Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microsemi Corporation |
IC SLAC 1FXS 1CH HV 48LQFP
|
pacchetto: - |
Azione3.808 |
|
- | 1 | - | - | - | - | - | - | - |
||
Microsemi Corporation |
IC TDM/TSI SWITCH 256X256 40DIP
|
pacchetto: 40-DIP (0.600", 15.24mm) |
Azione7.616 |
|
- | 1 | 4.75 V ~ 5.25 V | 10mA | - | -40°C ~ 85°C | Through Hole | 40-DIP (0.600", 15.24mm) | 40-PDIP |
||
Microsemi Corporation |
IC SLIC 1CH 100V MTRG 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione16.824 |
|
2-Wire | 1 | 5V | - | - | 0°C ~ 70°C | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
Microsemi Corporation |
IC VOICE LINE VCP 32CH 144LBGA
|
pacchetto: - |
Azione16.764 |
|
2-Wire | 32 | 3.3V | - | - | - | Surface Mount | - | 144-LBGA |
||
Microsemi Corporation |
IC LINE CARD LCAS 1CH 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione98.976 |
|
- | 1 | 4.5 V ~ 5.5 V | - | - | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Silicon Labs |
IC PROSLIC FXS DTMF -110V 42QFN
|
pacchetto: 42-WFQFN Exposed Pad |
Azione5.712 |
|
GCI, PCM, SPI | 1 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 42-WFQFN Exposed Pad | 42-QFN (5x7) |
||
Cirrus Logic Inc. |
IC LIU DUAL T1/E1 64LQFP
|
pacchetto: 64-LQFP |
Azione6.512 |
|
E1, T1 | 2 | 3.135 ~ 5.25 V | - | 350mW | -40°C ~ 85°C | Surface Mount | 64-LQFP | 64-LQFP |
||
Intersil |
IC LINE DVR DIFF 300MHZ 10HMSOP
|
pacchetto: 10-VFSOP, 10-MSOP (0.118", 3.00mm Width) Exposed Pad |
Azione219.036 |
|
- | 1 | 4.5 V ~ 12 V | 6mA | - | -40°C ~ 85°C | Surface Mount | 10-VFSOP, 10-MSOP (0.118", 3.00mm Width) Exposed Pad | 10-HMSOP |
||
Maxim Integrated |
IC OCTAL FRAMER T1/E1/J1 256BGA
|
pacchetto: 256-LBGA, CSBGA |
Azione5.392 |
|
WAN | 8 | 3.135 V ~ 3.465 V | 275mA | - | -40°C ~ 85°C | Surface Mount | 256-LBGA, CSBGA | 256-CSBGA (17x17) |
||
Exar Corporation |
IC LIU LH/SH T1/E1 SGL 64TQFP
|
pacchetto: - |
Azione3.552 |
|
- | 1 | 3.135 V ~ 3.465 V | - | - | - | - | - | - |
||
Microsemi Corporation |
IC VOICE ECHO CANCELLER 535BGA
|
pacchetto: 535-BGA |
Azione3.776 |
|
- | 1 | 1.6 V ~ 2 V | 10mA | - | -40°C ~ 85°C | Surface Mount | 535-BGA | 535-PBGA (31x31) |
||
Exar Corporation |
IC LIU E3/DS3/STS-1 4CH 176LQFP
|
pacchetto: 176-LQFP |
Azione9.552 |
|
LIU | 4 | 3.135 V ~ 3.465 V | 450mA | - | -40°C ~ 85°C | Surface Mount | 176-LQFP | 176-TQFP (24x24) |
||
Exar Corporation |
SINGLE CH E1 LIU WITH C/R
|
pacchetto: - |
Azione16.536 |
|
- | - | - | - | - | - | - | - | - |
||
Silicon Labs |
IC PROSLIC FXS DUAL -110V 60QFN
|
pacchetto: 60-WFQFN Exposed Pad |
Azione39.756 |
|
GCI, PCM, SPI | 1 | 3.13 V ~ 3.47 V | - | - | 0°C ~ 70°C | Surface Mount | 60-WFQFN Exposed Pad | 60-QFN (8x8) |
||
Silicon Labs |
IC PROSLIC PCM/SPI -140V 42QFN
|
pacchetto: 42-WFQFN Exposed Pad |
Azione4.800 |
|
