Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics |
IC FLASH 128MBIT 104MHZ 8SOIC
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione5.696 |
|
FLASH | FLASH - NOR | 128Mb (16M x 8) | SPI | 104MHz | 3ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
||
Micron Technology Inc. |
IC FLASH 8MBIT 70NS 48TSOP
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione5.536 |
|
FLASH | FLASH - NOR | 8Mb (1M x 8, 512K x 16) | Parallel | - | 70ns | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 125°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
Micron Technology Inc. |
IC RLDRAM 576MBIT 533MHZ 144UBGA
|
pacchetto: 144-TFBGA |
Azione2.192 |
|
DRAM | DRAM | 576Mb (16M x 36) | Parallel | 533MHz | - | 15ns | 1.7 V ~ 1.9 V | 0°C ~ 95°C (TC) | Surface Mount | 144-TFBGA | 144-µBGA (18.5x11) |
||
Adesto Technologies |
IC FLASH 1MBIT 66MHZ 8UDFN
|
pacchetto: 8-UDFN Exposed Pad |
Azione6.448 |
|
FLASH | FLASH | 1Mb (264 Bytes x 512 pages) | SPI | 66MHz | 4ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-UDFN Exposed Pad | 8-UDFN (5x6) |
||
Microchip Technology |
IC EEPROM 1KBIT 20MHZ 8MINIMAP
|
pacchetto: 8-UFDFN Exposed Pad |
Azione7.664 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | SPI | 20MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-Mini Map (2x3) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 256KBIT 15NS 28SOJ
|
pacchetto: 28-BSOJ (0.300", 7.62mm Width) |
Azione4.112 |
|
SRAM | SRAM - Asynchronous | 256Kb (32K x 8) | Parallel | - | 15ns | 15ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 28-BSOJ (0.300", 7.62mm Width) | 28-SOJ |
||
IDT, Integrated Device Technology Inc |
IC SRAM 1MBIT 20NS 32SOJ
|
pacchetto: 32-BSOJ (0.400", 10.16mm Width) |
Azione12.972 |
|
SRAM | SRAM - Asynchronous | 1Mb (128K x 8) | Parallel | - | 20ns | 20ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 32-BSOJ (0.400", 10.16mm Width) | 32-SOJ |
||
Cypress Semiconductor Corp |
IC SRAM 72MBIT 167MHZ 165FBGA
|
pacchetto: 165-LBGA |
Azione2.128 |
|
SRAM | SRAM - Synchronous, QDR II | 72Mb (2M x 36) | Parallel | 167MHz | - | - | 1.7 V ~ 1.9 V | 0°C ~ 70°C (TA) | Surface Mount | 165-LBGA | 165-FBGA (15x17) |
||
Micron Technology Inc. |
IC FLASH 4MBIT 55NS 48TSOP
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione13.896 |
|
FLASH | FLASH - NOR | 4Mb (512K x 8, 256K x 16) | Parallel | - | 55ns | 55ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
Cypress Semiconductor Corp |
IC SRAM 36MBIT 200MHZ 100TQFP
|
pacchetto: 100-LQFP |
Azione3.312 |
|
SRAM | SRAM - Synchronous | 36Mb (1M x 36) | Parallel | 200MHz | - | 3.2ns | 3.135 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x20) |
||
Micron Technology Inc. |
IC FLASH 4MBIT 80NS 48TSOP
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione2.480 |
|
FLASH | FLASH - NOR | 4Mb (512K x 8, 256K x 16) | Parallel | - | 80ns | 80ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP I |
||
Microchip Technology |
IC FLASH 2MBIT 100NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione3.040 |
|
FLASH | FLASH | 2Mb (256K x 8) | Parallel | - | 10ms | 100ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC FLASH 2MBIT 90NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione3.168 |
|
FLASH | FLASH | 2Mb (256K x 8) | Parallel | - | 50µs | 90ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
IDT, Integrated Device Technology Inc |
IC SRAM 2MBIT 133MHZ 208QFP
|
pacchetto: 208-BFQFP |
Azione3.456 |
|
SRAM | SRAM - Dual Port, Synchronous | 2Mb (64K x 36) | Parallel | 133MHz | - | 4.2ns | 2.4 V ~ 2.6 V | -40°C ~ 85°C (TA) | Surface Mount | 208-BFQFP | 208-PQFP (28x28) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 1MBIT 9NS 100TQFP
|
pacchetto: 100-LQFP |
Azione6.352 |
