Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
IDT, Integrated Device Technology Inc |
IC CLK MULTPX 2:6 250MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione6.400 |
|
1 | 2:6 | No/No | LVCMOS, LVTTL | LVCMOS, LVTTL | 250MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:4 650MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione4.944 |
|
1 | 2:4 | Yes/Yes | Clock, Crystal | LVPECL | 650MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:10 100MHZ 20QSOP
|
pacchetto: 20-SSOP (0.154", 3.90mm Width) |
Azione2.064 |
|
1 | 1:10 | No/No | LVCMOS | LVCMOS, TTL | 100MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.154", 3.90mm Width) | 20-QSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:4 266MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione7.424 |
|
1 | 2:4 | No/Yes | LVCMOS, LVTTL | LVPECL | 266MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 1:5 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione4.320 |
|
2 | 1:5 | No/No | CMOS, LVTTL | CMOS, LVTTL | - | 4.75 V ~ 5.25 V | 0°C ~ 70°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:18 150MHZ 48SSOP
|
pacchetto: 48-BSSOP (0.295", 7.50mm Width) |
Azione6.228 |
|
1 | 1:18 | No/No | Clock | Clock | 150MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 48-BSSOP (0.295", 7.50mm Width) | 48-SSOP |
||
ON Semiconductor |
IC CLK BUFFER 2:6 700MHZ 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione2.832 |
|
1 | 2:6 | Yes/Yes | ECL, PECL | ECL, PECL | 700MHz | 4.2 V ~ 5.7 V | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 2:4 1GHZ 16MLF
|
pacchetto: 16-VFQFN Exposed Pad, 16-MLF? |
Azione5.520 |
|
1 | 2:4 | No/Yes | LVCMOS, LVTTL | LVPECL | 1GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:9 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione220.632 |
|
1 | 1:9 | Yes/Yes | PECL | PECL | - | 4.2 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Texas Instruments |
IC CLK BUFFER 2:10 3.5GHZ 32LQFP
|
pacchetto: 32-LQFP |
Azione5.472 |
|
1 | 2:10 | Yes/Yes | HSTL, LVPECL | LVPECL | 3.5GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
Microsemi Corporation |
IC CLK BUFF MUX 2:8 750MHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione5.056 |
|
1 | 2:8 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVDS | 750MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 1:5 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione17.304 |
|
2 | 1:5 | No/No | CMOS, LVTTL | CMOS, LVTTL | - | 4.75 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microsemi Corporation |
IC CLK BUFFER 1:4 750MHZ 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione2.528 |
|
1 | 1:4 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVDS | 750MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
Silicon Labs |
IC CLK BUFFER 1:4 HCSL 24QFN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione3.904 |
|
1 | 1:4 | Yes/Yes | CML, HCSL, LVDS, LVPECL | HCSL | 250MHz | 1.71 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:4 200MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione3.120 |
|
1 | 1:4 | No/No | Clock | Clock | 200MHz | 2.375 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Diodes Incorporated |
1 TO 6 OUTPUT LVCMOS FANOUT BUFF
|
pacchetto: - |
Azione2.064 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:10 100MHZ 20QSOP
|
pacchetto: 20-SSOP (0.154", 3.90mm Width) |
Azione5.856 |
|
1 | 1:10 | No/No | TTL | TTL | 100MHz | 4.75 V ~ 5.25 V | 0°C ~ 70°C | Surface Mount | 20-SSOP (0.154", 3.90mm Width) | 20-QSOP |
||
Microchip Technology |
IC CLK BUFFER 1:2 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione24.000 |
|
1 | 1:2 | Yes/Yes | Clock | Clock | - | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Diodes Incorporated |
IC CLK BUFFER 1:4 140MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.880 |
|
1 | 1:4 | No/No | CMOS, TTL | LVCMOS | 140MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Analog Devices Inc. |
IC CLK BUFFER 1:2 7.5GHZ 16LFCSP
|
pacchetto: 16-VFQFN Exposed Pad, CSP |
Azione64.044 |
|
1 | 1:2 | Yes/Yes | Clock | ECL, NECL, PECL | 7.5GHz | 2.375 V ~ 3.63 V | -40°C ~ 125°C | Surface Mount | 16-VFQFN Exposed Pad, CSP | 16-LFCSP-VQ (3x3) |
||
IDT, Integrated Device Technology Inc |
IC NETWORK TIMING
|
pacchetto: - |
Azione6.240 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
CLOCK SYNTHESIZE/GENERATOR/PLL
|
pacchetto: - |
Azione4.992 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC CLK BUFF MUX 2:8 750MHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione5.280 |
|
1 | 2:8 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVDS | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Texas Instruments |
IC CLK BUFFER 1:8 250MHZ 48VQFN
|
pacchetto: - |
Request a Quote |
|
1 | 1:8 | Yes/Yes | Clock, HCSL | Clock, HCSL | 250 MHz | 3V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | 48-VQFN (6x6) |
||
Microchip Technology |
IC CLK BUFFER 2:8 1.5GHZ 48QFN
|
pacchetto: - |
Azione384 |
|
1 | 2:8 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL, SSTL | CML, HCSL, LVCMOS, LVDS, LVPECL, SSTL | 1.5 GHz | 2.375V ~ 2.625V, 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount, Wettable Flank | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
Cypress Semiconductor Corp |
IC ZD BUFFER 32TQFP
|
pacchetto: - |
Request a Quote |
|
- | 2:8 | No/No | LVCMOS, LVTTL | LVTTL | - | 2.25V ~ 2.75V, 2.97V ~ 3.63V | 0°C ~ 70°C (TA) | Surface Mount | 32-TQFP | 32-TQFP (7x7) |
||
Renesas Electronics Corporation |
IC CLK BUFFER 1:4 2GHZ 28VFQFPN
|
pacchetto: - |
Request a Quote |
|
2 | 1:4 | No/No | LVDS, LVPECL | LVDS | 2 GHz | 2.375V ~ 2.625V | -40°C ~ 85°C | Surface Mount | 28-WFQFN Exposed Pad | 28-VFQFPN (5x5) |
||
Microchip Technology |
IC CLK BUFFER 1:20 250MHZ 80GQFN
|
pacchetto: - |
Azione75 |
|
1 | 1:20 | Yes/Yes | Differential or Single-Ended | HCSL | 250 MHz | 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 80-WFQFN Dual Rows, Exposed Pad | 80-GQFN (6x6) |