Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC CLK BUFFER 3:4 266MHZ 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione5.136 |
|
1 | 3:4 | No/Yes | LVCMOS, LVTTL | LVPECL | 266MHz | 2.375 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3.5x3) |
||
Microchip Technology |
IC CLK BUFFER 1:4 150MHZ 16QFN
|
pacchetto: - |
Azione7.376 |
|
1 | 1:4 | No/No | LVCMOS | LVCMOS | 150MHz | 2.25 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | - | - |
||
Cypress Semiconductor Corp |
IC CLK BUFFER 1:2 1.5GHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione3.264 |
|
1 | 1:2 | Yes/Yes | CML, LVPECL | CML | 1.5GHz | 2.375 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:10 100MHZ 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione3.248 |
|
1 | 1:10 | No/No | LVTTL | CMOS, TTL | 100MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:18 150MHZ 48SSOP
|
pacchetto: 48-BSSOP (0.295", 7.50mm Width) |
Azione3.520 |
|
1 | 1:18 | No/No | Clock | Clock | 150MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 48-BSSOP (0.295", 7.50mm Width) | 48-SSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:2 700MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.784 |
|
1 | 1:2 | Yes/Yes | HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVHSTL | 700MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC CLK BUFFER 2:9 500MHZ 32TQFP
|
pacchetto: 32-TQFP |
Azione3.120 |
|
1 | 2:9 | Yes/Yes | HSTL, LVPECL | HSTL | 500MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 32-TQFP | 32-TQFP (7x7) |
||
Microchip Technology |
IC CLK BUFFER 1:9 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione3.312 |
|
1 | 1:9 | Yes/Yes | PECL | PECL | - | 4.2 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Diodes Incorporated |
IC CLK BUFFER 1:5 133MHZ 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione5.040 |
|
2 | 1:5 | No/No | CMOS | CMOS | 133MHz | 2.97 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC CLK BUFFER 1:2 3GHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.040 |
|
1 | 1:2 | Yes/Yes | LVECL, LVPECL | LVECL, LVPECL | 3GHz | 2.375 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC CLK BUFFER 1:2 3GHZ 8MSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione7.488 |
|
1 | 1:2 | Yes/Yes | LVECL, LVPECL | LVECL, LVPECL | 3GHz | 2.375 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Microchip Technology |
IC CLK BUFFER 2:5 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione5.936 |
|
1 | 2:5 | Yes/Yes | ECL, PECL | ECL, PECL | - | 3 V ~ 5.5 V | 0°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
ON Semiconductor |
IC CLK BUFFER 2:8 1GHZ 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione14.988 |
|
1 | 2:8 | Yes/Yes | LVECL, LVPECL | LVECL, LVPECL | 1GHz | 3 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
ON Semiconductor |
IC CLK BUFFER 2:6 6GHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione4.080 |
|
1 | 2:6 | Yes/Yes | CML, LVDS, LVPECL | CML | 6GHz | 1.71 V ~ 1.89 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microsemi Corporation |
10 OUTPUT PROGRAMMABLE FANOUT BU
|
pacchetto: - |
Azione7.808 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC CLK BUFFER 1:2 2GHZ 16MLF
|
pacchetto: 16-VFQFN Exposed Pad, 16-MLF? |
Azione2.656 |
|
1 | 1:2 | Yes/Yes | CML, HSTL, LVDS, LVPECL | LVDS | 2GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:1 200MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione7.520 |
|
1 | 1:1 | No/No | LVCMOS, Sine Wave | LVCMOS | 200MHz | 2.5 V ~ 3.3 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER MUX 1:4 24-TSSOP
|
pacchetto: - |
Azione5.136 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC CLK MULTPX 8:1 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione7.312 |
|
1 | 8:1 | No/No | LVCMOS, LVTTL | LVCMOS, LVTTL | 250MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 1:2 200MHZ 6DFN
|
pacchetto: 6-UFDFN Exposed Pad |
Azione3.968 |
|
1 | 1:2 | No/No | LVCMOS | LVCMOS | 200MHz | 1.62 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 6-UFDFN Exposed Pad | 6-DFN (1.3x2) |
||
Diodes Incorporated |
CLOCK SAW OSCILLATOR SEAM7050
|
pacchetto: - |
Azione7.264 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Diodes Incorporated |
IC CLK BUFFER 1:7 133MHZ 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione4.384 |
|
1 | 1:7 | No/No | CMOS, TTL | CMOS, TTL | 133MHz | 2.97 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Analog Devices Inc. |
IC CLK BUFFER 1:4 7GHZ 16LFCSP
|
pacchetto: 16-WFQFN Exposed Pad, CSP |
Azione9.468 |
|
1 | 1:4 | Yes/Yes | CML, CMOS, LVDS, LVPECL | ECL, LVPECL | 7GHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-WFQFN Exposed Pad, CSP | 16-LFCSP-WQ (3x3) |
||
Diodes Incorporated |
IC CLK BUFF 1:10 250MHZ
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione6.720 |
|
1 | 1:10 | No/No | LVCMOS, LVTTL | LVCMOS, LVTTL | 250MHz | 1.1 V ~ 2.7 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Diodes Incorporated |
IC CLK BUFFER 1:5 133MHZ 16QSOP
|
pacchetto: 16-SSOP (0.154", 3.90mm Width) |
Azione5.904 |
|
1 | 1:5 | No/No | CMOS, TTL | CMOS, TTL | 133MHz | 2.97 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-SSOP (0.154", 3.90mm Width) | 16-QSOP |
||
Diodes Incorporated |
IC CLK BUFFER MUX 2:4 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione7.056 |
|
1 | 2:4 | No/Yes | LVCMOS, LVPECL, LVTTL | LVPECL | 500MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 1:8 1.5GHZ 32MLF
|
pacchetto: 32-VFQFN Exposed Pad, 32-MLF? |
Azione14.772 |
|
1 | 1:8 | Yes/Yes | CML, LVDS, PECL | LVPECL | 1.5GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, 32-MLF? | 32-MLF? (5x5) |
||
ON Semiconductor |
IC CLK BUFFER 2:5 2GHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione4.112 |
|
1 | 2:5 | Yes/Yes | ECL, HSTL, PECL | ECL, PECL | 2GHz | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Texas Instruments |
IC CLK BUFFER 2:12 800MHZ 40VQFN
|
pacchetto: 40-VFQFN Exposed Pad |
Azione7.664 |
|
1 | 2:12 | Yes/Yes | LVCMOS, LVDS, LVPECL | LVDS | 800MHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-VQFN (6x6) |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 20-VFQFPN
|
pacchetto: 20-VFQFN Exposed Pad |
Azione5.616 |
|
1 | 1:10 | No/No | LVTTL | CMOS, TTL | 200MHz | 1.71 V ~ 3.45 V | -40°C ~ 105°C | Surface Mount | 20-VFQFN Exposed Pad | 20-VFQFPN (3x3) |