data di Pubblicazione: 2015-09-24
Fujitsu Semiconductor Europe (FSEU) has introduced a new ultra-small package for its 1Mbit SPI FRAM device. The new 8-pin wafer-level chip-scale package (WL-CSP) is another package variant of the existing product MB85RS1MT. Compared with the industry standard SOP-8 package, the new WL-CSP package has a size of 3.09mm x 2.28mm x 0.33mm, which reduces the surface mount area by 77% and reduces the device height by 80%. In this product release, Fujitsu will provide 1Mbit SPI FRAM products with the industry's smallest packaging technology.
The WL-CSP package makes FRAM an ideal non-volatile memory solution for wearable and sensor applications. These rapidly growing markets require ultra-small device sizes, extremely low power consumption to achieve the longest battery life, and high endurance in the write cycle in real-time recording. The company states that it is in these areas that FRAM has outstanding performance.
Although traditional non-volatile memory (such as EEPROM or flash memory) can only withstand a range of 1 million write cycles, the MB85RS1MT FRAM device can provide 10 trillion read / write cycles, allowing flexibility Stores real-time log data. Compared with EEPROM and Flash block access, FRAM can be quickly and flexibly covered into each memory cell without waiting time. As a result, FRAM consumes much lower energy in write accesses and helps extend battery life, especially for wearable / sensor applications with frequent recording capabilities.
In the end, the tiny 8-pin WL-CSP package only accounts for 5% of the SOP-8 installation volume, enabling designers to implement more miniature applications.
The MB85RS1MT device operates in a voltage range of 1.8V to 3.6V, and "guarantees" 10 years of data retention at a temperature of 85C. Operating temperature range is -40C to 85C.