- | - | - | - | - | - | Surface Mount | 42-WFQFN Exposed Pad | 42-QFN (5x7) |
||
Silicon Labs |
IC SLIC/CODEC 1CH 38TSSOP
|
pacchetto: 38-TFSOP (0.173", 4.40mm Width) |
Azione24.000 |
|
GCI, PCM, SPI | 1 | 3.13 V ~ 5.25 V | 88mA | 700mW | 0°C ~ 70°C | Surface Mount | 38-TFSOP (0.173", 4.40mm Width) | 38-TSSOP |
||
IXYS Integrated Circuits Division |
IC OPT-ISOLATED MULTIFUNC 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione10.992 |
|
- | 1 | - | - | 1W | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Silicon Labs |
IC SLIC/CODEC 1CH 38QFN
|
pacchetto: 38-VFQFN Exposed Pad |
Azione84.096 |
|
GCI, PCM, SPI | 1 | 3.13 V ~ 5.25 V | 88mA | 700mW | 0°C ~ 70°C | Surface Mount | 38-VFQFN Exposed Pad | 38-QFN (5x7) |
||
Microsemi Corporation |
IC 1FXO CHIPSET 1CH OLAC 10MSOP
|
pacchetto: - |
Azione2.672 |
|
- | 1 | - | - | - | - | Surface Mount | - | 10-MSOP |
||
IXYS Integrated Circuits Division |
IC RELAY OPTO 120MA 8SMD
|
pacchetto: 8-SMD, Gull Wing |
Azione7.488 |
|
- | 2 | - | - | 800mW | -40°C ~ 85°C | Surface Mount | 8-SMD, Gull Wing | 8-SMD |
||
IXYS Integrated Circuits Division |
IC RELAY OPTO 100MA 8FLTPK
|
pacchetto: 8-SMD, Gull Wing |
Azione5.424 |
|
- | 2 | - | - | 800mW | -40°C ~ 85°C | Surface Mount | 8-SMD, Gull Wing | 8-Flatpack |
||
Silicon Labs |
IC VOICE DAA SYSTEM SIDE 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione116.796 |
|
GCI, PCM, SPI | 1 | 3 V ~ 3.6 V | 8.5mA | - | 0°C ~ 70°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Microsemi Solutions Sdn Bhd. |
25 PORT L2 SWITCH W/12 GIGE CUPH
|
pacchetto: - |
Azione6.360 |
|
Serial | 1 | 1V | - | - | - | Surface Mount | - | 302-TQFP (24x24) |
||
STMicroelectronics |
IC TXRX S-FSK PWR LINE 48VFQFPN
|
pacchetto: 48-VFQFN Exposed Pad |
Azione24.006 |
|
UART | 1 | 8 V ~ 18 V | - | - | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-VQFN Exposed Pad (7x7) |
||
Microsemi Corporation |
84/63 CHANNEL T1/E1 FRAMER DEVIC
|
pacchetto: - |
Azione3.744 |
|
- | - | - | - | - | - | - | - | - |
||
Renesas Electronics America |
IC LINE DRIVER VDSL2 DIFF 16QFN
|
pacchetto: 16-TQFN Exposed Pad |
Azione4.608 |
|
- | 1 | ±4 V ~ 6.6 V, 8 V ~ 13.2 V | - | - | -40°C ~ 85°C | Surface Mount | 16-TQFN Exposed Pad | 16-QFN (4x4) |
||
Microchip Technology |
96-PORT (240G) STS-1 CROSS-CONNE
|
pacchetto: - |
Azione7.152 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC RECEIVER DTMF 50DB 18SOIC
|
pacchetto: 18-SOIC (0.295", 7.50mm Width) |
Azione4.800 |
|
Parallel | 1 | 4.75V ~ 5.25V | 3mA | - | -40°C ~ 85°C | Surface Mount | 18-SOIC (0.295", 7.50mm Width) | 18-SOIC |
||
Microchip Technology |
ARROW 24XFE
|
pacchetto: - |
Azione5.408 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC SLIC 2CH UNIV 150V 48TQFP
|
pacchetto: - |
Azione6.336 |
|
Parallel | 2 | 3.3V | 40mA | - | - | Surface Mount | - | 48-eTQFP |