Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Current - Supply | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
IC POWER MGT 36-WLCSP
|
pacchetto: 36-UFBGA, WLCSP |
Azione2.224 |
|
- | - | -40°C ~ 85°C | Surface Mount | 36-UFBGA, WLCSP | 36-WLCSP |
||
ON Semiconductor |
IC PHASE CONTROLLER 2/3/4 48-QFN
|
pacchetto: 48-VFQFN Exposed Pad |
Azione8.832 |
|
25mA | 4.75 V ~ 5.25 V | 0°C ~ 70°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
Texas Instruments |
IC BIAS SUPPLY TFT-LCD TV 40VQFN
|
pacchetto: 40-VFQFN Exposed Pad |
Azione203.196 |
|
1.2mA | 8.5 V ~ 14.7 V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-VQFN (6x6) |
||
NXP |
IC VOLT REG W/BATT DETECT 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione4.784 |
|
95µA | 5.6 V ~ 25 V | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SO |
||
Texas Instruments |
IC PMU CDMA W/CHARGER 49USMDXT
|
pacchetto: 49-WFBGA, DSBGA |
Azione6.528 |
|
- | - | - | Surface Mount | 49-WFBGA, DSBGA | 49-DSBGA |
||
Texas Instruments |
IC ENERGY MGMT 5A 1V SD 28WQFN
|
pacchetto: 28-WFQFN Exposed Pad |
Azione7.584 |
|
9mA | 3 V ~ 18 V | -40°C ~ 85°C | Surface Mount | 28-WFQFN Exposed Pad | 28-WQFN (5x5) |
||
Texas Instruments |
IC DGTL PWM SYSTEM CTRLR 80-TQFP
|
pacchetto: 80-TQFP |
Azione4.416 |
|
- | 3 V ~ 3.6 V | -40°C ~ 110°C | Surface Mount | 80-TQFP | 80-TQFP (12x12) |
||
ams |
IC PMU 81CSP
|
pacchetto: 56-VFQFN Exposed Pad |
Azione5.056 |
|
220µA | 2.7 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN (7x7) |
||
STMicroelectronics |
IC DOOR ACTUATOR DVR POWERSSO-36
|
pacchetto: PowerSSO-36 Exposed Bottom Pad |
Azione445.320 |
|
7mA | 7 V ~ 28 V | -40°C ~ 150°C | Surface Mount | PowerSSO-36 Exposed Bottom Pad | PowerSSO-36 |
||
Intersil |
IC CTRLR INTEL PENT M 38-TSSOP
|
pacchetto: 38-TFSOP (0.173", 4.40mm Width) |
Azione7.360 |
|
1.4mA | 4.75 V ~ 5.25 V | -10°C ~ 85°C | Surface Mount | 38-TFSOP (0.173", 4.40mm Width) | 38-TSSOP |
||
Diodes Incorporated |
HEATER CONTROLLER SO-8
|
pacchetto: - |
Azione7.360 |
|
- | - | - | - | - | - |
||
Texas Instruments |
PMIC SOLUTIONS EMBEDDED CAMERA M
|
pacchetto: - |
Azione2.368 |
|
25µA | 3.7 V ~ 6 V | -40°C ~ 85°C | - | - | - |
||
Diodes Incorporated |
IRON CONTROLLER SO-8
|
pacchetto: - |
Azione6.448 |
|
- | - | - | - | - | - |
||
ON Semiconductor |
IC USB TYPE C VCONN OVP 4WLCSP
|
pacchetto: - |
Azione7.040 |
|
40µA | 28V | -40°C ~ 85°C | - | - | - |
||
STMicroelectronics |
IC DIGITAL CTLR 38TSSOP
|
pacchetto: 38-TFSOP (0.173", 4.40mm Width) |
Azione5.056 |
|
- | 3 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 38-TFSOP (0.173", 4.40mm Width) | 38-TSSOP |
||
Texas Instruments |
IC USB ADJ LDO 3.3V HP 14-HTSSOP
|
pacchetto: 14-TSSOP (0.173", 4.40mm Width) Exposed Pad |
Azione6.640 |
|
85µA | 2.7 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 14-TSSOP (0.173", 4.40mm Width) Exposed Pad | 14-HTSSOP |
||
Texas Instruments |
WIRELESS POWER MEDIUM POWER TRAN
|
pacchetto: 64-VFQFN Exposed Pad |
Azione7.500 |
|
52mA | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 64-VFQFN Exposed Pad | 64-VQFN (9x9) |
||
Lattice Semiconductor Corporation |
IC PLATFORM MANAGER 237FTBGA
|
pacchetto: 237-LBGA |
Azione6.192 |
|
- | 4.75 V ~ 13.2 V | -40°C ~ 100°C | Surface Mount | 237-LBGA | 237-FTBGA (17x17) |
||
Texas Instruments |
IC PWR MGMT 4 LDO TXRX 139NFBGA
|
pacchetto: 139-LFBGA |
Azione18.684 |
|
300µA | 2.7 V ~ 4.5 V | -40°C ~ 85°C | Surface Mount | 139-LFBGA | 139-NFBGA (10x10) |
||
Maxim Integrated |
IC XFRMR DRIVER RS485 8-UMAX
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione11.076 |
|
450µA | 3.3V, 5V | 0°C ~ 70°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-uMAX |
||
NXP |
SYSTEM BASIS CHIP DCDC 0.8A VCO
|
pacchetto: 48-LQFP Exposed Pad |
Azione7.360 |
|
- | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
||
NXP |
POWER MANAGEMENT IC I.MX7 PRE-
|
pacchetto: 48-VFQFN Exposed Pad |
Azione5.552 |
|
- | 2.8 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
Texas Instruments |
POWER MANAGEMENT UNIT
|
pacchetto: - |
Azione4.432 |
|
- | - | - | - | - | - |
||
STMicroelectronics |
CONDITIONING & INTERFACES
|
pacchetto: 24-VQFN Exposed Pad |
Azione6.448 |
|
- | - | - | Surface Mount | 24-VQFN Exposed Pad | 24-QFN-EP (4x4) |
||
NXP |
SYSTEM BASIS CHIP DCDC 2.2A VCO
|
pacchetto: 48-LQFP Exposed Pad |
Azione7.596 |
|
- | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
||
NXP |
POWER MANAGEMENT IC I.MX7 PRE-
|
pacchetto: 48-VFQFN Exposed Pad |
Azione6.684 |
|
- | 2.8 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
Linear Technology |
IC POWER MANAGEMENT
|
pacchetto: 8-WFDFN Exposed Pad |
Azione3.728 |
|
220µA | 2.5 V ~ 80 V | -40°C ~ 85°C | Surface Mount | 8-WFDFN Exposed Pad | 8-DFN (2x2) |
||
IDT, Integrated Device Technology Inc |
IC WIRELESS RECEIVER 36WLCSP
|
pacchetto: - |
Azione4.848 |
|
- | - | - | - | - | - |
||
Diodes Incorporated |
IRON CONTROLLER DIP-8
|
pacchetto: - |
Azione2.160 |
|
400µA | 4.5 V ~ 5.5 V | -10°C ~ 85°C (TA) | - | - | - |
||
NXP |
IC POWER MANAGEMENT I.MX8QM
|
pacchetto: 56-VFQFN Exposed Pad |
Azione4.512 |
|
- | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |