Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Silicon Labs |
IC CLK BUFFER 1:8 350MHZ 24QFN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione2.544 |
|
1 | 1:8 | Yes/No | CML, HCSL, LVDS, LVPECL | SSTL | 350MHz | 1.71 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
Cypress Semiconductor Corp |
IC CLK BUFFER 1:8 350MHZ 38TSSOP
|
pacchetto: 38-TFSOP (0.173", 4.40mm Width) |
Azione3.488 |
|
1 | 1:8 | Yes/Yes | LVDS, LVPECL, LVTTL | LVPECL | 350MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 38-TFSOP (0.173", 4.40mm Width) | 38-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 1:9 133.33MHZ 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione2.416 |
|
1 | 1:9 | No/No | LVTTL | LVTTL | 133.33MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 1:9 133.33MHZ 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione7.856 |
|
1 | 1:9 | No/No | LVTTL | LVTTL | 133.33MHz | 3 V ~ 3.6 V | 0°C ~ 70°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:18 150MHZ 48SSOP
|
pacchetto: 48-BSSOP (0.295", 7.50mm Width) |
Azione3.408 |
|
1 | 1:18 | No/No | Clock | Clock | 150MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 48-BSSOP (0.295", 7.50mm Width) | 48-SSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:4 350MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione3.568 |
|
1 | 2:4 | No/Yes | LVCMOS, LVTTL | LVDS | 350MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:5 3GHZ 32TQFP
|
pacchetto: 32-LQFP |
Azione7.088 |
|
2 | 1:5 | Yes/Yes | CML, LVDS, LVPECL, SSTL | ECL, LVPECL | 3GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-TQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:3 2GHZ 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione5.216 |
|
2 | 1:3 | Yes/Yes | CML, LVDS, LVPECL, SSTL | ECL, LVPECL | 2GHz | 2.375 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:16 500MHZ 48TQFP
|
pacchetto: 48-LQFP |
Azione6.032 |
|
1 | 1:16 | Yes/Yes | HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVHSTL | 500MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 48-LQFP | 48-LQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:4 200MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione51.372 |
|
1 | 1:4 | No/No | CMOS | CMOS | 200MHz | 2.375 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:4 160MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione174.000 |
|
1 | 1:4 | No/No | CMOS | CMOS | 160MHz | 3 V ~ 5.5 V | 0°C ~ 70°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC CLK BUFFER 1:4 160MHZ 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione14.892 |
|
1 | 1:4 | Yes/Yes | PECL | TTL | 160MHz | 4.75 V ~ 5.25 V | 0°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Microchip Technology |
IC CLK BUFFER 2:4 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione6.208 |
|
1 | 2:4 | Yes/Yes | ECL, PECL | ECL, PECL | - | 3 V ~ 3.8 V | 0°C ~ 85°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Microchip Technology |
IC CLK BUFFER 1:4 2GHZ 16MLF
|
pacchetto: 16-VFQFN Exposed Pad, 16-MLF? |
Azione79.716 |
|
1 | 1:4 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 2GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
ON Semiconductor |
IC CLK MULTI 1:6/1:3 3GHZ 32LQFP
|
pacchetto: 32-LQFP |
Azione11.076 |
|
1 or 2 | 1:6, 1:3 | Yes/Yes | LVCMOS, LVPECL | LVPECL | 3GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
ON Semiconductor |
IC CLK BUFFER 2:8 80MHZ 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione5.632 |
|
1 | 2:8 | Yes/No | PECL, TTL | TTL | 80MHz | 4.75 V ~ 5.25 V | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
ON Semiconductor |
IC CLK FANOUT/BUFFER 1:6 8TSSOP
|
pacchetto: 14-TSSOP (0.173", 4.40mm Width) |
Azione7.728 |
|
1 | 1:6 | No/No | LVCMOS | LVCMOS | 250MHz | 1.71 V ~ 3.6 V | -40°C ~ 105°C | Surface Mount | 14-TSSOP (0.173", 4.40mm Width) | 14-TSSOP |
||
Diodes Incorporated |
LVPECL BUFFER
|
pacchetto: - |
Azione3.392 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 1:6 100MHZ 20VFQFPN
|
pacchetto: 20-VFQFN Exposed Pad |
Azione6.320 |
|
1 | 1:6 | No/No | Crystal | LVCMOS, LVTTL | 100MHz | 1.6 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 20-VFQFN Exposed Pad | 20-VFQFPN (4x4) |
||
Diodes Incorporated |
IC CLK BUFFER 1:3 25MHZ 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione4.480 |
|
1 | 1:3 | No/No | LVCMOS, Crystal | LVCMOS | 25MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 1:2 40MHZ 6DFN
|
pacchetto: 6-UFDFN Exposed Pad |
Azione2.384 |
|
1 | 1:2 | No/No | Crystal | LVCMOS | 40MHz | 1.62 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 6-UFDFN Exposed Pad | 6-DFN (1.3x2) |
||
Diodes Incorporated |
CLOCK BUFFER QSOP-20
|
pacchetto: - |
Azione7.088 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Diodes Incorporated |
IC CLK BUFFER 1:5 133MHZ 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione6.084 |
|
1 | 1:5 | No/No | CMOS, TTL | CMOS, TTL | 133MHz | 2.97 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:8 500MHZ 24TSSOP
|
pacchetto: 24-TSSOP (0.173", 4.40mm Width) |
Azione6.976 |
|
1 | 1:8 | Yes/Yes | HCSL, LVDS, LVHSTL, LVPECL, SSTL | HCSL | 500MHz | 2.97 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 24-TSSOP (0.173", 4.40mm Width) | 24-TSSOP |
||
Texas Instruments |
IC CLK BUF 1:10 200MHZ 24TSSOP
|
pacchetto: 24-TSSOP (0.173", 4.40mm Width) |
Azione4.864 |
|
1 | 1:10 | No/No | LVTTL | LVTTL | 200MHz | 2.3 V ~ 3.6 V | -55°C ~ 125°C | Surface Mount | 24-TSSOP (0.173", 4.40mm Width) | 24-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:10 2.5GHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione10.080 |
|
1 | 2:10 | Yes/Yes | LVDS, LVPECL, SSTL | ECL, PECL | 2.5GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-VFQFN (5x5) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:4 250MHZ 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione17.760 |
|
1 | 1:4 | No/Yes | LVCMOS, LVTTL | LVDS | 250MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Texas Instruments |
IC CLK BUFFER 2:4 800MHZ 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione5.424 |
|
1 | 2:4 | Yes/Yes | LVCMOS, LVDS, LVPECL | LVDS | 800MHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC TIMING
|
pacchetto: 32-VFQFN Exposed Pad |
Azione6.096 |
|
1 | 2:4 | Yes/Yes | HCSL, LVDS, LVPECL | HCSL | 350MHz | 3V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 32-VFQFN Exposed Pad | 32-VFQFPN (5x5) |
||
Microchip Technology |
IC CLK BUFF MUX 2:6 750MHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione2.064 |
|
1 | 2:6 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |