Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC NETWORK TERMINATOR MQFP-64
|
pacchetto: 64-QFP |
Azione5.664 |
|
ISDN, SCI | 1 | 3.3V | 30mA | - | 0°C ~ 70°C | Surface Mount | 64-QFP | P-64-MQFP |
||
Infineon Technologies |
IC SPEECH AND VOICE MQFP-44
|
pacchetto: 44-QFP |
Azione2.624 |
|
IOM-2, SCI | 1 | 5V | 97.5mA | - | - | Surface Mount | 44-QFP | P-MQFP-44 |
||
Microsemi Corporation |
IC SLIC 1CH UNIV 100V 28QFN
|
pacchetto: - |
Azione3.296 |
|
Parallel | 1 | 3.3V | 40mA | - | - | - | - | - |
||
Microsemi Corporation |
IC SLIC 1CH 52DB LGBAL 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione6.656 |
|
2-Wire | 1 | 4.75 V ~ 5.25 V | - | - | 0°C ~ 70°C | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
Exar Corporation |
IC LIU E3/DS3/STS-1 6CH 217BGA
|
pacchetto: 217-BBGA |
Azione3.056 |
|
LIU | 6 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 217-BBGA | 217-BGA (23x23) |
||
Maxim Integrated |
IC RECEIVE LINE INTERFACE 18-DIP
|
pacchetto: 18-DIP (0.300", 7.62mm) |
Azione3.680 |
|
T1 | 1 | 4.75 V ~ 5.25 V | 18mA | - | 0°C ~ 70°C | Through Hole | 18-DIP (0.300", 7.62mm) | 18-PDIP |
||
IXYS Integrated Circuits Division |
IC DAA W/HALF-WAVE RING 32-SOIC
|
pacchetto: 32-SOIC (0.295", 7.50mm Width) |
Azione19.392 |
|
- | 1 | 3 V ~ 5.5 V | 10mA | 1W | 0°C ~ 85°C | Surface Mount | 32-SOIC (0.295", 7.50mm Width) | 32-SOIC |
||
Maxim Integrated |
IC CONTROLLER E1 5V LP 40-DIP
|
pacchetto: 40-DIP (0.600", 15.24mm) |
Azione7.824 |
|
Parallel/Serial | - | 4.5 V ~ 5.5 V | 10mA | - | 0°C ~ 70°C | Through Hole | 40-DIP (0.600", 15.24mm) | 40-PDIP |
||
Maxim Integrated |
IC BUFFER RECEIVE T1 IND 24-DIP
|
pacchetto: 24-DIP (0.300", 7.62mm) |
Azione6.240 |
|
TDM | 1 | - | 5mA | - | 0°C ~ 70°C | Through Hole | 24-DIP (0.300", 7.62mm) | 24-PDIP |
||
Maxim Integrated |
IC ELASTIC STORE T1/CEPT 16-SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione7.472 |
|
PCM | 1 | 4.5 V ~ 5.5 V | 9mA | - | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Texas Instruments |
IC SOURCE RINGER CNTRLR 28-DIP
|
pacchetto: 28-DIP (0.600", 15.24mm) |
Azione3.856 |
|
- | 1 | 5V | 500µA | - | 0°C ~ 70°C | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP |
||
Microsemi Corporation |
IC TDM SWITCH 512CH 144LBGA
|
pacchetto: 144-LBGA |
Azione6.704 |
|
- | 1 | 3 V ~ 3.6 V | 250mA | - | -40°C ~ 85°C | Surface Mount | 144-LBGA | 144-LBGA (13x13) |
||
Microsemi Corporation |
IC VOICE LINE VCPNG 128CH 128TQF
|
pacchetto: 128-TQFP |
Azione7.008 |
|
2-Wire | - | - | - | - | - | Surface Mount | 128-TQFP | 128-TQFP |
||
Microsemi Corporation |
IC SLIC 2CH UNIV 150V 48QFN
|
pacchetto: 48-VFQFN Exposed Pad |
Azione6.832 |
|
4-Wire | 2 | 3.135 V ~ 3.465 V | 25mA | - | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
Microsemi Corporation |
IC RECEIVER DTMF 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione34.416 |
|
- | 1 | 2.7 V ~ 3.6 V | 2mA | - | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
Microsemi Corporation |
IC DGTL SWITCH FLEX 344BGA
|
pacchetto: 344-BBGA |
Azione27.300 |
|
- | 1 | 3 V ~ 3.6 V | 480mA | - | -40°C ~ 85°C | Surface Mount | 344-BBGA | 344-PBGA (27x27) |
||
Microsemi Corporation |
IC TXRX DTMF 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione6.320 |
|
- | 1 | 4.75 V ~ 5.25 V | 7mA | - | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microsemi Corporation |
IC TXRX DTMF 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione18.408 |
|
- | 1 | 4.75 V ~ 5.25 V | 7mA | - | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
NXP |
CABLE FST DEMOD
|
pacchetto: - |
Azione2.768 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC ETHERNET CLK OUTPUTS 256BGA
|
pacchetto: - |
Azione7.536 |
|
- | 1 | - | - | - | - | Surface Mount | - | 256-BGA (17x17) |
||
Microchip Technology |
IC INTERFACE CONTROLLER
|
pacchetto: 256-BGA |
Azione2.352 |
|
- | - | - | - | - | - | Surface Mount | 256-BGA | 256-BGA (17x17) |
||
Microchip Technology |
IC INTERFACE CONTROLLER
|
pacchetto: - |
Azione3.184 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC ENHANCED DIGITAL SWITCH
|
pacchetto: - |
Azione3.712 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC ECHO CANCEL ACOUSTIC 36SSOP
|
pacchetto: 36-BSOP (0.295", 7.50mm Width) |
Azione5.760 |
|
Serial | 1 | 2.7V ~ 3.6V | 3µA | - | -40°C ~ 85°C | Surface Mount | 36-BSOP (0.295", 7.50mm Width) | 36-QSOP |
||
Microchip Technology |
IC DAA CHIPSET 1CHAN 10MSOP
|
pacchetto: - |
Azione5.616 |
|
- | 1 | - | - | - | - | Surface Mount | - | 10-MSOP |
||
Microchip Technology |
IC CESOP PROC 1024CH 552BGA
|
pacchetto: 552-BGA |
Azione2.448 |
|
TDM | 1 | 1.65V ~ 1.95V | 950mA | - | -40°C ~ 85°C | Surface Mount | 552-BGA | 552-PBGA (35x35) |
||
Microchip Technology |
IC RECEIVER DTMF 16PAIR 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione4.064 |
|
- | 1 | 4.75V ~ 5.25V | 3mA | - | -40°C ~ 85°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Broadcom Limited |
24GE + 4X10GE SWITCH
|
pacchetto: - |
Azione2.416 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC TDM/TSI SWITCH 128X128 40DIP
|
pacchetto: 40-DIP (0.600", 15.24mm) |
Azione2.736 |
|
- | 1 | 4.75V ~ 5.25V | 6mA | - | -40°C ~ 85°C | Through Hole | 40-DIP (0.600", 15.24mm) | 40-PDIP |
||
Texas Instruments |
INTERFACE TELECOM
|
pacchetto: Die |
Azione3.792 |
|
- | 1 | 10V ~ 28V | 23mA | - | -25°C ~ 85°C | Surface Mount | Die | Wafer |