|
SRAM | SRAM - Dual Port, Synchronous | 1Mb (128K x 8) | Parallel | - | - | 9ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
Cypress Semiconductor Corp |
IC SRAM 36MBIT 400MHZ 165FBGA
|
pacchetto: 165-LBGA |
Azione5.088 |
|
SRAM | SRAM - Synchronous, QDR II+ | 36Mb (2M x 18) | Parallel | 400MHz | - | - | 1.7 V ~ 1.9 V | -40°C ~ 85°C (TA) | Surface Mount | 165-LBGA | 165-FBGA (13x15) |
||
Micron Technology Inc. |
IC RLDRAM 576MBIT 800MHZ 168FBGA
|
pacchetto: 168-TBGA |
Azione3.504 |
|
DRAM | DRAM | 576Mb (16M x 36) | Parallel | 800MHz | - | 10ns | 1.28 V ~ 1.42 V | 0°C ~ 95°C (TC) | Surface Mount | 168-TBGA | 168-BGA |
||
Micron Technology Inc. |
IC SDRAM 16GBIT 800MHZ BGA
|
pacchetto: 96-TFBGA |
Azione5.040 |
|
DRAM | SDRAM - DDR3L | 16Gb (1G x 16) | Parallel | 800MHz | - | 13.75ns | 1.283 V ~ 1.45 V | 0°C ~ 95°C (TC) | Surface Mount | 96-TFBGA | 96-FBGA (9.5x14) |
||
Micron Technology Inc. |
IC SDRAM 2GBIT 400MHZ 84FBGA
|
pacchetto: 84-TFBGA |
Azione5.552 |
|
DRAM | SDRAM - DDR2 | 2Gb (128M x 16) | Parallel | 400MHz | 15ns | 400ps | 1.7 V ~ 1.9 V | -40°C ~ 105°C (TC) | Surface Mount | 84-TFBGA | 84-FBGA (9x12.5) |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 2GBIT 667MHZ 96BGA
|
pacchetto: 96-TFBGA |
Azione4.896 |
|
DRAM | SDRAM - DDR3L | 2Gb (128M x 16) | Parallel | 667MHz | 15ns | 20ns | 1.283 V ~ 1.45 V | -40°C ~ 105°C (TC) | Surface Mount | 96-TFBGA | 96-TWBGA (9x13) |
||
Alliance Memory, Inc. |
IC SRAM 256KBIT 10NS 28SOJ
|
pacchetto: 28-BSOJ (0.300", 7.62mm Width) |
Azione3.360 |
|
SRAM | SRAM - Asynchronous | 256Kb (32K x 8) | Parallel | - | 10ns | 10ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 28-BSOJ (0.300", 7.62mm Width) | 28-SOJ |
||
ISSI, Integrated Silicon Solution Inc |
16MB QSPI WSON
|
pacchetto: 8-WDFN Exposed Pad |
Azione5.008 |
|
FLASH | FLASH - NOR | 16Mb (2M x 8) | SPI - Quad I/O, QPI, DTR | 133MHz | 800µs | - | 2.3 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |
||
Microchip Technology |
IC EEPROM 32KBIT 400KHZ 8MSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione4.816 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Alliance Memory, Inc. |
IC SDRAM 512MBIT 200MHZ 66TSOP
|
pacchetto: 66-TSSOP (0.400", 10.16mm Width) |
Azione5.424 |
|
DRAM | SDRAM - DDR | 512Mb (64M x 8) | Parallel | 200MHz | 15ns | 700ps | 2.3 V ~ 2.7 V | 0°C ~ 70°C (TA) | Surface Mount | 66-TSSOP (0.400", 10.16mm Width) | 66-TSOP II |
||
Micron Technology Inc. |
IC SDRAM 128MBIT 167MHZ 66TSOP
|
pacchetto: 66-TSSOP (0.400", 10.16mm Width) |
Azione4.544 |
|
DRAM | SDRAM - DDR | 128Mb (16M x 8) | Parallel | 167MHz | 15ns | 700ps | 2.3 V ~ 2.7 V | -40°C ~ 85°C (TA) | Surface Mount | 66-TSSOP (0.400", 10.16mm Width) | 66-TSOP |
||
Fujitsu Electronics America, Inc. |
IC FRAM 16KBIT 20MHZ 8SOP
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione7.376 |
|
FRAM | FRAM (Ferroelectric RAM) | 16Kb (2K x 8) | SPI | 20MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
||
Microchip Technology |
IC EEPROM 512KBIT 20MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione98.064 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | SPI | 20MHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Winbond Electronics |
IC DRAM 2G PARALLEL 800MHZ
|
pacchetto: 78-VFBGA |
Azione7.920 |
|
DRAM | SDRAM - DDR3 | 2Gb (128M x 16) | Parallel | 800MHz | - | 20ns | 1.283 V ~ 1.45 V | -40°C ~ 95°C (TC) | Surface Mount | 78-VFBGA | 78-VFBGA (8x10.5) |
||
Cypress Semiconductor Corp |
IC SRAM
|
pacchetto: - |
Azione6.944 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
IC FLASH 4G SPI UPDFN
|
pacchetto: - |
Azione3.792 |
|
FLASH | FLASH - NAND | 4Gb (4G x 1) | SPI | - | - | - | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | - | - | - |