Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Exar Corporation |
IC JITTER ATTENUATOR 4CH 80TQFP
|
pacchetto: 80-LQFP |
Azione2.688 |
|
Serial | 1 | 3.135 V ~ 5.25 V | 140mA | - | -40°C ~ 85°C | Surface Mount | 80-LQFP | 80-TQFP (14x14) |
|
|
|
Microsemi Corporation |
IC VOICEPORT 2CH FXS 4KHZ 80LQFP
|
pacchetto: 80-LQFP |
Azione4.032 |
|
PCM | 2 | - | - | - | - | Surface Mount | 80-LQFP | 80-eLQFP |
|
|
Silicon Labs |
IC PROSLIC FXS WIDEB -110V 60QFN
|
pacchetto: 60-WFQFN Exposed Pad |
Azione4.832 |
|
GCI, PCM, SPI | 1 | 3.13 V ~ 3.47 V | - | - | -40°C ~ 85°C | Surface Mount | 60-WFQFN Exposed Pad | 60-QFN (8x8) |
|
|
Cypress Semiconductor Corp |
IC TXRX HOTLINK II DUAL 196LBGA
|
pacchetto: 196-LBGA |
Azione3.280 |
|
LVTTL | 2 | 3.135 V ~ 3.465 V | 570mA | - | 0°C ~ 70°C | Surface Mount | 196-LBGA | 196-FBGA (15x15) |
|
|
Maxim Integrated |
IC QUAD DS3/E3 TXRX 400BGA
|
pacchetto: 400-BBGA |
Azione3.024 |
|
DS3, E3 | 4 | 3.135 V ~ 3.465 V | 725mA | - | 0°C ~ 70°C | Surface Mount | 400-BBGA | 400-PBGA (27x27) |
|
|
NXP |
IC TRANSMISSION LV 16-DIP
|
pacchetto: 16-DIP (0.300", 7.62mm) |
Azione3.952 |
|
- | 1 | 3.4V | 900µA | 666mW | -25°C ~ 75°C | Through Hole | 16-DIP (0.300", 7.62mm) | 16-DIP |
|
|
Maxim Integrated |
IC TRANSCEIVER E1 QUAD 5V 256BGA
|
pacchetto: 256-BGA |
Azione5.568 |
|
E1 | 4 | 5V | - | - | - | Surface Mount | 256-BGA | 256-BGA (27x27) |
|
|
|
Maxim Integrated |
IC LINE QUAD 3.3V E1/T1/J1 BGA
|
pacchetto: 144-BGA |
Azione4.672 |
|
- | 4 | 3.135 V ~ 3.465 V | 320mA | - | -40°C ~ 85°C | Surface Mount | 144-BGA | 144-TEPBGA (17x17) |
|
|
|
Exar Corporation |
IC LIU SH T1/E1/J1 14CH 304TBGA
|
pacchetto: 304-BBGA |
Azione3.504 |
|
LIU | 14 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 304-BBGA | 304-PBGA (31x31) |
|
|
Microsemi Corporation |
IC TXRX SGL E1 W/LIU 100MQFP
|
pacchetto: 100-BQFP |
Azione6.368 |
|
- | 1 | 4.75 V ~ 5.25 V | 150mA | - | -40°C ~ 85°C | Surface Mount | 100-BQFP | 100-MQFP (14x20) |
|
|
Maxim Integrated |
IC TXRX T1/E1/J1 SGL 100-LQFP
|
pacchetto: 100-LQFP |
Azione10.932 |
|
E1, HDLC, J1, T1 | 1 | 3.14 V ~ 3.47 V | 75mA | - | -40°C ~ 85°C | Surface Mount | 100-LQFP | 100-LQFP (14x14) |
|
|
|
IDT, Integrated Device Technology Inc |
IC LIU T1/J1/E1 2CH SHORT 80TQFP
|
pacchetto: 80-LQFP |
Azione4.048 |
|
LIU | - | 3.13 V ~ 3.47 V | - | - | -40°C ~ 85°C | Surface Mount | 80-LQFP | 80-TQFP (14x14) |
|
|
Texas Instruments |
IC SOURCE RINGER CTRLR 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione2.624 |
|
- | 1 | 5V | 500µA | - | 0°C ~ 70°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
|
|
|
Silicon Labs |
IC PROSLIC FXS ISI DTMF 48QFN
|
pacchetto: - |
Azione7.344 |
|
3-Wire, PCM | 2 | 3.3V | - | - | 0°C ~ 70°C | - | - | - |
|
|
Silicon Labs |
IC PROSLIC PCM/SPI -110V 42QFN
|
pacchetto: 42-WFQFN Exposed Pad |
