Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC CODEC VOIP 100-TQFP
|
pacchetto: 100-LQFP |
Azione6.000 |
|
PCM | 1 | - | - | - | - | Surface Mount | 100-LQFP | PG-TQFP-100 |
||
Infineon Technologies |
IC CODEC W/TRANSCEIVER MQFP-64
|
pacchetto: 64-QFP |
Azione6.976 |
|
IOM-2, Parallel, SCI | 1 | 3.3V, 5V | 27mA | - | - | Surface Mount | 64-QFP | P-64-MQFP |
||
Microsemi Corporation |
IC SLIC 1CH P RV 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione5.216 |
|
2-Wire | 1 | 4.75 V ~ 5.25 V | - | - | 0°C ~ 70°C | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
Maxim Integrated |
IC FRAMER 6PORT DS3/E3 HCBGA
|
pacchetto: 349-BGA Exposed Pad |
Azione4.512 |
|
LIU | 1 | 2.4 V ~ 5.5 V | 480mA | - | 0°C ~ 70°C | Surface Mount | 349-BGA Exposed Pad | 349-TE-PBGA-2 (27x27) |
||
Maxim Integrated |
IC SOFTWARE GENERATOR EBERT PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione7.248 |
|
E1, J1, T1 | 1 | 3 V ~ 3.6 V | 50mA | - | 0°C ~ 70°C | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Cirrus Logic Inc. |
IC LIU DUAL T1/E1 64LQFP
|
pacchetto: 64-LQFP |
Azione7.596 |
|
E1, T1 | 2 | 3.135 ~ 5.25 V | - | 350mW | -40°C ~ 85°C | Surface Mount | 64-LQFP | 64-LQFP |
||
Silicon Labs |
IC PROSLIC FXS DUAL -110V 50QFN
|
pacchetto: - |
Azione7.232 |
|
GCI, PCM, SPI | 1 | 3.3V | - | - | - | Surface Mount | - | 50-QFN (6x8) |
||
Exar Corporation |
IC LIU T1/E1/J1 14CH 304TBGA
|
pacchetto: 304-BBGA |
Azione13.044 |
|
LIU | 14 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 304-BBGA | 304-PBGA (31x31) |
||
Exar Corporation |
IC LIU E1 QUAD 80TQFP
|
pacchetto: 80-LQFP |
Azione4.592 |
|
LIU | - | 4.75 V ~ 5.25 V | - | - | -40°C ~ 85°C | Surface Mount | 80-LQFP | 80-TQFP (14x14) |
||
Maxim Integrated |
IC ELASTIC STORE T1/CEPT 16-SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione6.368 |
|
PCM | 1 | 4.5 V ~ 5.5 V | 9mA | - | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Maxim Integrated |
IC TRANSCEIVER T1 IND 44-PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione2.096 |
|
T1 | 1 | 4.5 V ~ 5.5 V | 3mA | - | -40°C ~ 85°C | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Microsemi Corporation |
IC VOICE ECHO CANCEL 365MCMBGA
|
pacchetto: 365-BBGA |
Azione3.152 |
|
- | 1 | 3 V ~ 3.6 V | 65µA | - | -40°C ~ 85°C | Surface Mount | 365-BBGA | 365-BGA (27x27) |
||
Microsemi Corporation |
IC TXRX DTMF 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione4.096 |
|
- | 1 | 4.75 V ~ 5.25 V | 7mA | - | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC |
||
IXYS Integrated Circuits Division |
IC OPT-ISOLATED MULTIFUNC 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione58.908 |
|
- | 1 | - | - | 1W | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Silicon Labs |
IC PROSLIC FXS DC-DC -110V 42QFN
|
pacchetto: 42-WFQFN Exposed Pad |
Azione83.328 |
|
GCI, PCM, SPI | 1 | 3.3V | - | - | 0°C ~ 70°C | Surface Mount | 42-WFQFN Exposed Pad | 42-QFN (5x7) |
||
Microsemi Solutions Sdn Bhd. |
6.5GBPS QUAD REDRIVER WITH CROSS
|
pacchetto: - |
Azione11.400 |
|
- | 2 | 2.5V | - | - | -40°C ~ 110°C | Surface Mount | - | 32-QFN (5x5) |
||
Maxim Integrated |
IC TXRX MAC/PHY 64-LQFP
|
pacchetto: 64-LQFP |
Azione8.268 |
|
SPI, UART | 1 | - | - | - | -40°C ~ 105°C | Surface Mount | 64-LQFP | 64-LQFP (10x10) |
||
Maxim Integrated |
IC MODULATOR DRVR 10GBPS 24-TQFN
|
pacchetto: 24-WFQFN Exposed Pad |
Azione6.720 |
|
- | 1 | -5.5 V ~ -4.9 V | 140mA | - | -40°C ~ 85°C | Surface Mount | 24-WFQFN Exposed Pad | 24-TQFN (4x4) |
||
Broadcom Limited |
TRANSCEIVER
|
pacchetto: - |
Azione4.880 |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
ETHERNET SWITCH 10GE
|
pacchetto: - |
Azione2.000 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
11-PORT CE SWITCH ENGINE WITH CU
|
pacchetto: - |
Azione4.080 |
|
- | - | - | - | - | - | - | - | - |
||
Silicon Labs |
WIDEBAND FXS WITH ISI INTERFACE,
|
pacchetto: 38-QFN |
Azione2.528 |
|
3-Wire | 1 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 38-QFN | 38-QFN (4x6) |
||
ams |
INTERFACE TELECOM
|
pacchetto: Die |
Azione5.456 |
|
Serial | 1 | - | 3mA | - | -25°C ~ 70°C | Surface Mount | Die | Die |
||
Microchip Technology |
TEMUX 336NG, PB FREE BUMP
|
pacchetto: - |
Azione2.576 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC DGTL SWITCH DHS 84PLCC
|
pacchetto: 84-LCC (J-Lead) |
Azione2.128 |
|
Parallel | 1 | 4.75V ~ 5.25V | 100mA | - | -40°C ~ 85°C | Surface Mount | 84-LCC (J-Lead) | 84-PLCC |
||
Microchip Technology |
IC TXRX DTMF 3V 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione4.688 |
|
- | 1 | 2.7V ~ 3.6V | 3.1mA | - | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
TEMUX-84 WITH E3 MAPPERS, DS3/E3
|
pacchetto: 324-FBGA |
Azione2.576 |
|
E1, J1, T1 | - | 1.8V, 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 324-FBGA | 324-PBGA (23x23) |
||
Microchip Technology |
IC DGTL SWITCH F16KDX 272BGA
|
pacchetto: 272-BGA |
Azione4.416 |
|
- | 1 | 3V ~ 3.6V | 160mA | - | -40°C ~ 85°C | Surface Mount | 272-BGA | 272-PBGA (27x27) |
||
Microchip Technology |
IC TDM SWITCH 4K-CH ENH 256BGA
|
pacchetto: 256-BGA |
Azione4.944 |
|
- | 1 | 1.71V ~ 1.89V | 130mA | - | -40°C ~ 85°C | Surface Mount | 256-BGA | 256-BGA (17x17) |
||
Microchip Technology |
IC SLIC 1CH 52DB LGBAL 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione5.536 |
|
2-Wire | 1 | 4.75V ~ 5.25V | - | - | 0°C ~ 70°C | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |