Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC CLK BUFFER 1:4 40MHZ 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione6.576 |
|
1 | 1:4 | No/No | Crystal | LVCMOS | 40MHz | 1.62 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
ON Semiconductor |
IC CLK BUFFER 2:24 1GHZ 64LQFP
|
pacchetto: 64-LQFP Exposed Pad |
Azione6.960 |
|
1 | 2:24 | Yes/Yes | ECL, LVDS, LVPECL, NECL, PECL | ECL, PECL | 1GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 64-LQFP Exposed Pad | 64-LQFP (10x10) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:5 250MHZ 48TSSOP
|
pacchetto: 48-TFSOP (0.240", 6.10mm Width) |
Azione7.136 |
|
1 | 1:5 | Yes/Yes | eHSTL, HSTL, LVPECL, LVTTL | eHSTL, HSTL, LVTTL | 250MHz | 2.4 V ~ 2.6 V | -40°C ~ 85°C | Surface Mount | 48-TFSOP (0.240", 6.10mm Width) | 48-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 1:10 250MHZ 48TSSOP
|
pacchetto: 48-TFSOP (0.240", 6.10mm Width) |
Azione5.680 |
|
1 | 1:10 | Yes/No | eHSTL, HSTL, LVPECL, LVTTL | eHSTL, HSTL, LVTTL | 250MHz | 2.4 V ~ 2.6 V | -40°C ~ 85°C | Surface Mount | 48-TFSOP (0.240", 6.10mm Width) | 48-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 1:5 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione3.456 |
|
2 | 1:5 | No/No | CMOS, LVTTL | CMOS, LVTTL | - | 4.75 V ~ 5.25 V | 0°C ~ 70°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK MULTPX 16:1 24TSSOP
|
pacchetto: 24-TSSOP (0.173", 4.40mm Width) |
Azione3.376 |
|
1 | 16:1 | No/Yes | LVCMOS, LVTTL | LVDS, LVPECL | 250MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 24-TSSOP (0.173", 4.40mm Width) | 24-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK MULTIPLX 4:1/2:1 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione3.392 |
|
1 | 4:1, 2:1 | Yes/Yes | HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 750MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 2:9 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione4.928 |
|
1 | 2:9 | Yes/Yes | PECL, TTL | PECL | - | 4.75 V ~ 5.25 V | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
ON Semiconductor |
IC CLK BUFFER 2:10 5.5GHZ 52QFN
|
pacchetto: 52-VFQFN Exposed Pad |
Azione5.488 |
|
1 | 2:10 | Yes/Yes | CML, LVCMOS, LVDS, LVNECL, LVPECL, LVTTL | CML | 5.5GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 52-VFQFN Exposed Pad | 52-QFN (8x8) |
||
Microchip Technology |
IC CLK BUFFER 1:9 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione34.872 |
|
1 | 1:9 | Yes/Yes | PECL | PECL | - | 4.2 V ~ 5.5 V | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Fairchild/ON Semiconductor |
IC CLK BUFFER 1:2 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.592 |
|
1 | 1:2 | Yes/Yes | ECL | ECL | - | 4.2 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Texas Instruments |
IC CLK BUFFER 1:4 60MHZ 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione5.664 |
|
2 | 1:4 | No/No | TTL | CMOS | 60MHz | 4.5 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
ON Semiconductor |
IC CLK BUFFER 1:12 250MHZ 32LQFP
|
pacchetto: 32-LQFP |
Azione5.072 |
|
1 | 1:12 | No/No | LVCMOS, LVTTL | LVCMOS | 250MHz | 1.6 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP |
||
ON Semiconductor |
IC CLK BUFFER 2:5 1GHZ 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione5.840 |
|
1 | 2:5 | Yes/Yes | ECL, PECL | ECL, PECL | 1GHz | 4.2 V ~ 5.7 V | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microsemi Corporation |
IC CLK BUFFER 1:8 750MHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione7.552 |
|
