Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Cypress Semiconductor Corp |
IC MEM FLASH NOR
|
pacchetto: - |
Azione5.664 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 1GBIT 400MHZ 134TFBGA
|
pacchetto: 134-TFBGA |
Azione3.152 |
|
DRAM | SDRAM - Mobile LPDDR2-S4 | 1Gb (32M x 32) | Parallel | 400MHz | 15ns | - | 1.14 V ~ 1.95 V | -40°C ~ 85°C (TC) | Surface Mount | 134-TFBGA | 134-TFBGA (10x11.5) |
||
Micron Technology Inc. |
IC FLASH 2TBIT 167MHZ 152LBGA
|
pacchetto: - |
Azione2.128 |
|
FLASH | FLASH - NAND | 2Tb (256G x 8) | Parallel | 167MHz | - | - | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | - | - | - |
||
Micron Technology Inc. |
IC FLASH 256GBIT 83MHZ 48TSOP
|
pacchetto: - |
Azione5.904 |
|
FLASH | FLASH - NAND | 256Gb (32G x 8) | Parallel | 83MHz | - | - | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | - | - | - |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 64MBIT 166MHZ 90BGA
|
pacchetto: 90-TFBGA |
Azione4.384 |
|
DRAM | SDRAM - Mobile | 64Mb (2M x 32) | Parallel | 166MHz | - | 5.5ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 90-TFBGA | 90-TFBGA (8x13) |
||
Micron Technology Inc. |
IC FLASH 64GBIT 83MHZ 100TBGA
|
pacchetto: 100-TBGA |
Azione6.640 |
|
FLASH | FLASH - NAND | 64Gb (8G x 8) | Parallel | 83MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 100-TBGA | 100-TBGA (12x18) |
||
Micron Technology Inc. |
IC FLASH 32GBIT 48TSOP
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione7.088 |
|
FLASH | FLASH - NAND | 32Gb (4G x 8) | Parallel | - | - | - | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP I |
||
Texas Instruments |
IC NVSRAM 64KBIT 70NS 28DIP
|
pacchetto: 28-DIP Module (0.61", 15.49mm) |
Azione5.184 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 64Kb (8K x 8) | Parallel | - | 70ns | 70ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 28-DIP Module (0.61", 15.49mm) | 28-DIP Module (18.42x37.72) |
||
ISSI, Integrated Silicon Solution Inc |
IC DRAM 16MBIT 50NS 44TSOP
|
pacchetto: 44-TSOP (0.400", 10.16mm Width) |
Azione3.056 |
|
DRAM | DRAM - EDO | 16Mb (1M x 16) | Parallel | - | - | 25ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP II |
||
Cypress Semiconductor Corp |
IC SRAM 16MBIT 45NS 48TSOP
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione4.432 |
|
SRAM | SRAM - Asynchronous | 16Mb (1M x 16) | Parallel | - | 45ns | 45ns | 2.2 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP I |
||
Micron Technology Inc. |
IC SDRAM 512MBIT 133MHZ 66TSOP
|
pacchetto: 66-TSSOP (0.400", 10.16mm Width) |
Azione2.100 |
|
DRAM | SDRAM - DDR | 512Mb (64M x 8) | Parallel | 133MHz | 15ns | 750ps | 2.3 V ~ 2.7 V | -40°C ~ 85°C (TA) | Surface Mount | 66-TSSOP (0.400", 10.16mm Width) | 66-TSOP |
||
Microchip Technology |
IC EEPROM 512KBIT 10MHZ 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione6.432 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | SPI | 10MHz | 10ms | - | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Microchip Technology |
IC EEPROM 16KBIT 3MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.080 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | SPI | 3MHz | 5ms | - | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Texas Instruments |
IC NVSRAM 1MBIT 70NS 32DIP
|
pacchetto: 32-DIP Module (0.61", 15.49mm) |
Azione5.248 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 1Mb (128K x 8) | Parallel | - | 70ns | 70ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 32-DIP Module (0.61", 15.49mm) | 32-DIP Module (18.42x42.8) |