Azione7.360 |
|
GCI, PCM, SPI | 1 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 42-WFQFN Exposed Pad | 42-QFN (5x7) |
|
|
Microsemi Corporation |
IC TXRX DTMF 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione9.000 |
|
- | 1 | 4.75 V ~ 5.25 V | 7mA | - | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
|
|
IXYS Integrated Circuits Division |
IC LINE CARD ACCESS SW 16-SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione2.912 |
|
- | 1 | 4.5 V ~ 5.5 V | - | 10mW | -40°C ~ 110°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
|
|
Silicon Labs |
IC PROSLIC DUAL FXS ANLG 48-QFN
|
pacchetto: 48-VFQFN Exposed Pad |
Azione7.840 |
|
- | 1 | 3.15 V ~ 3.45 V | - | - | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
|
|
Microsemi Corporation |
IC SLIC 2CH UNIV 100V 48QFN
|
pacchetto: 48-VFQFN Exposed Pad |
Azione72.744 |
|
4-Wire | 2 | 3.135 V ~ 3.465 V | 25mA | - | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
|
|
Linear Technology |
IC RING TONE GENERATOR 14-SOIC
|
pacchetto: 14-SOIC (0.154", 3.90mm Width) |
Azione6.372 |
|
- | 1 | - | - | - | 0°C ~ 125°C | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | 14-SOIC |
|
|
|
Microsemi Corporation |
IC TXRX DTMF 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione40.800 |
|
- | 1 | 4.75 V ~ 5.25 V | 7mA | - | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
|
|
|
Microchip Technology |
DUAL 10G (R)-XAUI PHY WITH PREMI
|
pacchetto: - |
Azione3.696 |
|
- | - | - | - | - | - | - | - | - |
|
|
|
Microchip Technology |
IC ETHERNET PHY QUAD 256BGA
|
pacchetto: - |
Azione4.176 |
|
- | 1 | 1V | - | - | - | Surface Mount | - | 256-BGA (17x17) |
|
|
|
Silicon Labs |
WIDEBAND FXS WITH ISI INTERFACE
|
pacchetto: 38-QFN |
Azione2.048 |
|
3-Wire | 1 | 3.3V | - | - | 0°C ~ 70°C | Surface Mount | 38-QFN | 38-QFN (4x6) |
|
|
Microchip Technology |
12 PORT GE PHY W/QSGMII MAC I/F
|
pacchetto: 302-TQFP |
Azione4.784 |
|
- | - | - | - | - | - | Surface Mount | 302-TQFP | 302-TQFP (24x24) |
|
|
|
Microchip Technology |
8CH NG SLAC QFN164
|
pacchetto: - |
Azione3.872 |
|
- | - | - | - | - | - | - | - | - |
|
|
|
Microchip Technology |
IC SLIC 1CH UNIV 150V 28PLCC
|
pacchetto: - |
Azione7.648 |
|
Parallel | 1 | 3.3V | 40mA | - | - | Surface Mount | - | 28-PLCC |
|
|
|
Microchip Technology |
8 CHANNEL 10/100 OR 1XGE ETHERNE
|
pacchetto: - |
Azione5.968 |
|
- | - | - | - | - | - | - | - | - |
|
|
|
Microchip Technology |
IC TRANSCODER QUAD ADPCM 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione3.232 |
|
- | 4 | 4.5V ~ 5.5V | 5mA | - | -40°C ~ 85°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
|
|
|
Microchip Technology |
IC SUBSCRIBER NETWRK DNIC 24SSOP
|
pacchetto: - |
Azione2.016 |
|
- | 1 | 4.75V ~ 5.25V | 10mA | - | -40°C ~ 85°C | Surface Mount | - | 24-SSOP |