1 | 1:8 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVDS | 750MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Silicon Labs |
IC TRANSLATOR BUFF/LEVEL 44QFN
|
pacchetto: 44-VFQFN Exposed Pad |
Azione5.760 |
|
1 | 2:10 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | CML, HCSL, LVCMOS, LVDS, LVPECL | 725MHz | 1.71 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 44-VFQFN Exposed Pad | 44-QFN (7x7) |
||
Diodes Incorporated |
IC CLOCK BUFFER MUX 2:10 32QFN
|
pacchetto: 32-TQFP |
Azione2.704 |
|
1 | 2:10 | Yes/Yes | CML, LVDS, LVPECL, SSTL | LVPECL | 1.5GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-TQFP | 32-TQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 1:5 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione4.592 |
|
2 | 1:5 | No/No | CMOS, LVTTL | CMOS, LVTTL | - | 4.5 V ~ 5.5 V | 0°C ~ 70°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Diodes Incorporated |
IC CLK BUFFER 1:5 100MHZ 20QSOP
|
pacchetto: 20-SSOP (0.154", 3.90mm Width) |
Azione36.000 |
|
2 | 1:5 | No/No | CMOS, TTL | CMOS | 100MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.154", 3.90mm Width) | 20-QSOP |
||
Diodes Incorporated |
IC CLK BUFFER 1:4 140MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione11.292 |
|
1 | 1:4 | No/No | CMOS, TTL | LVCMOS | 140MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Analog Devices Inc. |
IC CLK BUFFER 2:5 1.2GHZ 48LFCSP
|
pacchetto: 48-VFQFN Exposed Pad, CSP |
Azione33.888 |
|
1 | 2:5 | Yes/Yes | Clock | CMOS, LVDS, LVPECL | 1.2GHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad, CSP | 48-LFCSP-VQ (7x7) |
||
Microsemi Corporation |
6 OUTPUT PROGRAMMABLE FANOUT BUF
|
pacchetto: - |
Azione8.052 |
|
1 | 4:6 | Yes/Yes | CMOS, Crystal | CML, CMOS, HCSL, HSTL, LVDS, LVPECL, SSTL | 1.035GHz | 1.71 V ~ 3.465 V | -40°C ~ 85°C | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:5 650MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione28.056 |
|
1 | 2:5 | Yes/Yes | HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 650MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Diodes Incorporated |
IC CLK BUFFER 1:5 133MHZ 16QSOP
|
pacchetto: 16-SSOP (0.154", 3.90mm Width) |
Azione28.872 |
|
1 | 1:5 | No/No | CMOS, TTL | CMOS, TTL | 133MHz | 2.97 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-SSOP (0.154", 3.90mm Width) | 16-QSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:12 250MHZ 32TQFP
|
pacchetto: 32-LQFP |
Azione9.264 |
|
1 | 1:12 | No/No | LVCMOS, LVTTL | LVCMOS, LVTTL | 250MHz | 1.6 V ~ 3.465 V | 0°C ~ 85°C | Surface Mount | 32-LQFP | 32-TQFP (7x7) |
||
Cypress Semiconductor Corp |
IC CLOCK DISTRIBUTION QFN
|
pacchetto: - |
Azione6.672 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
NETWORK TIMING
|
pacchetto: 40-VFQFN Exposed Pad |
Azione3.792 |
|
2 | 2:12 | Yes/Yes | LVCMOS, LVDS, LVPECL | LVDS | 2GHz | 1.71 V ~ 2.7 V | -40°C ~ 85°C (TA) | Surface Mount | 40-VFQFN Exposed Pad | 40-VFQFPN (6x6) |
||
IDT, Integrated Device Technology Inc |
NETWORK TIMING
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione3.840 |
|
1 | 4:1 | Yes/Yes | CML, LVDS, LVPECL | LVDS | 2.5GHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 20-TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione7.888 |
|
1 | 1:10 | No/No | LVTTL | CMOS, TTL | 200MHz | 1.71 V ~ 3.45 V | -40°C ~ 105°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Analog Devices Inc. |
IC CLK BUFFER 1:2 14GHZ 16SMD
|
pacchetto: 16-VFCQFN Exposed Pad |
Azione6.976 |
|
1 | 1:2 | Yes/Yes | CML | CML | 14GHz | -3 V ~ -3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFCQFN Exposed Pad | 16-CSMT (3x3) |