Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Current - Supply | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|
IDT, Integrated Device Technology Inc |
IC WIRELESS PWR RECEIVER
|
pacchetto: - |
Azione6.864 |
|
- | - | - | - | - | - |
||
Texas Instruments |
IC PWR MNGMNT CELL/PCS 28WQFN
|
pacchetto: 28-WFQFN Exposed Pad |
Azione4.800 |
|
5µA | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 28-WFQFN Exposed Pad | 28-WQFN (5x5) |
||
Maxim Integrated |
IC DCDC CONV STPDN LDO 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) Exposed Pad |
Azione5.536 |
|
- | 3.7 V ~ 28 V | -40°C ~ 125°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) Exposed Pad | 20-TSSOP-EP |
||
Texas Instruments |
IC POWER MGMT 48WQFN
|
pacchetto: 48-WFQFN Exposed Pad |
Azione4.144 |
|
- | 2.5 V ~ 6 V | -40°C ~ 85°C | Surface Mount | 48-WFQFN Exposed Pad | 48-WQFN (6x6) |
||
NXP |
IC VOLT REG W/SW & IGNIT 17-SIL
|
pacchetto: 17-SIP Formed Leads |
Azione7.072 |
|
110µA | 9.5 V ~ 18 V | -40°C ~ 85°C | Through Hole | 17-SIP Formed Leads | 17-PDBS |
||
Texas Instruments |
IC PMU CDMA W/CHARGER 49USMDXT
|
pacchetto: 49-WFBGA, DSBGA |
Azione6.112 |
|
- | - | - | Surface Mount | 49-WFBGA, DSBGA | 49-DSBGA |
||
NXP |
IC SYSTEM BASIS CHIP CAN 28-SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione47.196 |
|
42mA | 5.5 V ~ 18 V | -40°C ~ 125°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microchip Technology |
IC FAILSAFE W/RELAY DRVR 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.152 |
|
15mA | 4.5 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SO |
||
Texas Instruments |
IC ELECTRONIC IGNITION 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione15.168 |
|
25mA | 4.75 V ~ 5.25 V | -40°C ~ 125°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Linear Technology |
IC USB POWER MANAGER 28-QFN
|
pacchetto: 28-WFQFN Exposed Pad |
Azione26.484 |
|
- | 4.35 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 28-WFQFN Exposed Pad | 28-QFN (4x5) |
||
IDT, Integrated Device Technology Inc |
IC PMIC PWR MGMT MULTI-CH
|
pacchetto: 100-WQFN Dual Rows, Exposed Pad |
Azione3.536 |
|
- | 4.5 V ~ 5.5 V | - | Surface Mount | 100-WQFN Dual Rows, Exposed Pad | 100-VFQFPN (8x8) |
||
Maxim Integrated |
IC DCDC CONV STPDN DL LDO 20TQFN
|
pacchetto: 20-WQFN Exposed Pad |
Azione5.664 |
|
- | 3.7 V ~ 28 V | -40°C ~ 125°C | Surface Mount | 20-WQFN Exposed Pad | 20-TQFN-EP (5x5) |
||
Intersil |
IC REG/CTRLR ACPI DUAL DDR 28QFN
|
pacchetto: 28-VQFN Exposed Pad |
Azione6.112 |
|
5.25mA | - | -40°C ~ 85°C | Surface Mount | 28-VQFN Exposed Pad | 28-QFN (6x6) |
||
Texas Instruments |
IC WIRELESS PWR RCVR 42-DSBGA
|
pacchetto: 42-XFBGA, DSBGA |
Azione7.552 |
|
- | 4 V ~ 11 V | -40°C ~ 125°C | Surface Mount | 42-XFBGA, DSBGA | 42-DSBGA |
||
Active-Semi International Inc. |
IC REG BUCK LDO 40TQFN
|
pacchetto: 40-WFQFN Exposed Pad |
Azione6.816 |
|
420µA | 2.7 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 40-WFQFN Exposed Pad | 40-TQFN (5x5) |
||
Rohm Semiconductor |
IC INVERTER CTLR DC-AC 24-SOP
|
pacchetto: 24-SOIC (0.213", 5.40mm Width) |
Azione17.256 |
|
30µA | 8.5 V ~ 19 V | -40°C ~ 85°C | Surface Mount | 24-SOIC (0.213", 5.40mm Width) | 24-SOP |
||
Diodes Incorporated |
HEATER CONTROLLER PDIP-8
|
pacchetto: - |
Azione6.160 |
|
- | - | - | - | - | - |
||
Diodes Incorporated |
HEATER CONTROLLER SO-8
|
pacchetto: - |
Azione4.352 |
|
- | - | - | - | - | - |
||
Diodes Incorporated |
HEATER CONTROLLER SO-8
|
pacchetto: - |
Azione6.992 |
|
- | - | - | - | - | - |
||
Diodes Incorporated |
IRON CONTROLLER PDIP-8
|
pacchetto: - |
Azione2.880 |
|
- | - | - | - | - | - |
||
Maxim Integrated |
IC OVP ADJ HIGH ACCURACY 10UTQFN
|
pacchetto: 10-UFQFN |
Azione123.456 |
|
150µA | 3.5 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 10-UFQFN | 10-UTQFN (2.1x1.6) |
||
Texas Instruments |
IC LOAD SHARE CONTROLLER 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione227.772 |
|
4mA | 2.7 V ~ 20 V | -40°C ~ 100°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
NXP |
SYSTEM BASIS CHIP DCDC 1.5A VCO
|
pacchetto: 48-LQFP Exposed Pad |
Azione4.320 |
|
- | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
||
NXP |
SYSTEM BASIS CHIP DCDC 0.8A VCO
|
pacchetto: 48-LQFP Exposed Pad |
Azione6.352 |
|
- | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
||
NXP |
PF1550
|
pacchetto: 40-VFQFN Exposed Pad |
Azione6.976 |
|
- | 3.8 V ~ 7 V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-QFN (5x5) |
||
IDT, Integrated Device Technology Inc |
IC WIRELESS RECEIVER
|
pacchetto: - |
Azione3.632 |
|
- | - | - | - | - | - |
||
Microchip Technology |
USB PORT POWER CONTROLLER
|
pacchetto: 28-VFQFN Exposed Pad |
Azione3.008 |
|
650µA | 4.5 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 28-VFQFN Exposed Pad | 28-VQFN (5x5) |
||
Diodes Incorporated |
HEATER CONTROLLER DIP-8
|
pacchetto: - |
Azione2.832 |
|
- | 3.5 V ~ 5.5 V | -20°C ~ 85°C (TA) | - | - | - |
||
Renesas Electronics America |
IC POWER MANAGEMENT
|
pacchetto: 28-VFQFN Exposed Pad |
Azione27.000 |
|
700µA | 2.5 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 28-VFQFN Exposed Pad | 28-QFN (4x5) |
||
ON Semiconductor |
IC DRIVER FET MULTICHIP 40-MLP
|
pacchetto: 40-WFQFN Exposed Pad |
Azione6.224 |
|
2mA | 6 V ~ 16 V | -55°C ~ 150°C | Surface Mount | 40-WFQFN Exposed Pad | 40-MLP (6x6) |