||
Micron Technology Inc. |
IC FLASH 512GBIT 83MHZ 152TBGA
|
pacchetto: - |
Azione6.672 |
|
FLASH | FLASH - NAND | 512Gb (64G x 8) | Parallel | 83MHz | - | - | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC SRAM 144KBIT 15NS 68PLCC
|
pacchetto: 68-LCC (J-Lead) |
Azione7.232 |
|
SRAM | SRAM - Dual Port, Asynchronous | 144Kb (16K x 9) | Parallel | - | 15ns | 15ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 68-LCC (J-Lead) | 68-PLCC (24.21x24.21) |
||
Microchip Technology |
IC EEPROM 1MBIT 150NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione7.616 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Cypress Semiconductor Corp |
IC NVSRAM 4MBIT 25NS 54TSOP
|
pacchetto: 54-TSOP (0.400", 10.16mm Width) |
Azione7.376 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 4Mb (256K x 16) | Parallel | - | 25ns | 25ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 54-TSOP (0.400", 10.16mm Width) | 54-TSOP II |
||
IDT, Integrated Device Technology Inc |
IC SRAM 8KBIT 35NS 64TQFP
|
pacchetto: 64-LQFP |
Azione4.144 |
|
SRAM | SRAM - Dual Port, Asynchronous | 8Kb (1K x 8) | Parallel | - | 35ns | 35ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 64-LQFP | 64-TQFP (10x10) |
||
Cypress Semiconductor Corp |
ASYNC SRAMS
|
pacchetto: - |
Azione7.312 |
|
SRAM | SRAM - Asynchronous | 4Mb (256K x 16) | Parallel | - | 10ns | 10ns | 2.2 V ~ 3.6 V | -40°C ~ 85°C (TA) | - | - | - |
||
Macronix |
IC FLASH 256MBIT 80MHZ 8WSON
|
pacchetto: 8-WDFN Exposed Pad |
Azione3.216 |
|
FLASH | FLASH - NOR | 256Mb (32M x 8) | SPI | 80MHz | 300µs, 5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (8x6) |
||
Winbond Electronics |
IC SDRAM 1GBIT 667MHZ 78BGA
|
pacchetto: 78-TFBGA |
Azione17.628 |
|
DRAM | SDRAM - DDR3 | 1Gb (128M x 8) | Parallel | 667MHz | - | 20ns | 1.425 V ~ 1.575 V | 0°C ~ 95°C (TC) | Surface Mount | 78-TFBGA | 78-WBGA (10.5x8) |
||
Micron Technology Inc. |
IC FLASH 128MBIT 70NS 64LBGA
|
pacchetto: 64-LBGA |
Azione5.136 |
|
FLASH | FLASH - NOR | 128Mb (16M x 8, 8M x 16) | Parallel | - | 60ns | 95ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 64-LBGA | 64-LBGA (11x13) |
||
Microchip Technology |
IC EEPROM 64KBIT 400KHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione5.824 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | I2C | 400kHz | 5ms | 900ns | 1.8 V ~ 6 V | 0°C ~ 70°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM 8KBIT 10MHZ 8MSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione7.840 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | SPI | 10MHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Cypress Semiconductor Corp |
IC FLASH 64M PARALLEL 48TSOP
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione3.616 |
|
FLASH | FLASH - NOR | 64Mb (8M x 8, 4M x 16) | Parallel | - | 90ns | 90ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
Cypress Semiconductor Corp |
IC MEMORY NOR
|
pacchetto: - |
Azione2.912 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Winbond Electronics |
IC FLASH MEMORY 32MB
|
pacchetto: - |
Azione6.240 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Cypress Semiconductor Corp |
IC FLASH MEMORY SMD
|
pacchetto: - |
Azione2.656 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Cypress Semiconductor Corp |
IC SRAM 16M PARALLEL 48VFBGA
|
pacchetto: - |
Azione5.552 |
|
- | - | - | - | - | - | - | - | - | - | - | - |